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1、 電路板 PCB 字彙整理 教育訓練教材 PCB字典 流程圖PCBMfg FLOWCHART UPDATED 1999 09 01 多層板內層流程 INNERLAYERPRODUCT P1 136 ProcessModule說明 A 下料 CutLamination a 1裁板 SheetsCutting a 2原物料發料 Panel ShearmaterialtoSize B 鑽孔 Drilling b 1內鑽 InnerLayerDrilling b 2一次孔 OuterLayerDrilling b 3二次孔 2ndDrilling b 4雷射鑽孔 LaserDrilling Laser
2、Ablation b 5盲 埋 孔鑽孔 Blind BuriedHoleDrilling C 乾膜製程 PhotoProcess D F c 1前處理 Pretreatment c 2壓膜 DryFilmLamination c 3曝光 Exposure c 4顯影 Developing c 5蝕銅 Etching c 6去膜 Stripping c 7初檢 Touch up c 8化學前處理 化學研磨 ChemicalMilling c 9選擇性浸金壓膜 SelectiveGoldDryFilmLamination c 10顯影 Developing c 11去膜 Stripping D 壓
3、合Laminationd 1黑化 BlackOxideTreatment d 2微蝕 Microetching Developing Etching Stripping DES d 3鉚釘組合 eyelet d 4疊板 Layup d 5壓合 Lamination d 6後處理 PostTreatment d 7黑氧化 BlackOxideRemoval d 8銑靶 spotface d 9去溢膠 resinflushremoval E 減銅 CopperReduction e 1薄化銅 CopperReduction F 電鍍 HorizontalElectrolyticPlating f
4、1水平電鍍 HorizontalElectro Plating PanelPlating f 2錫鉛電鍍 Tin LeadPlating PatternPlating f 3低於1mil Lessthan1milThickness f 4高於1mil Morethan1milThickness f 5砂帶研磨 BeltSanding f 6剝錫鉛 Tin LeadStripping f 7微切片 Microsection G 塞孔 PlugHole g 1印刷 InkPrint g 2預烤 Precure g 3表面刷磨 Scrub g 4後烘烤 Postcure H 防焊 綠漆 Solder
5、Mask h 1C面印刷 PrintingTopSide h 2S面印刷 PrintingBottomSide h 3靜電噴塗 SprayCoating h 4前處理 Pretreatment h 5預烤 Precure h 6曝光 Exposure h 7顯影 Develop h 8後烘烤 Postcure h 9UV烘烤 UVCure h 10文字印刷 PrintingofLegend h 11噴砂 Pumice WetBlasting h 12印可剝離防焊 PeelableSolderMask I 鍍金Goldplatingi 1金手指鍍鎳金 GoldFinger i 2電鍍軟金 Sof
6、tNi AuPlating i 3浸鎳金 ImmersionNi Au ElectrolessNi Au J 噴錫 HotAirSolderLeveling j 1水平噴錫 HorizontalHotAirSolderLeveling j 2垂直噴錫 VerticalHotAirSolderLeveling j 3超級焊錫 SuperSolder j 4 印焊錫突點 SolderBump K 成型 Profile Form k 1撈型 N CRouting Milling k 2模具沖 Punch k 3板面清洗烘烤 Cleaning Backing k 4V型槽 V Cut V Scorin
7、g k 5金手指斜邊 BevelingofG F L 短斷路測試 ElectricalTesting Continuity InsulationTesting l 1AOI光學檢查 AOIInspection l 2VRS目檢 Verified Repaired l 3汎用型治具測試 UniversalTester l 4專用治具測試 DedicatedTester l 5飛針測試 FlyingProbe M 終檢 FinalVisualInspection m 1壓板翹 WarpageRemove m 2X OUT印刷 X OutMarking m 3包裝及出貨 Packing shippi
8、ng m 4目檢 VisualInspection m 5清洗及烘烤 FinalClean Baking m 6護銅劑 ENTEKCu 106A OSP m 7離子殘餘量測試 IonicContaminationTest CleanlinessTest m 8冷熱衝擊試驗 ThermalcyclingTesting m 9焊錫性試驗 SolderabilityTesting N 雷射鑽孔 LaserAblation N 1雷射鑽Tooling孔 LaserablationToolingHole N 2雷射曝光對位孔 LaserAblationRegistrationHole N 3雷射Mask
9、製作 LaserMask N 4雷射鑽孔 LaserAblation N 5AOI檢查及VRS AOIInspection Verified Repaired N 6BlaserAOI afterDesmearandMicroetching N 7除膠渣 Desmear N 8微蝕 Microetching A W artwork 底片Ablation燒溶 laser 切除abrade粗化abrasionresistance耐磨性absorption吸收ACC accept 允收acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗acceleratio
10、n速化反應accelerator加速劑acceptable允收activator活化液activeworkinprocess實際在製品adhesion附著力adhesivemethod黏著法airinclusion氣泡airknife風刀amorphouschange不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annularring環狀墊圈 孔環anodeslime sludge 陽極泥anodizing陽極處理AOI automaticopticalinspection 自動光學檢測applicabledocuments引用之文件AQLsa
11、mpling允收水準抽樣aqueousphotoresist液態光阻aspectratio縱橫比 厚寬比 Asreceived到貨時 backlighting背光back up墊板bankedworkinprocess預留在製品basematerial基材baselineperformance基準績效batch批betabackscattering貝他射線照射法beveling切斜邊 斜邊biaxialdeformation二方向之變形black oxide黑化blankcontroller空白對照組 blankpanel空板blanking挖空blip彈開blister氣泡 起泡bliste
12、ring氣泡blowhole吹孔board thicknesserror板厚錯誤bondingplies黏結層bow bowing板彎breakout從平環內破出bridging搭橋 橋接BTO BuildToOrder 接單生產burning燒焦burr毛邊 毛頭 camcorder一體型攝錄放機carbide碳化物carlsonpin定位梢carrier載運劑catalyzing催化catholicsputtering陰極濺射法caulplate隔板 鋼板calibrationsystemrequirements校驗系統之各種要求centerbeammethod中心光束法centralpr
13、ojection集中式投射線certification認證chamfer倒角 金手指 chamfering切斜邊 倒角characteristicimpedance特性阻抗chargetransferoverpotential電量傳遞過電壓chase網框checkboard棋盤chelator蟹和劑chemicalbond化學鍵chemicalvapordeposition化學蒸著鍍circumferentialvoid圓周性之孔破cladmetal包夾金屬cleanroom無塵室clearance間隙coat鍍外表coatingerror防焊覆蓋錯誤 coefficientofthermal
14、expansion CTE 熱澎脹系數coldsolderjoint冷焊點cold weld金屬粉末冷焊color顏色colorerror顏色錯誤compensation補償competitiveperformance競爭力績效complexsalt錯化物complexor錯化物componenthole零件孔componentside零件面concentric同心conformance密貼性consumerproducts消費性產品contactresistance接觸電阻continuousperformance連續發揮效能contractservice協力廠controlledsplit
15、均裂式conventionalflow亂流方式conventionaltensiletest傳統張力測試法conversioncoating轉化層convex突出coordinatelist資料清單coppercladedlaminates CCL 銅箔基板copperexposure線路露銅coppermirror鏡銅copperpad銅箔圓配copperresidue coppersplash 銅渣corrosionratenumbering腐蝕速率計數系統corrosionresistance抗蝕性coulombslaw庫倫定律countersink喇叭孔coupon試樣couponlo
16、cation試樣點coveringpower遮蓋力CPU中央處理器crack破裂 裂痕crazing裂痕 白斑crosslinking交聯聚合 crosstalk呼應作用crosslinking交聯crystalcollection結晶收集curing聚合體currentefficiency電流效率cut outs挖空cutting裁板cyanide氰化物cyclesoflearning學習循環cycle timereduction交期縮短datecode週期deburring去毛頭dedicated專用型degradation退變delamination分層dent pinhole凹陷 針孔departmentofdefense國防部designation字碼簡示法de smear除膠渣developing顯影dewetting縮錫dewettingtime縮錫時間dimensionerror外形尺寸錯誤dielectricconstant介質常數difficulty困難度difunctional雙功能dimension尺寸dimensionstability尺寸安定性dimensi
