{产品管理产品规划}moldflow改善产品变形问题

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1、1. Project Summary-2 2. Plastic material information - 3 3. Analysis purpose & Process condition - 4 4. Part information, Runner and cooling system design -68 5. Analysis result-927 6. Conclusion & suggestion - 28,Mold Flow Report,2006-06-26,Mold Flow Report,case1,case2,Mold NO: Prepared by: Bill.Bi

2、n Cavity number:1*2 Analysis purpose : improve warpage。 Analysis Project: Cool +Fill +Pack + Warp Case1 is the 3D design. Case2 is revise mold design and modified the process condition.,2006-06-26,Material Property,Viscosity vs Shear rate,P-V-T,2006-06-26,Process setting,Analysis purpose: improve wa

3、rpage Analysis Project: Cooling + flow + Warpage Process setting,case1,Mold Temperature:60/65 Melt Temperature: 220 Fill Time: automatic Cooling time:60S V/P switch-over: 99% of filled volume pack,80%V/P 10S,case2,80%X0.3+0X1.5+6X60%+12X100%S,2006-06-26,Part infomatiom,Thickness distribution,2006-06

4、-26,Cooling system design,All case is base 2d mold design.,2006-06-26,Runner system design,Case1 is base 2d mold design ,,12mm,10mm,8mm,2.88mm,102.8mm,case1,2006-06-26,Runner system design,case2,Same case1,Same case1,Same case1,case2 is reviser runner system (move gate ),Move gate,2006-06-26,Fill Ti

5、me,The fill time result shows the position of the flow front at regular , as the cavity fills. Each color contour represent the parts of the mold Which were being filled at same time. .The fill time is about 5.6 second in the model . No racetrack effect occur. Air trap appear on the last filled area

6、. Do set enough vent over there.,case2,case1,2006-06-26,Fill Time,The fill time result shows the position of the flow front at regular , as the cavity fills. Each color contour represent the parts of the mold Which were being filled at same time. .The fill time is about 5.6 second in the model . No

7、racetrack effect occur. Air trap appear on the last filled area. Do set enough vent over there.,case2,case1,2006-06-26,Pressure at V/P switchover,The result shows the pressure distribution through the flow path inside the mold at the Switchover point from velocity to pressure control.,case1,case2,20

8、06-06-26,Air Trap,The air traps are show in pink node,case1,case2,2006-06-26,Air Trap,The air traps are show in pink node,case1,case2,2006-06-26,Weld line,Notice the positions of the weld lines, which may affect the qualing of the part appearance but which maybe affect the part structural functions.

9、 .,case1,case2,2006-06-26,波前温度,The melt temperature is 220, this themperature at flow front is allow.,case1,case2,2006-06-26,Pressure at injection location :XY Plot,The result shows the pressure and clamp force at various times during the filling and packing phases of the analysis.,case1,case2,2006-

10、06-26,Clamp force: XY Plot,The result shows the pressure and clamp force at various times during the filling and packing phases of the analysis.,case1,case2,2006-06-26,circuit coolant temperature,The cooling analysis screen output contains the change in coolant temperature from coolant-into coolant-

11、out If the increase is unacceptable (greater than 2-3 deg.c),case1,case2,2006-06-26,Time to freeze,The result shows the thickness of the frozen. A higher value represents a thicker frozen layer, while low value means a thinner polymer melt (flow )layer Cooing channel need to near sprue , for reduce

12、cycle time.,case2,case1,2006-06-26,Temperature mold,The temperature mold result shows the average temperature of the plastic mold interface at the top side, of the mold element during the cycle time . The result displays in the mold surface has a small range.,case2,case1,2006-06-26,Volumetric Shrink

13、age at Ejection,The Volumetric shrinkage at ejection result can be used to detect sink marks on the model. Volumetric shrinkage should be uniform across the whole part to reduce warpage. High shrinkage values could indicate sink marks or voids inside the part. Volumetric shrinkage can be controlled by the use of packing profiles.,case1,case2,2006-06-26,2006-06-26,2006-06-26,2006-06-26,2006-06-26,Cool and shrinkage is major cause to effect warpage.,2006-06-26,2006-06-26,2006-06-26,

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