Technology for you 1 Technology for youOverview Presentation Hipims+ by HauzerØWhy High Power sputter technologyØHipims vs. Hipims+ØCoatings: TiAlN, Cr2NØMachine integration in Flexicoat®2 Technology for youPlasma technology with high % of the material to be deposited is ionized. Gaining control over stress - > Control microstructure/textureØTo create defect free coatings with good adhesion.ØTo make coatings for tool and tribo applications which outperform arc deposited coatingsØTo reduce thermal load of substrateØTo increase deposition rate of sputtering processWhy High power pulse sputtering?3 Technology for youØCapacitor dischargeØPeak pulse powers from kW to MWØLow frequency (duty cycle)ØPulse energy and voltage can be definedØPulse shape is determined by system configurationØCablingØPressureØSputtering atmosphereØMagnetron designConcept behind HIPIMS Technology4 Technology for youHIPIMS Plasma composition in ArN2Sum of Ar++Ar+++Ti++Ti+++N++N++=100%Ratio of N+ to N2+ is significantly higher in a HIPIMS discharge than in (pulsed) DC discharge.More reactive N species.5 Technology for youHIPIMS TiAlN ExperimentExperiment overviewSample: polished M2 HSSTarget: 50/50 at% AlTiDep. Temp.: 450-520oCFilm thickness: 2-3µmFull load in chamber, Three fold rotationSample #EtchingDeposition source configurationBias voltage1 SpuHIPIMS Ti2 DC + 1HIPIMS-75V2 SpuHIPIMS Ti2 DC + 1HIPIMS-95V3 SpuHIPIMS AlTi1 DC + 2 HIPIMS-75V1 ArcArc Ti2 x 4 CARC-40V2 ArcArc Ti2 x 4 CARC-70V6 Technology for you2D1H95HIPIMS -95V bias2D1H75HIPIMS -75V biasA70Arc -70V biasResults - RoughnessAFM 30x30µmSignificant improvement in surface roughness 7 Technology for youResults - RoughnessRoughness data8 Technology for youIon energy 2D1H75VHIPIMS -75V2D1H95HIPIMS -95VResults - MorphologyAFM 2x2µmIncrease in ion energy (higher bias) with constant ion flux leads to densification of coatingColumns coalesce to reduce number of boundariesResputtering of film evident at growing surface9 Technology for youResults – Hardness and E modulusHardness increases with increasing bias or addition of HIPIMS Cathodes.No definite trend for E modulus – possible differences due to changes in Microstructure.10 Technology for youResults – Scratch testAlTi etchedTi etchedCritical loads for HIPIMS etched samples close to those for arc etched Samples.No apparent difference In adhesion with respect to etching material.11 Technology for youConclusions HIPIMS TiAlNØIt is possible to create AlTiN coatings by HIPIMS deposition with material properties similar to those deposited by cathodic arcØsimilar hardness and E modulus.ØHIPIMS deposited coatings show some promising benefits as compared to arc deposited coatingsØlower roughnessØHIPIMS etching produces comparable adhesion values as compared to metal ion etching from an arc source – for both Ti and AlTi targets.ØHIPIMS technology is industrially feasible.12 Technology for youØModulated Pulse Power - MPP™ ØHigh power pulse magnetron sputtering techniqueØHeart of technology is Multi-step DC pulseØVoltage rise time control is key to enabling a long, stable, and high power pulse dischargeØPulses widths of > 200 µsec up to 1.5 msecØHIPIMS+ by Hauzer provides:ØControl of the gas to metal ion ratioØIncreased deposition rate (higher than HIPIMS)ØImproved target utilization ØSmooth, very good adhering hard coatings for tool and tribo applications.Hipims+ Technology Integrated MPP™ Technology 13 Technology for youHIPIMS vs. HIPIMS+14 Technology for youIntegrated MPP™ Technology - Modulated Pulse PowerØMulti-step voltage pulse§First step – ignition of low power discharge§Second step – low power discharge§Third step – transient stage from low power discharge to high power discharge§Fourth step – high power dischargeHIPIMS+ TechnologyVVLPVHP12340t0t1t2t3t4(1) VLP/(t1-t0) (3) (VHP-VLP)/(t3-t2)timet515 Technology for youHipims+ Pulse 16 Technology for youHipims+ Pulsing possibilities Multilayer structure of CrN film, sputtered with different voltage pulse shapes (1) and (2).Time T1 (5s, 10s, 15s) Rep. rate 160 HzTime T2 (5s, 10s, 15s) Rep. rate 50 HzVSiTime1500 µs1500 µs700 µs700 µs150 ms600540112217 Technology for you•Provide an additional constant voltage power supply, which can supply the required peak current at the required constant voltage. (Arc handling)•Simple Solution: use capacitor as additional CV-power supply.•Hauzer Patent: electronic switching for a fast interruption of the arc current, capable to handle the current of the capacitor discharge circuit.With capacitor80 AWithout capacitorHipims+ Bias issues18 Technology for youHipims+Hipims+Flexicoat 1000Table dia = 650mmCoating zone height = 650mmFull loadCoating temperature = 520°CTarget composition 50/50 at%Ti+ etching – CARC cathodesAr+ etching – plasma sourceHIPIMS+ TiAlN19 Technology for youTi+ ion etching (arc) + DC sputterTi+ ion etching (arc) + ArcTi+ ion etching (arc) + HIPIMS+Ar+ etching + HIPIMS+HIPIMS+ TiAlN experiment overview20 Technology for youHIPIMS+ Scratch summaryArc etch + UBMArc etch + HIPIMS+Arc etch + ArcAr etch + HIPIMS+80N100N100N100NHVPL (20mN) 3415S = 4.08 µm Ra = 0.050 µmHVPL (20mN) 3311S = 3.52 µm Ra = 0.143 µmHVPL (20mN) 3150S = 2.75 µm Ra = 0.143 µmHVPL (20mN) 2874S = 4.00 µm Ra = 0.101 µm21 Technology for youTiAlN Deposition rate normalized to one bank (4xCARC) of arc sourcesAverage power for UBM and Hipims+ = 10kW22 Technology for youTiAlN HIPIMS+ conclusionsØDense coatings with dense microstructure similar to arc coatings can be produced with HIPIMS+ technology.ØAdhesion is comparable to arc coatings (Argon etching and HIPIMS+ for coating).ØRa value 2 to 3 times better than Arc (smooth coating)ØComparable deposition rate to arc (14 kW).ØCoating has been found to outperform OEM benchmark for stainless milling by 30%.23 Technology for youHIPIMS+ Cr2NØHarder and more wear resistant than CrNØHas better oil wettability than CrN – lower frictionØToolØMoulding diesØForming toolsØLow temperature coatings < 250°CØTemperature sensitive steelsØPlasticsØAim of Hipims+ coatingsØLower temperature deposition – less thermal loadingØMore control over stress and microstructureØNo post treatment needed as compared to arc coatings24 Technology for youHIPIMS+ Cr2N Microstructure25 Technology for youHardness vs Peak Power Density26 Technology for youCr2N Comparison of Hipims+ and closed field UBM sputtering I bias-ave (A)Deposition rate (µm/hr)HIPIMS+ (208 W/cm2)3,70,87DC (closed field configuration)120,67Thermal loading with Hipims+ technology is lower than for DC can have higher deposition rate with Hipims+Target utilization is poor for high UBM coil currentsFull face erosion with HIPIMS+ depositionTsubstrate =250°C27 Technology for youConclusions Cr2N HIPIMS+•Relatively low loss of deposition rate as peak power density increases.•Low temperature coating can be deposited.•Eliminate post treatment after coating.•Suspect that increase in metal ion/neutral ratio is responsible for refinement of microstructure at constant bias voltage•It is possible to tailor film stress.28 Technology for youIndustrial requirements29 Technology for youConclusionsØHIPIMS+ technology is available and has been integrated into Hauzer Flexicoat 1000 and Flexicoat 850.ØHauzer is currently developing HIPIMS+ technology as an industrial solution for producing superior hard coatings.ØAs a result of the increased ionization in the HIPIMS+ process, the process window is wide for deposition of hard coatings, such as TiAlN and CrN. Even at low deposition temperatures, industrially viable coatings can be produced.ØHIPIMS+ technology can be used for commercial applications, such as Cr2N. For such an application, it has been found that that the coating time for such a coating can be reduced by 33% due to reduced thermal loading.ØHIPIMS+ deposited TiAlN has outperformed a major OEM benchmark for stainless steel milling.ØHIPIMS+ technology is commercialy available for the Flexicoat 850, 1000 and 1200 machines.30 Technology for youHauzer Techno Coating (HQ Venlo NL)Thank you for your attention31 若有不当之处，请指正，谢谢！32 。