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1、.中英制基本单位换算1 kg=2.205 lb(磅)1磅=0.454 kg1英尺=12英寸1 OZ(盎司)=28.3527g1g=0.03527OZ1英寸inch=1000密尔mil1 ft(英尺)=0.3048m1m=3.281ft1mil=1000u”(uin mil)1码=0.914m1m=1.094码1OZ=28.35克/平方英尺=35微米1 in(英寸)=25.4mm1mm=0.03937in1in=1000mil=25.4mm,1mil=25.4um1 m2=10.76 ft21 ft2=0.0929 m21ASD=1安培/平方分米=10.76安培/平方英尺1磅力=4.4484牛顿
2、1N=0.2248磅力1加仑美制=3.785升1psi=0.06895bar1bar=14.5psi=1.013kg/cm2 1bar=100000Pa1马力=0.746千瓦1 品脱=568 ml1oC=1.8 x oC+32 oF1 oF=( oF-32)/1.8 oC1 英尺=30.5 cm基本英文词汇流程Board cut开料Carbon printing碳油印刷Inner dry film内层干膜Peelable blue mask蓝胶Inner etching内层蚀刻ENIG(Electroless nickel immersion gold)沉镍金Inner dry film st
3、ripping内层干膜退膜 HAL(hot air leveling)喷锡AOI （Automatic Optical Inspection）自动光学检测OSP（Organic solderability preservative）有机保焊Pressing压板Punching啤板Drilling钻孔Profiling外形加工Desmear除胶渣，去钻污 E-Test电性测试PTH镀通孔，沉铜FQC(final quality control)最终品质控制Panel plating整板电镀FQA(Final quality audit)最终品质保证Outer dry film外层干膜Packin
4、g包装Etching蚀刻IPQA(In-process quality audit)流程QATin stripping退锡IPQC(In-process quality control)流程QCEQC（QC after etching）蚀检QCIQC(Incoming quality control)来料检查Solder mask感阻MRB(material review board)材料评审委员会Component mark字符QA(Quality assurance)品质保证Physical Laboratory物理实验室QC(Quality control)品质控制Chemistry L
5、aboratory化学实验室Document control center文件控制中心2nd Drilling 二钻Routing锣板，铣板Brown oxidation棕化Waste water treatment污水处理V-cutV坑WIP（work in process）半成品Store/stock仓库F.G(Finished goods)成品概述Printed Circuit Board印制电路板Flexible Printed Circuit, FPC软板Double-Side Printed Board双面板IPC（The Institute for Interconnecting
6、 and Packing Electronic Circuits）电子电路互连与封装协会CPAR（Corrective & Preventive Action Request）要求纠正预防措施Flammability Rate燃性等级Characteristic impedance特性阻抗BUM（Build-up multilayer）积层多层板Date Code周期代码CCL（Copper-clad laminate）覆铜板Ionic contamination离子性污染Acceptance Quality Level (AQL)允收水平HDI（High density interconne
7、cting）高密度互连板Base Material基材Radius半径Capacity生产能力Diameter直径Capability工艺能力PPM(Parts Per Million)百万分之几CAM（computer-aided manufacturing)计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design)计算机辅助设计Statistical Process Control统计过程控制Specification规格，规范Via导通孔Dimension尺寸Buried /blind via埋/盲孔
8、Tolerance公差Tooling hole定位孔Oven焗炉Output/throughput产量湿流程PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning酸性除油PP(Panel Plating)板电Acid dip酸洗Pattern plating图电Pre-dip预浸Line width线宽Alkaline cleaning碱性除油Spacing线隙Flux松香Deburring去毛刺（沉铜前磨板） Hot air leveling喷锡Carbon treatment碳处理Skip plating跳镀，漏镀Track/conductor导线Un
9、dercut侧蚀Aspect ratio深径比Water rinsing水洗Etch Factor蚀刻因子Transportation行车Back Light Test背光测试Rack挂架Pink ring粉红圈Maintenance保养干流程Hole location孔位Annular ring孔环Image Transfer图象转移Component Side(C/S)元件面Artwork底片Solder Side(S/S)焊接面Mylar胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout破孔Fidu
10、cial mark基点，对光点 Scrubbing磨板Expose曝光Developing显影内层制作Core material内层芯板Thermal pad散热PADPre-pregPP片Resin content树脂含量Kraft Paper牛皮纸Brown oxidation棕化Lay up排版Black Oxidation黑化Registration对位Base material板材Delamination分层其它Wicking灯芯效应Hole size孔径(尺寸)Yield良品率Touch Up修理Warp and Twist板曲度Solvent Test溶剂测试Peel off剥离
11、Company Logo公司标识Tape Test胶纸试验UL MarkUL 标记Cosmetic外观Function功能Tin/Lead Ratio 锡/铅比例Reliability Tests可靠性试验Hole Wall Roughness孔壁粗糙度Base Copper Thickness底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical in
12、spection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面
13、报告17.X-out=Cross-out 打X报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO U
14、L标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final qualit
