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1、各种半导体LED湿法清洗机苏州晶洲装备科技施利君 DFPE Batchtype ConventionaltypeCassettetypeCassettelesstypeSinglebathtypeSinglewafertype ScrubberSEZ Wetbenchtype Wetbenchbathconfiguration SC1 DI HF DI SC2 DI DI DRY PreFurnaceClean SC1 StandardClean1SC2 StandardClean2HF HydrofluoricAcidDI DeIonizedWater LotFlow TypicalWetC
2、leanBath P HeatExchanger filter pump Processbath Measurementtank ParticlepatterndefectMetalcontaminationJunctionleakOrganiccontaminationgateoxideleakNativeoxidegateoxideleakMicroRoughnesssgateoxideleak ThecontaminationandItsinfluence 沾污及其影响 SC standardclean RCA Acompanyname DIW deionizedwaterSC 1 RC
3、A1 APM NH4OH H2O2 DIW SC 2 RCA2 HPM HCl H2O2 DIW CARO SPM Piranha H2SO4 H2O2 H3PO4 H3PO4 DIW BOE BufferoxideetchHF NH4F withsurfactant 表面活性剂 DHF DiluteHF DrySystem SpinDry IPAVaporDry MarangoniDry Keyword SC1 MS lightorganic particleremoveDHFRemovechemicaloxideornativeOXSC2RemovalofmetalsimpuritiesB
4、OE RemoveoxidewithPRHF HNO3Removepolyfilm SPM H2SO4 H2O2 PhotoresistandmetalsionsH3PO4Nitrideremove49 HFremovenitrideandthickoxide Chemicalapplication SC1 TypicalRatio NH4OH H2O2 DI 1 1 5 1 2 50Temp 40 80CMechanism Solutionoxidizesurfaceorganicsanddissolvessolublecomplexesformed PHishigh Lowstabilit
5、yofmetalimpuritiesNH4OH DissolvesSiO2andetchesSiH2O2 Oxidizer formslayerofchemicaloxide Depositionofsomespeciesofmetalsonoxide e g Fe Ca RelationshipofZetaPotentialsandpHValue SC2 Typicalratio Hcl H2O2 DI 1 1 5 1 1 50Temp Typical80cPurpose RemovemetallicimpuritiesfromwafersMechanism 机制 LowPHimproves
6、solubilityofmetallicimpurities 低的PH值可以提高金属杂质的溶解度 Metallicchloridesformed MetalslikeFe Cacanberemoved 形成金属氯化物 H2O2formschemicaloxide AffectOxidequality HF Ratio 100 1 10 1Temp Typical23 25CPurpose SilicondioxideremovalNitrideremoval Rare 38 HFSiO2 6HF SiF6 2H2O H2Hydrophobic 疏水 surfaceproduced Partic
7、lesensitive SPM Caro MainReactiveCompound H2S2O5Caro sacidTypicalTemp 130CChemicalRatio H2SO4 H2O2 4 1 6 1AfterdryashingandIMPpostclean Photoresistremoveandlightorganicremoveforpre clean Si3N4 H2O3SiO2 4NH3H3PO4为催化剂 H2O为主要反应物TypicalChemicalused HotH3PO4acidTemperature 150Cto165CMajoruse Strippingofn
8、itridemaskEtchcharacteristic Isotropic 各向同性刻蚀 H3PO4 TypesofDryingMethods SpinDry IPAVaporDry HotIPA MarangoniDry RoomTempIPA HotN2 IPAfumeDryPerformanceIndices DryingSpeed Particlelevel Watermark Metalimpurity Drytechnology MonitorTechnique ParticleCountLaserSurfaceScannerParticleinbathLiquidParticl
9、eCounterMetalContaminationTXRF ICPMS 全反射X荧光 Etchrate uniformityEllipsometer 偏振光椭圆率测试仪 OrganiccontaminationXPS X光电子能谱仪 TOF SIMS MicroroughnessAFM 原子力显微镜 Forwetbench wenormallymonitorParticle Etchrate DHF H3PO4 andTXRFitems Particle1wafer once dayspec 30pcs 0 16 m 2 Etchrate1wafer once dayTXRF TotalRe
10、flectionX rayFluorescence 1wafer once weekusethesamewaferasparticletestwafer afterparticletest Monitorfrequency Monitorwafertype 1 Particle H3PO4bathuseoxidefilmwafer othersusebarewafer IfParticlecountmorethan100 needreclaim 2 Etchrate a DHF BOEuseoxidefilmwafer 4500A whenfilmthicknesslowerthan1000A
11、 needreclaimb H3PO4useNitridefilmwafer 1700A onlycanuseonce thenneedreclaim EtchRateData ChuckWash Rinse Forchuck robotcleanchemicalresidueOverFlow NormallyafterHF BHF BOE hot QuickDumpRinse cleanchemicalresidueonwaferFinalRinse AddedResistsensor 水阻值计 makesureresidueremovecompletely DIWbath tank MSD
12、S MaterialsafetydatasheetThroughput WPH waferperhour Uniformity 均匀性Etchingrate 蚀刻率 deltathickness sec Chemicallifetime 化学液活期 General名词解释 Chemicallifecount batch 化学液批数活期Replenish spiking time 补充时间Circulationrate 循环速率Measuringtank 测量槽Megasoniccleaning 超声波清洗Inlineheater 在线加热器 Heaterexchanger 冷热交换器Pump
13、泵 提供循环动力Filter 过滤器 吸附化学溶液中的杂质Loader unloader 入货 出货装置BG backgrinding晶圆背面研磨PR photoresist光阻 Wetbenchconfiguration processrecipesampleProcessPPID F040A60H30Detailrecipe SPM 0 HQDR 0 0 5HF 40 OF 480 APM 600 HCQDR 300 HPM 300 QDR 300 FR 300 M D 1 ADWGC01Pregateclean2 ADWRA01RCAclean3 AEWPS01PRwetstrip4 A
14、SWCP01CoblatPRstrip selectiveetch5 ADWNS01Nitridestrip6 ADWOE01Oxideetch withPR 7 ADWOE02Oxideetch8 ASWPM01Premetaldip TiNstrip postsilicidePRstrip9 ARWFR01Frontendrecycle nonmetal 10 ARWBR01Backendrecycle metal 11 AGWBG01PostBackgrindingcleaning Wetbenchequipmentlist Hardwarepicture Theendthankyou
