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1、1Presentation TitleC-System Introduction will coverRole & Responsibility (R&R)ProcessCx Stage:C0: Proposal phase 構想階段C1: Planning phase 規劃階段C2: R&D Design phase 設計階段C3: Lab Pilot Run phase 樣品試作階段C4: Eng Pilot Run phase 工程試作階段C5: PD Pilot Run phase 試產階段C6: Mass Production phase 量產階段2Presentation Titl
2、eRole & ResponsibilityFunctionResponsibilityPM產品經理- Product Manager (或計畫專案經理- Project Manager)為所負責計畫或產品線成敗之總負責人, 將依產品線之性質指定專人負責某類產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的了解. 並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場競爭策略,並在適當的時機推出適當之技術或產品.TMTM is responsible to coordinate technical issues conflict among HW, SW, ID and M
3、E and decision-making. TM has to handle all project technical issues. PCC為規劃推廣、連絡及控制專案進行的負責人, 掌握專案進行之情況以協助處理異常狀況, 使新產品能順暢切入工廠且如期推出, 以提高產品競爭力.協助 R&D RELEASE 開發階段 BOM CHANGE NOTICE.R&DR&D 包括電子部門及工業設計部門,若只寫 HW (Hardware Design) 則指電子部門,若只寫 ID (INDUSTRIAL DESIGN) 則指工業設計部門; 包括ME, Thermal, Packing design.
4、若只寫 SW (Software design) 則指軟體設計部門有負責 BIOS, Driver 及 Pre-load 不同工作性質之軟體開發功能. R&D 人員負責產品之開發、設計、測試規劃，包括 H/W、S/W及ID的開發、設計、提出新發明及著作權揭露書. - Wistron Case3Presentation TitleRole & ResponsibilityFunctionResponsibilityHW (Hardware Design)* Hardware is responsible for Electronic Engineering Design * Co-works w
5、ith S/W and QT to make sure that the every function works well according to spec. * H/W should conduct technical transfer to PE. * H/W should input, update, and maintain the bugs/issues information in the bug tracking system. SW (Software Design)* Software is responsible for the design of BIOS, Driv
6、er, Utilities, and S/W Preload. * S/W co-works with H/W and QT to make sure that every function works well according to the specification. * S/W has to release the SCD and the Cert. Team Document. * S/W should conduct technical transfer to TE. * S/W has to input/update/maintain the bugs/issues infor
7、mation in the bug tracking system.ID/ME (Industrial Design/ Mechanical Engineering)* ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in the bug track
8、ing system used.- Wistron Case4Presentation TitleRole & ResponsibilityFunctionResponsibilityPA (EMI/Safety, QT, CE/Reliability, PCB, OS Certification)為產品保證暨開發支援Function之總稱, 主要負責根據 MRS/PES 執行各項產品之測試, 諸如 EMC/Safety : REGULATORY TEST , CE : RELIABILITY TEST 及 KEY COMPONENT APPROVAL , PCB : PCB LAYOUT,
9、DC : BOM , OS : OS 認證 etc;EMC/SafetyAll products to meet EMC/Safety requirements and guarantee the legality in the international marketing. 申請產品之安規、測試、Debug. QT為R&D轄下所屬之測試單位人員,主要負責各項產品之測試,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC.,CE/Reliability組件承認測試、不良品故障分
10、析及其他附件等材料品質之管制及保證 產品相關之可靠度與環境實驗，以及可靠度工程之研究與制定. PCBPCB Layout之申請、PCB之設計、Orcad library & Mentor library的建立與管理. 信號品質CAE分析, PCB layout外包廠商之管理，PCB製造廠商之管理. OS Certification執行公司各產品之 OS 相容性認證測試及 LOGO 申請. O.S. Beta Site 測試 PDM料號編碼及控管,BOM製作 - Wistron Case5Presentation TitleRole & ResponsibilityFunctionRespons
11、ibilityAM (Account Manager)1.爭取訂單與客戶合約協商. 2.協調產品SPEC.工程變更SAMPLEAPPROVAL.3.適時反應市場需求與趨勢. MM (Material Management)1.MM is responsible for new supplier development, parts purchasing2.Controlling mechanical tooling status including the schedule, capacity, parts readiness, concerns3.Manage the dependencie
12、s, long lead-time items. 4.MM also co-works with SQM and CE for component quality improvement and the key component QVL final versionSQM (Supplier Quality Management)* 零件品質管理及參與分包商之評鑑/管理 (SQRC Plan/Status)* 負責異常材料分析、追蹤與改善.* 負責進行產品 QVL CANDIDATE APPROVAL 作業系統 AT mfg. GCSD1.開發及推動全球客戶服務及支援計劃.2.各項售後服務及支
13、援作業.3.參與 Field 品質改善作業 (EWG)FI負責評估ProjectCost,決定Project是否可行以及Project所花費之Cost. Legal合約及專利審核- Wistron Case6Presentation TitleRole & ResponsibilityFunctionResponsibilityCFECFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a representative of the cus
14、tomer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and project status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or notNPI1.負責規劃、協調、整合與提供各 S
15、ite製造所需相關資訊與技術資料2.協調安排新產品轉移至海外生產工廠 3.協調處理海外生產工廠發生之生產相關問題 PE/PME1.產品設計審查, 產品問題之發覺及產品移交.2.協助生產良率提昇,克服生產瓶頸,提高生產力. 3.協助訂定製造規格及引進新的製作技術,進行改善以確保產品品質. IE1.設計及管理一個高效率的整合製造系統.2.消除浪費、杜絕不合理，提高生產力 3.生產流程規劃、製程改善、標準工時製定 QA1.執行製程及產品之檢驗並反應品質報告請相關單位改善品質 2.收集及處理市場及客戶品質回饋資料反應相關單位改善品質 3.協助工程單位必要之驗證測試. 4.建立PCBA,Final As
16、sembly之檢驗標準QE1.執行 DQA.FDI, MTBF, ORT Test2.執行產品開發過程之可靠度及環境測試 (C4)3.協助工程測試驗證 4.品質工程問題分析與解決 - Wistron Case7Presentation TitleRole & ResponsibilityFunctionResponsibilityPD (Production)PD has to work with PE, PME and IE respectively to get testing equipment & tools, assembly tools, and SOP ready before
17、C5 Exit. PD is responsible to produce the product. PD is not just for efficiency only but also quality.PSE (Process Engineer)PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP).FAE (Failure Analysis Engin
18、eer) or REFAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement. FAE is also responsible for preparing repair SOP if applicable.TETE is responsible for providing and maintaining Test Plan and Test Program. TE also implem
19、ent all the preload to production line and report the problems related to preload to preload team.PMC/GPMC (Plan Material Control/ Global Plan Material Control)GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up plan for all sites.- Wistr
20、on Case8Presentation TitleWistron C-System Quality ControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseProductionPilot-runPhaseMassProductionPhaseC0C1C2C3C4C5CheckPointWistron C- PhaseNPIFDI/MTBFDQA/PQC/ FQC Compatibility/Diagnostic-Simulation Test-Layout & drawi
21、ng-Signal Integrity-DFX Check-AVL-C-Test Plans Reliability/Stress EMI/ Safety OS & Pre-LoadWIH/WPH/WZS/WKS-MRS Check-Service Cost Estimate-Simulation-Design Peer Review -Lessons LearnedAvailabilityDevelop PlanLaunch FAI & SPCMTBF DemoCIP/CLCAPareto AnalysisEWG ReadyAFRTest ReportsPre-QVL ReadyDiagno
22、stics ProgramBug List & ActionDCN/ECN/ECR FAI report PFMEASQRCTrainingMTBF ReviewQMP/QPA/QSAFPYRPPAPServiceability DesignTest PlansIntegrate Design Review Signal QualityDFX IndexInitial Supplier AuditMemorandumDFMEASimulationMTBF EstimateMVPConcept/ProposalMRS Definition ScopeSCEInvestigation& Propo
23、salDesign & SourcingIntegrationValidationReleaseProduct Life CycleMDRR/C4MDRR/C4Go/ No Go?Go/ No Go?MRR/C5MRR/C5Go/ No Go?Go/ No Go?C6OOB/OBAORT/StressEWG/FQHAFR/DOA9Presentation TitleNew C System ArchitectureProgressC0 ExitC0 ActivityC0 EntryC1 ExitC1 ActivityC1 EntryC2 ExitC2 ActivityC2 EntryC3 Ex
24、itC3 ActivityC3 EntryC4 ExitC4 ActivityC4 EntryC5 ExitC5 ActivityC5 EntryC6 ExitC6 ActivityC6 EntryTimeDetail ActivitiesSubjectScopeDefinitionProcedure.Activities DefinitionRecord & ReportFormat DefinitionEscalation RuleMeasurementStandardProject Management & System Maintenance10Presentation TitleNe
25、w C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwor
26、k/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review repo
27、rtSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instr
28、uctionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel
29、.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC0 ChecklistMRSC0/PM C0 Meeting11Presentation Title階段 C0構想階段 (Proposal Phase) 負責單位 計畫經理 (Project Manager) 或產品經理 (Product Manager) 目的 * 確訂提案構想或市場需求規格書 (MRS)* 可行性分析 工作重點 * 相關提案之市場資料搜集* 相關提案之關鍵技術資料搜集* R
30、&D 提出技術可行性分析* PM 執行可行性及效益評估審核會議 C0目的 評估是否成立專案計畫，進行研發 檢核項目 計畫提案書或市場需求規格書 (MRS) C0-工作重點及檢核項目12Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meeti
31、ngC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/D
32、iagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificati
33、onSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 ChecklistMRSC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modules
34、pecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC1/PMC1 Meeting13Presentation TitleC1-工作重點及檢核項目階段 C1規劃階段 (Planning Phas
35、e) 負責單位 計畫經理 (Project Manager) 或產品經理 (Product Manager) 目的 * 規格的擬訂* 專案組織的成立* 專案時程的規劃 工作重點 * 選任技術經理 (Technical Manager, 簡稱TM) 並成立專案組織* 計畫專案經理(Project Manager)或產品經理，規劃專案時程* 召開C1審核會議* 法務確認Legal Concern、如Potential Patent List, Invention Disclosure* 成立專案團隊 審核會議 C1目的 成立專案團隊、確定開發時程 檢核項目 Time ScheduleProject
36、 TeamInvention DisclosureGreen Design Check ListSample Request Form 14Presentation Title15Presentation TitleCase - bottle Coca in England開採鋁礦開採鋁礦一噸鋁土提鍊半噸氧化鋁一噸鋁土提鍊半噸氧化鋁半小時加工半小時加工半噸氧化鋁熔煉成半噸氧化鋁熔煉成1/4噸金屬鋁噸金屬鋁再加工二週成鋁錠再加工二週成鋁錠瑞典或梛威瑞典或梛威熔爐工廠熔爐工廠澳大利亞澳大利亞澳大利亞澳大利亞化學還原工廠化學還原工廠加熱至華氏加熱至華氏900度度壓延成壓延成1/8 inch薄片薄片瑞
37、典和德國瑞典和德國壓延廠壓延廠船運一個月船運一個月冷軋成冷軋成1/80 inch薄片薄片冷軋廠冷軋廠英國易開罐廠英國易開罐廠成型，清洗，烘乾，防鏽成型，清洗，烘乾，防鏽裝填，印刷裝填，印刷英國可樂廠英國可樂廠消費消費鋁罐回收儘鋁罐回收儘16%16Presentation TitleEcological Rucksack (生態包袱生態包袱)生產一片半導體晶片所產生之廢料為產品重量之十萬倍生產一台筆記型電腦所產生之廢料為產品重量之四千倍生產一公升佛羅里達橘子汁需要兩公升汽油及一千公升之水生產一噸紙需用掉九十八噸之其他資源 資料來源資料來源 : 綠色資本主義綠色資本主義 天下出版社天下出版社17P
38、resentation TitleEU RoHS Directive指令期程指令期程2003.01.27 指令發布指令發布2003.02.13 歐盟公報發行歐盟公報發行,指令生效指令生效2004.08.13 轉為會員國當地法律轉為會員國當地法律,法規或行政指令法規或行政指令2006.07.01 新投入之產品不得含有禁用物質新投入之產品不得含有禁用物質指令要求指令要求/禁用項目禁用項目鉛鉛 (Pb)鎘鎘 (Cd)汞汞 (Hg)六價鉻六價鉻 (Cr6+)多溴聯苯多溴聯苯(PBB)多溴化二苯乙醚多溴化二苯乙醚(PBDE)(The restriction of the use of certain h
39、azardous substances in electrical and electronic equipment)18Presentation TitleEU RoHS 管制規格管制規格SubstancesE.U. 建議值Lead (Pb) 鉛 ; 銲錫1000 PPMLead (Pb) 鉛 ; 塑膠,線材,塗料1000 PPMCadmium (Cd) 鎘100 PPMMercury (Hg) 汞1000 PPMHex. Chromium (Cr6+) 六價鉻1000 PPMPBB (聚溴聯苯) 1000 PPMPBDE (聚溴二苯醚)1000 PPM重金屬：重金屬：汞、鉛、鎘、六價鉻汞、
40、鉛、鎘、六價鉻溴性耐燃劑：溴性耐燃劑：聚溴聯苯聚溴聯苯( (PBBPBBs s) )、溴聯苯醚溴聯苯醚( (PBDEPBDEs s) )註：另有註：另有管制規範外管制規範外的項目的項目19Presentation TitleEU WEEE DirectiveDirective 2002/96/EC期程2003.01.27 指令發布2003.02.13 歐盟公報發行，指令生效2004.08.13 轉為會員國當地法律,法規或行政指令2005.08.13 完成回收系統建構,製造商因應回收之 財務規劃就緒2006.12.31 回收再利用率達每人每年4kg2008.12.31 訂定下階段目標回收Targ
41、et of Recovery and Recycling(Waste Electrical and Electronic Equipment)WEEE CategoryLarge household appliancesSmall household appliancesIT & telecommunications appliancesConsumer equipmentLighting equipmentElectrical and electronic toolsToys, leisure & sports equipmentMedical devicesMonitoring and c
42、ontrol instrumentsAutomatic dispensersRate of RecoveryRate of Recycling80%75%70%50%75%65%75%65%70%50%70%50%70%50%*70%50%80%75% * To be determined by 31 December 200620Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run Phase
43、Production Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 c
44、hecklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility te
45、st reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklist
46、InventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecifica
47、tionC2/PMC2 Meeting21Presentation TitleC2 -工作重點及檢核項目階段 C2設計階段 (R&D Design Phase) 負責單位 技術經理 (Technical Manager)研發部門 目的 * 軟、硬體、機構設計* 証實設計可行性* 修正軟、硬體、機構規格 工作重點 * 電路設計並完成電路圖* 機構設計並完成機構設計圖* 機電整合設計並完成機電介面設計* 軟體設計並完成初步版本* 電路設計Review* 機構設計Review* 機電整合設計Review* 建立初步之測試計畫(硬體、軟體、機構) 審核會議 C2目的 * 確定計畫規格* 檢討設計階段之
48、工作成效* 決定是否進入樣品試作* 查核是否發出專利之申請 檢核項目 Schematics(Preliminary)S/WSpecificationMechanical&ThermalTestPlanInvention Disclosure Invention Disclosure22Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run Pha
49、seMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/Proc
50、edureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO
51、test reportPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificat
52、ionPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork packing drawingPAL/ROM data listingC3 manufacturability review reportSample approve status & bug list reviewC3/PMC3 Meeting23Pr
53、esentation TitleC3 -工作重點及檢核項目階段 C3樣品試作階段 (Lab Pilot Run Phase) 負責單位 技術經理 (Technical Manager)研發部門 目的 * 設計驗證* 依測試結果修改、變更設計 工作重點 * 樣品試作材料準備* 樣品試作* 針對樣品進行測試及驗證* 搜集Project成本資料* 擬定C3品質量化目標* 機構設計問題檢討及除錯(Debug)，測試報告檢討* 電路設計問題檢討及除錯(Debug)，測試報告檢討* 軟體設計問題檢討除錯(Debug)，測試報告檢討* 法務 -稽核文件之形成要件是否符合法定要件或工程規範-專利著作權、商標等
54、智慧財產權之申請準備審核會議 C3目的 檢討樣品測試驗證之結果、並決定是否進入工程試作階段 檢核項目 *HWdesignverificationreport*Microprocessor/EEPROMdatalisting*Mechanicaltestreport*SWfunctionverificationtestreport*MechanicalDrawing(Preliminary)*C3TestReport*C4TestPlan24Presentation TitleNew C System Product DevelopmentProposal PhasePlanning Phase
55、R&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability
56、review reportSample approvestatus & bug list reviewC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklistInventiondisclosureTime scheduleProject team
57、Model number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC4 checklistBOMQVLTime standardSystem
58、BIOS/KBC FW releaseS/W Driver/AP/Utility/Diagnostic release EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reli
59、ability test reportKey Component verificationSpare parts listC4/PMC4 Meeting25Presentation TitleWistron Mobile Reliability Test PlanEnvironment Thermal Pro Temperature and Humidity Test Vibration, Shock, Drop Tests Altitude Test, Acoustics Tests MTBF Prediction EMC Lightning/Surge Test Voltage Dip T
60、est EFT, ESD Test Harmonic Test IEC1000-4-XX EMI/EMSPower Line Interference Line Voltage/Frequency Test Power Surge Test Voltage Dip and Interruption Power On/Off Test EFT/B Immunity Test Complex Margin TestTransportation Vibration Test Altitude Test Shock Test Drop TestUser Incline Operation Test B
61、ench Handling Test Power Saving Test Pressure Test Audio Quality Torture Test26Presentation TitleReliability Test LCD Module27Presentation TitleWistron Mobile Reliability Test Plan28Presentation TitleItemTest ConditionSample SizeTimeResultHigh Temp / High Humid Op50 80%RH Dynamin20500 HoursPassLow T
62、emp Op0, Dynamic5500 HoursPassHigh Temp Op60, Dynamic10500 HoursPassHigh Temp / High Humid storage60, 90%RH, Storage2240 HoursPassLow Temp storage-20, Storage2240 HoursPassT/C ( Non-Op )-20(30Min) 60(30Min), Storage3100cyclePassAltitude testOperating & Storage272 HoursPassELP-20, Dynamic5072 HoursPa
63、ssVibration(Non-Op)5500Hz, 0.37Oct/min, 1.5G, X/Y/Z3-PassShock(Non-Op)180G, 2msec, Half Sine, X, Y, Z3-PassBox Vibration5500Hz, 1.0G, 0.5Oct/min15-PassBox Drop76 drop15-PassESDOperatingTop_Case : 12kVPanel : 15kVPanel : 15kV5-PassNon-OperatingUser connector : 2kVBottom cover :12kV5-PassPanel (ref)3k
64、V5-PassPush5kgf (result After 24Hours)2-PassImage StickingMosaic Pattern(8 X 6)104 HoursPassWistron Mobile Reliability Test - LCD29Presentation TitleC4 -工作重點及檢核項目階段 C4工程試作階段 (ENG Pilot Run Phase) 負責單位 技術經理 (Technical Manager)研發部門工程部門 目的 *工程試作與驗證*依驗證結果改善設計*準備技術資料以便技術移轉、授權或移轉技術至相關生產單位 工作重點 完成系統軟體或應用軟體
65、之設計、測試及除錯提出軟體之程式碼(SourceCode)正式發出電路圖(Schematics)、料表清單(BOM)及已驗證料表供應商清單(QVL)進行工程試作階段之測試、驗證及除錯並提出測試驗證報告提出工程試作階段之試作報告及改善建議完成生產或技術移轉所需之相關測試程式及程序法務完成專利、著作權、商標申請審核會議 C4目的 檢討工程試作結果，並決定是否進入試產階段完成各項技術移轉或生產所需之文件，並進行系統殘留問題之檢討與對策驗證 檢核項目 *S/WFirmwarerelease*BOM*MEENGP/Rreport*EEENGP/Rreport*TestProgram*PCBartwork
66、*C4Testreport*Schematics*SWsourcecode*Transferplan30Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test repor
67、tSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT
68、WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listPMPMC0 meetingC1 meeti
69、ngPM C0 ChecklistMRSPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificationPMC0C1C2C3C4C5C6C6 meetingGC
70、SDC6 checklistProduct phaseout noticeC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportC5/NPIC5 Meeting31Presentation TitleC5 -工作重點及檢核項目階段 C5試產階段 ( Production Pilot Run Phase) 負責單位 生產部門(Production)物管
71、部門(Material Management)工程部門(Engineering)技術經理 (Technical Manager)研發部門(R&D)目的 預為建立量產之準備, 完成各項生產必備之文件, 並進行產品殘留問題之檢討與對策驗證工作重點 * 提出 FDI 及MTBF DEMO TEST REPORT.* 提出 ACT(ACCEPT TEST REPORT)* 提出 PD PILOT RUN YIELD RATE ANALYSIS REPORT* 殘存 ISSUE 之追蹤與結果* REVIEW 量產材料狀況 * 取得各項安全規格之合格證明* 取得 REQUEST OS 認證之合格證明 *
72、Service Guide & Spare Parts List 審核會議 C5目的 檢討試產結果及生產作業與流程,並決定是否進入量產.檢核項目 試產階段之問題與對策研討.SCHEDULE檢討.量產計劃及備料狀況研討.試產階段YEILD RATE分析與改善對策32Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass prod
73、uction phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 checklistBOMQVLTime standardSystem B
74、IOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliabi
75、lity test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklistInventiondisclosureTime schedulePro
76、ject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingC6/GCSDC6 checklistProduct phase out noticeC6 Meeting33Presentation
77、TitleC6 -工作重點及檢核項目階段 C6 量產階段 (Mass Production Phase) 負責單位 生產部門(Production)物管部門(Material Management)工程部門(Engineering)業務部門(Account Manager - AM)客服部門(GCSD)目的 配合行銷與客戶需求產品之品質再確認及持續改善產品停產後, 後續服務需求滿足產品研發與銷售成本營收之比較工作重點 產品品質持續改善 (CIP Continuous Improve Process)提出ProductEOFServicePlan執行EarlyWarning機制及產品相關品質資料收集提出FieldQuality及ServiceCostSummaryReport提供客戶回饋之主要問題的經驗學習及掌握通告產品PhaseOutNotice產品停產之ServiceInformationPackUpdateRelease執行客戶滿意度相關事宜審核會議 C6目的 對 Project 開發活動作通盤開發檢討及提出改進意見及產品停產後客戶後續服務需求及未來殘留問題的職責之研討 檢核項目 量產階段之問題與對策研討客戶回饋問題停產後客戶服務後續事宜經驗學習與掌握(lessonslearned)
