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1、IPC标准、文件一览表标准、文件一览表 Updated May 24, 2000 IPC DOC # (IPC文件 号) TITLE 名称 PUBLICATION/ REVISION DATES 出版/修订日期 Roadmap (指南指南) National Technology Roadmap for Electronic Interconnections (美国国家电子互联技术指南) 6/95 (orig. pub.) SMC- TR- 001 SMT An Introduction to Tape Automated Bonding & Fine Pitch Technology(TAB
2、和细间距SMT介绍) 1/89 (orig. pub.) J- STD- 001 代替代替 IPC- S- 815 Requirements for Soldered Electrical and Electronic Assemblies (电气、电子组件焊接技术要求) 4/92 (orig. pub.) Revision: A 1/95 Amendment 1: 3/96 Revision B: 10/96 Revision C: 3/00 IPC- HDBK- 001 Handbook and Guide to the Requirements for Soldered Electric
3、al and Electronic Assemblies to Supplement J- STD- 001B (J- STD- 001B学习辅导书) 3/98 (orig. pub.) J- STD- 002 代替代替 IPC- S- 805 Solderability Tests for Component Leads,Terminations, Lugs, Terminals and Wires (元件引线,焊端,接线端和导 线的可焊性 测试) 4/92 (orig. pub.) A 10/98 J- STD- 003 代替代替 IPC- S- 804 Solderability Tes
4、ts for Printed Boards(印制板可焊性测 试) 4/92 (orig. pub.) Revision A: In process J- STD- 004 代替代替IPC- SF- 818 Requirements for Soldering Fluxes(助焊剂技术要求) 1/95 (orig. pub.) Amendment 1 - 4/96 Revision A: In process J- STD- 005 代替代替 IPC- SF- 819 Requirements for Soldering Pastes(焊膏技术要求) 1/95 (orig. pub.) Amen
5、dment 1 - 1/95 J- STD- 006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non- Fluxed Solid Solders for Electronic Soldering Applications 1/95 (orig. pub.) Amendment 1 - 6/96 Revision A: In process Page 1 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.ht
6、ml PDF 文件使用 “pdfFactory Pro“ 试用版本创建 (电子级固态焊料技术要求) J- STD- 012 Implementation of Flip Chip and Chip Scale Technology (FC和CSP器件的安装) 1/96 (orig. pub.) J- STD- 013 Implementation of Ball Grid Array and Other High Density Technology(BGA和HDI器件的安装) 7/96 (orig. pub.) IPC- DRM- 18 Component Identification De
7、sk Reference Manual (元器件封装辨认手册) 9/95 (orig. pub.) Revision A: 4/96 Revision B: 2/97 Revision C: 7/98 J- STD- 020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices(塑封表面器件对潮湿和再流焊 的敏感度要求) October 1996 (orig. pub.) Revision A: 3/99 IPC- DRM- 40 Through- Hole Solder Joint Evalua
8、tion Desk Reference Manual (通孔引线焊点评估参考手册) IPC- DRM- SMT Surface Mount Solder Joint Evaluation Desk Reference Manual (表面组装焊点评估参考手册) 8/98 IPC- T- 50 Terms and Definitions Interconnecting and Packaging Electronic Circuits(电子电路互连及封装术语和定义) 8/75 (orig. pub.) A - 8/76 B - 6/80 C - 3/85 D - 11/88 E - 7/92 F
9、 - 6/96 IPC- SC- 60 Post Solder Solvent Cleaning Handbook (焊后溶剂清洗 手册) 4/87 (orig. pub.) Revision A: In process IPC- SA- 61 Post- Solder Semi- Aqueous Cleaning Handbook (焊后半水清洗手册) 7/95 (orig. pub.) IPC- AC- 62 Post Solder Aqueous Cleaning Handbook (焊后水清洗手 册) 12/86 (orig. pub.) IPC- CH- 65 Guidelines
10、for Cleaning of Printed Boards and Assemblies (印制板及其组件清洗导则) 12/90 (orig. pub.) Revision A: In process IPC- CS- 70 Guidelines for Chemical Handling Safety in Printed Board Manufacturing(印制板制造化学处理安全准则) 8/88 (orig. pub.) IPC- CM- 78 Page 2 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准
11、（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 被被 IPC- SM- 780替替 代代 Guidelines for Surface Mounting and Interconnecting Chip Carriers 11/83 (orig. pub.) C - 3/88 IPC- MP- 83 IPC Policy on Metrication(IPC公制化导则) 8/85 (orig. pub.) IPC- PC- 90 General Requirements for Implementation of Statistical
12、Process Control(实施SPC的总技术规范) 10/90 (orig. pub.) IPC- QS- 95 General Requirements for Implementation of ISO 9000 Quality Systems(实施 ISO 9000质量体系的总技术规 范) 4/93 (orig. pub.) IPC- L- 108 被被 IPC- 4101替代替代 Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards 3/76 (orig. pub.) A 10
13、/80 B 6/90 IPC- L- 109 被被 IPC- 4101 替代替代 Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards 3/76 (orig. pub.) A 10/80 B 7/92 IPC- L- 110 (已作废已作废) Preimpregnated, B- Stage Epoxy- Glass Cloth for Multilayer Printed Cicuit Boards A IPC- CC- 110 被被 IPC- 4121替代替代 Guideline
14、s for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 1/94 (orig. pub.) Revision A: 12/97 IPC- L- 112 被被 IPC- 4101 替代替代 Specification for Composite Metal Clad Base materials for Printed Boards 7/81 (orig. pub.) A 6/92 IPC- L- 115 被被 IPC- 4101 替代替代 Specification for Rigi
15、d Metal Clad Base Materials for Printed Boards 3/77 (orig. pub.) A 10/80 B 4/90 IPC- L- 120 (己作废己作废) Inspection Procedure for Chemical Processing Suitability of Copper- Clad Epoxy- Glass Laminates IPC- L- 125 Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Intercon
16、nections (高速/高频塑性基板特性规范) 8/83 (orig. pub.) A 7/92 IPC- L- 130 (已作废已作废) 被被 IPC- L- 108 替代替代 Specificaitons for Thin Laminates, Metal Clad, Primarily for General- Purpose Multilayer Printed Boards 1/77 (orig. pub.) Page 3 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 IPC- EG- 140 Specification for Finished Fabric Woven from “E“ Glass for Printed Boards(“E“纤维织物印制板特性规范) 3/88 (orig. pub.) A
