电镀基础知识培训

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1、Atotech (China) Chemicals Ltd.SH安美特上海青浦分公司 PRESENTS ELECTROPLATING TRAINING电镀培训电镀培训 1OUTLINE内容提要bINTRODUCTION介绍介绍bELECTROCHEMISTRY电化学电化学bCLEANING & PREPLATE 清洗及预镀清洗及预镀bNICKEL 镍镍bCopper 铜铜bDECORATIVE CHROMIUM装饰铬装饰铬bTESTING测试测试bFILTRATION 过滤过滤bTROUBLE SHOOTING故障处理故障处理2WHAT IS ELECTROPLATING ?什么是电镀？bTH

2、E DEPOSITION OF A METALLIC COATING UPON A NEGATIVELY CHARGED CATHODE BY THE PASSING OF AN ELECTRIC CURRENT在电流通过时，有金属层沉积在带负电荷在电流通过时，有金属层沉积在带负电荷的阴极表面的阴极表面.3WHAT IS THE PURPOSE ?电镀的目的是什么？bTO OBTAIN A METALLIC COATING HAVING CERTAIN PROPERTIES SUCH AS HARDNESS, BRIGHTNESS, CORROSION RESISTANCE AND TO RE

3、PRODUCE IDENTICAL FORMS IN ELECTROFORMING.b是为了得到具有某种特性的金属层，如：硬是为了得到具有某种特性的金属层，如：硬度、光亮度、耐腐性及在度、光亮度、耐腐性及在电铸方面复制同样电铸方面复制同样的形状的形状.4REQUIREMENTS要求bSOURCE OF DIRECT CURRENT直流电源直流电源bA PLATING TANK电镀槽电镀槽bA SOLUTION CONTAINING THE DISSOLVED SALTS OF THE METAL TO BE PLATED含有待镀的可溶性金属盐的溶液含有待镀的可溶性金属盐的溶液bANODE (

4、POSITIVE ELECTRODE )阳极（正电极）阳极（正电极）bA PREPARED OBJECT - CATHODE ( NEGATIVE ELECTRODE ) 准备好的待镀工件准备好的待镀工件-阴极（负电极）阴极（负电极） 5WHAT IS DIRECT CURRENT ? 何为直流电？何为直流电？bTHE FLOW OF ELECTRONS IN THE SAME DIRECTION BETWEEN POSITIVE AND NEGATIVE ELECTRODES在正负电极之间电子向同样的方向移动在正负电极之间电子向同样的方向移动.6WHAT IS A PLATING SOLUT

5、ION ?电镀液是什么？bA CONDUCTING MEDIUM FOR THE MOVEMENT OF METAL IONS IN SOLUTION BETWEEN AN ANODE AND A CATHODE溶液中在阳极与阴极间金属离子移动的导电溶液中在阳极与阴极间金属离子移动的导电介质介质.7WHAT IS pH ?什么是pH值？bTHE MEASUREMENT OF ACIDITY OR ALKALINITY用来度量酸碱度的用来度量酸碱度的bON A SCALE FROM 0 TO 14pH值的范围处于值的范围处于0-14之间之间b 0 TO 6.9 BEING ACIDIC AND

6、7.1 TO 14 ALKALINE AND 7.0 BEING NEUTRAL. 小于小于7的为酸性，大于的为酸性，大于7且小于等于且小于等于14的为碱性，的为碱性，7.0为中性为中性8HOW ARE PLATING SOLUTION MAINTAINED ?如何维护电镀液？bCHEMICAL ANALYSIS OF THE CONSTITUENTS持续的化学分析持续的化学分析bHULL CELL PLATING TESTS赫氏槽电镀测试赫氏槽电镀测试bADDITION OF CHEMICALS添加化学品添加化学品bELIMINATION OF CONTAMINANTS 去除污染物去除污染物

7、bPERIODIC PURIFICATION定期净化定期净化bREGULAR INSPECTION OF PARTS FOR DEFECTS缺陷缺陷/次品的常规检查次品的常规检查bPHYSICAL TESTING物理测试物理测试9WHAT IS A METAL ION ?什么是金属离子？bA METAL ION IS AN ATOM OF A METAL HAVING A POSITIVE ELECTRICAL CHARGE金属离子是带正电荷的金属原子金属离子是带正电荷的金属原子(失去电子失去电子) 10WHAT ARE THE SOURCES OF METAL IONS ?金属离子来自何处？

8、bMETAL SALTS IN PLATING SOLUTION电镀液中的金属盐电镀液中的金属盐bSOLUBLE METAL ANODES可溶性的金属阳极可溶性的金属阳极11WHAT ARE ANODE BAGS ?什么是阳极袋？bANODE BAGS ARE POROUS MEMBRANES PLACED AROUND ANODES TO COLLECT SLUDGE FORMING ON THE DISSOLVING ANODE阳极袋是包扎在阳极外面阳极袋是包扎在阳极外面,会将电镀过程中产会将电镀过程中产生的阳极泥收集在袋内的多孔的袋。生的阳极泥收集在袋内的多孔的袋。12Basic ELE

9、CTROCHEMISTRY基本的电化学理论13ELECTROCHEMISTRY 电化学Plating Cell 电镀槽Ni+Ni+Cl-Cl-+_Rectifier整流器整流器ANODE阳极阳极CATHODE阴极阴极ANODE阳极阳极14CATHODE REACTIONS 阴极反应Cathode 阴极bReduction of ions离子还原反应离子还原反应bDraw electrons from the external circuit从从外部电路中吸收电子外部电路中吸收电子bTYPICAL REACTION 典型的反应典型的反应Ni+ + 2e- Ni (metal 金属金属)2H+ +

10、 2e- H24H2O + 4e- 2H2 + 4(OH)-15ANODE REACTIONS 阳极反应Anode 阳极bOxidation of metal to ions 金属氧化成阳离金属氧化成阳离子子bRelease of electrons to external circuit 将将电子释放至外部电路电子释放至外部电路bTYPICAL REACTION 典型的反应典型的反应Ni Ni+ + 2e-4OH- O2 + 2H2O + 4e-2H2O O2 + 4H+ + 4e-16RATE OF CURRENT FLOW 电流速率Ohms Law 欧姆定律欧姆定律Amperes安培安培

11、 = Volts 伏特伏特 Ohms 欧姆欧姆I 电流电流= E 电压电压 R 电阻电阻17FARADAYS LAW 法拉第定律Factors 要素要素Amperes 安培安培Time 时间时间Equivalent Weight of Metal 金属当量金属当量18FARADAYS LAW 法拉第定律b One ampere flowing for one second represents one coulomb. Faraday law states that 96,500 coulombs (one Faraday) will deposit one gram equivalent w

12、eight of a metal. Equivalent weight is the atomic weight of the metal divided by its valence.b1安培的电流安培的电流1秒的时间通过的电量等于秒的时间通过的电量等于1库仑。库仑。法拉第定律：法拉第定律：1个法拉第即个法拉第即96,500库仑的电量可以库仑的电量可以沉积沉积1克当量的金属。克当量是金属的原子量除以克当量的金属。克当量是金属的原子量除以它的化合价它的化合价.19FARADAYS LAW 法拉第定律weight of metal deposited沉积的金属重量沉积的金属重量 96,500 C

13、oulombs Deposit At. Wt. = grams 96,500库仑的镀层库仑的镀层 Valence20WEIGHT OF NICKEL PLATED电镀镍的重量KNOWN FACTORS已知的条件已知的条件Current 电流电流= 50 amps安培安培Time 时间时间 = 15 mins分钟分钟原子量原子量 At. Wt. Ni = 58.7 Valence = 化合价化合价, 2 价价CALCULATION 计算计算96,500 = 45,000 X = 13.7 GRAMS 克克 58.7 x grams 221CALCULATING THICKNESS FROM WE

14、IGHT从重量计算厚度Thickness = WT 1um=10 -4 cmdensity x area1mil = 25. 4 umEXAMPLE :wt = 0.136 grams. Density of Ni = 8.9Area = 4 cm2Thickness = 0.1368.9 x 4Answer = 1.5 mils22CURRENT IN CELL电镀槽中的电流Anode阳极阳极-e = cathode阴极阴极 +eAnode阳极阳极-e = corrosion溶解溶解 -e + Oxygen氧氧 -e Cathode阴极阴极+e = plating所镀金属所镀金属+e + h

15、ydrogen氢氢+eThe exchange of electrons at the anode and the cathode or the total flow of current at each electrode is always equal.电子在阳极和阴极上交换电子在阳极和阴极上交换,在阴阳极上流动的电在阴阳极上流动的电流总是相等的。流总是相等的。23DEPOSITION WITH H 2 LIBERATION伴随着氢气释放的沉积 NET RESULT 最终的结果最终的结果1.Cathode Efficiency Reduced阴极电流效率的降低阴极电流效率的降低2.pH I

16、ncreased pH值升高值升高Anode阳极阳极Cathode阴极阴极Ni+2Ni+22H+H224PLATING EFFICIENCY AND TIME OF PLATING电镀效率和电镀时间% Efficiency效率效率 = Actual Ni Plated实际镀的镍实际镀的镍 X 100 Theoretical (Faradays Law ) 理论的（法拉第定律）理论的（法拉第定律）25FACTORS AFFECTING PLATING CURRENT影响电镀电流的因素bHydrogen Liberation ( cathode )氢气释放（阴极）氢气释放（阴极）bOxygen L

17、iberation ( anode )氧气释放（阳极）氧气释放（阳极）bPolarization极化极化bConcentration Polarization ( Diffusion )浓度极化（扩散）浓度极化（扩散）bHydrogen Overvoltage氢过电位氢过电位26POLARIZATION极化E = IRE = Volts伏特伏特 ( potential difference电位差电位差 )R = Resistance电阻电阻 ( resistance of solution to the flow of current 溶液对电流的阻抗溶液对电流的阻抗) I = Current

18、电流电流 ( flow of electricity电荷的移动电荷的移动 )E = CURRENT电流电流 (I) X RESISTANCE电阻电阻 (R)Ep = Change in potential difference due to Polarization from resistance. 由于电阻升高造由于电阻升高造成的极化成的极化,极化导致的电位差的改变极化导致的电位差的改变.27POLARIZATION 极化EIEpR= E IEP= Polarization28CONCENTRATION POLARIZATION 浓度极化bCONCENTRATION OF METAL ION

19、S BUILD ON THE SURFACE OF THE ANODE 阳极表面的金属离子浓度阳极表面的金属离子浓度bCONCENTRATION OF THE METAL IONS DECREASE AT THE SURFACE OF THE CATHODE 阴极表面的金属离子浓度减少阴极表面的金属离子浓度减少bCHANGE IN ANODE AND CATHODE FILMS CAUSES POLARIZATION阳极和阴极膜层的改变导致了极化阳极和阴极膜层的改变导致了极化29CONCENTRATION POLARIZATION 浓度极化Ni +IonsANODE阳极阳极CATHODE 阴极

20、阴极+ + + + +EFFECT 影响影响Agitation 打气打气Temperature 温度温度30HYDROGEN OVERVOLTAGE氢过电位bPOLARIZATION DUE TO EVOLUTION OF HYDROGEN UPON A SPECIFIED ELECTRODE SURFACE OROR THE EXCESS POTENTIAL ABOVE THE EQUILIBRIUM POTENTIAL REQUIRED TO EVOLVE HYDROGEN AT THE CURRENT DENSITY SPECIFIED.在指定的电极表面上氢气的形成而引起的极化在指定的电

21、极表面上氢气的形成而引起的极化 或或 在某一电流密度下氢的形成所要求的超出平衡电在某一电流密度下氢的形成所要求的超出平衡电位后的电位位后的电位.31HYDROGEN OVERVOLTAGE氢过电压bFACTORS 要素要素TYPE OF METAL金属的种类金属的种类SURFACE ROUGHNESS 表面的粗糙度表面的粗糙度TYPE OF SOLUTION 溶液的类型溶液的类型CURRENT DENSITY电流密度电流密度TEMPERATURE温度温度32HYDROGEN OVERVOLTAGE 氢过电位 (1 ma/cm2) )bZnbSnbCdbCubNibAgbAubCbPt-0.80

22、-0.80-0.80-0.60-0.40-0.30-0.15-0.110.0033ELECTROMOTIVE SERIES 电势序列 VoltsAl3+ -1.66Zn2+ -0.76Cr3+ -0.74Fe2+ -0.44Cd2+ -0.40Co2+ -0.29Ni2+ -0.25Sn2+ -0.14Pb2+ -0.13 VoltsH1+ 0.00Sb3+ +0.10Bi3+ +0.20Cu2+ +0.34 Cu1+ +0.52 Rh3+ +0.80Ag1+ +0.80Pt2+ +1.20Au1+ +1.68 34ANY QUESTIONS ?有问题吗？35CLEANING & PREPLA

23、TECLEANING & PREPLATE清洗与预镀清洗与预镀36PURPOSE FOR CLEANING清洗的目的bTO PROVIDE ADHESION ON THE SUBSEQUENT DEPOSITS保障后续的镀层的结合力保障后续的镀层的结合力.bTO OBTAIN A HIGH QUALITY FINISH DEPOSIT得到高品质的完美镀层得到高品质的完美镀层bTO OBTAIN THE DESIRED PROPERTIES OF THE DEPOSITS镀层具有期望的各种特性镀层具有期望的各种特性.37EFFECTS OF IMPROPER CLEANING不正确清洗的影响bP

24、OOR BONDING TO BASE METAL与基体与基体(素材素材)金属间差的结合力金属间差的结合力bPEELING OF DEPOSIT镀层的起皮镀层的起皮bSKIP PLATE漏镀漏镀bMICRO ROUGHNESS微观粗糙微观粗糙bPITTING起泡起泡bPOOR CORROSION RESISTANCE差的耐腐性差的耐腐性bCONTAMINATED BATHS 污染镀液污染镀液38PRECLEANING OPTIONS预清洗的选择bMECHANICAL CLEANING 机械清洗机械清洗WET OR DRY BLASTING 干法喷砂干法喷砂/丸丸bSOLVENT CLEANIN

25、G 溶剂清洗溶剂清洗DEGREASING, EMULSION, DIPHASE 脱脂、乳化、脱脂、乳化、固液相分离固液相分离.bALKALINE CLEANING 碱洗碱洗SPRAY, SOAK, ELECTRO, ULTRASONIC 喷射、浸泡、喷射、浸泡、电解、超声波电解、超声波bACID CLEANING 酸洗酸洗SOAK, ELECTRO 浸泡、电解浸泡、电解39HOW CLEANERS WORK清洗剂如何工作bDISPERSION 分散分散bSAPONIFICATION皂化皂化bEMULSIFICATION乳化乳化40DISPERSION分散分散bDISPERSION IS A M

26、ETHOD WHEREBY SOLID PARTICLES ARE BROKEN DOWN TO SMALL PARTICLES BY THE ACTION OF SURFACTANTS AND OTHER COMPONENTS IN A CLEANER. THE PRINCIPLE IS EFFECTIVE FOR RESIDUE LEFT FROM POLISHING OPERATIONS分散是一种方法，固体的微粒通过表面活化剂和清分散是一种方法，固体的微粒通过表面活化剂和清洗剂中其它组分的作用分散成小的微粒。这个原则洗剂中其它组分的作用分散成小的微粒。这个原则对抛光时留下的残余物的清洗是

27、有效的。对抛光时留下的残余物的清洗是有效的。41HOW CLEANERS WORK清洁剂如何工作DISPERSION DISPERSION 分散分散分散分散DIRTDIRT污垢污垢污垢污垢COATED WITH SURFACTANTCOATED WITH SURFACTANT覆盖了表面活性剂覆盖了表面活性剂覆盖了表面活性剂覆盖了表面活性剂42HOW CLEANERS WORK清洗剂如何工作bDISPERSION 分散分散bSAPONIFICATION皂化皂化bEMULSIFICATION乳化乳化43SAPONIFICATION皂化皂化bSAPONIFICATION IS THE CHEMICA

28、L ACTION BY WHICH FATTY ACID, FATTY OIL OR OTHER REACTABLE SOIL IS CONVERTED TO A WATER SOLUBLE COMPOUND, SOAP. ELEVATED TEMPERATURES, CONCENTRATION, AND pH PROMOTES THE SPEED AND COMPLETION OF THE REACTION皂化是将脂肪酸皂化是将脂肪酸/脂肪油或其它可反应的污物转化脂肪油或其它可反应的污物转化成水溶性的混合物成水溶性的混合物(肥皂肥皂)。提高温度、浓度和。提高温度、浓度和pH值值都会促进反应的

29、速度和反应的完成。都会促进反应的速度和反应的完成。44HOW CLEANERS WORK清洗剂如何工作SAPONIFICATION SAPONIFICATION 皂化皂化皂化皂化VEGETABLE OILSVEGETABLE OILS植物油植物油植物油植物油SOLUBLESOLUBLE ALKALI SOAPS ALKALI SOAPS可溶性的碱性肥皂可溶性的碱性肥皂可溶性的碱性肥皂可溶性的碱性肥皂45HOW CLEANERS WORK清洗剂如何工作bDISPERSION 分散分散bSAPONIFICATION皂化皂化bEMULSIFICATION乳化乳化46EMULSIFICATION乳化乳

30、化bEMULSIFICATION IS A CHEMICAL PROCESS BY WHICH SURFACTANTS PENETRATE OILS AND SOILS AND BREAK THEM DOWN TO TINY WATER SOLUBLE GLOBULES DISPERSED AND SUSPENDED IN SOLUTION乳化是一种化学过程，表面活性剂渗透油和污乳化是一种化学过程，表面活性剂渗透油和污物，将它们在溶液中分散成微小的分散性的水物，将它们在溶液中分散成微小的分散性的水溶性水珠和悬浮液溶性水珠和悬浮液.47HOW CLEANERS WORK清洗剂如何工作EMULSI

31、FICATIONEMULSIFICATION乳化乳化乳化乳化MINERAL OILMINERAL OIL矿物油矿物油矿物油矿物油COATED WITH EMULSIFIERSCOATED WITH EMULSIFIERS覆盖了乳化剂覆盖了乳化剂覆盖了乳化剂覆盖了乳化剂48TYPE OF CLEANING清洗的种类bSOLVENT DEGREASING溶剂脱脂溶剂脱脂bALKALINE CLEANING碱洗碱洗bSPRAY CLEANING喷射清洁洗喷射清洁洗bACID PICKLING浸酸浸酸49TYPE OF CLEANING清洗的种类SOLVENT CLEANING 溶剂脱脂溶剂脱脂bMI

32、XTURES OF SUITABLE SOLVENTS AND SURFACTANTS. 适合的溶剂和表面活性剂的混合适合的溶剂和表面活性剂的混合bUSED IN VAPOR DEGREASING.在蒸汽除油时使用在蒸汽除油时使用bMINIMAL USE DUE TO HEALTH AND ENVIRONMENTAL CONCERNS.由于健康和环境方面的考虑尽量少使用由于健康和环境方面的考虑尽量少使用50ALKALINE CLEANERS 碱洗 THREE MAJOR COMPONENTS 三种主要成份三种主要成份bBUILDERS-SODIUM HYDROXIDE 氢氧化钠氢氧化钠 or主

33、体主体 POTASSIUM HYDROXIDE 氢氧化钾氢氧化钾 SILICATES 硅酸盐硅酸盐 CARBONATES 碳酸盐碳酸盐 CONDENSED PHOSPHATES 浓缩磷酸盐浓缩磷酸盐b ADDITIVES- CHELATING AGENTS TO COUNTERACT EFFECTS OF HARD WATER AND METAL IONS.添加剂添加剂-螯合物可以消除硬水和金属离子的影响螯合物可以消除硬水和金属离子的影响.bSURFACTANTS-DISPLACE AND DISPERSE SOIL. LOWER SURFACE TENSION OF CLEANER AT M

34、ETAL SURFACE FOR UNIFORM COVERAGE.表面活性剂表面活性剂- -置换和分散污物，降低金属表面上清洗剂的表置换和分散污物，降低金属表面上清洗剂的表面张力面张力, ,让金属表面被清洗液完全覆盖让金属表面被清洗液完全覆盖. .51TYPES OF ALKALINE CLEANERS碱洗的类型bSOAK 浸泡浸泡-HIGH INFINITY FOR OILS AND GREASES DUE TO HIGH SURFACTANT CONTENT 高的表面活性剂的含量可除去大量的油脂高的表面活性剂的含量可除去大量的油脂-DESIGNED FOR SPECIFIC CLEANI

35、NG为某些清洗而设计为某些清洗而设计.bSPRAY 喷射喷射-MECHANICAL IMPINGEMENT AND CHEMICAL CLEANING 机械冲击与化学冲洗机械冲击与化学冲洗-LOW FOAMING 低泡低泡52ALKALINE CLEANERS碱洗bSOAK/ELECTRO浸泡浸泡/电镀电镀CONC. - 15 - 90 g/lTEMP. - 50 - 82 CTIME - 1 - 10 min. bSPRAY喷射喷射CONC. - 2 - 15 g/lTEMP. - 43 - 66 CTIME - 15 - 60 sec. 53TYPES OF ALKALINE CLEANI

36、NG碱洗的类型bCATHODIC ELECTRO 阴极电镀阴极电镀 -GREATEST GAS EVOLUTION 产生大量的气体产生大量的气体 -REDUCES OXIDE 减少氧化减少氧化 -DEPOSITS SMUT 脏物会沉积到阴极上脏物会沉积到阴极上.bANODIC - ELECTRO 阳极电镀阳极电镀 -REMOVES SMUT 移走污物移走污物-TOLERANCE TO METAL IMPURITIES 容忍金属杂质容忍金属杂质-FORMS OXIDE FILM 形成氧化膜形成氧化膜54TYPES OF ALKALINE CLEANING碱洗的类型bULTRASONIC SOAK

37、 超声波超声波-浸泡浸泡ENERGY FROM SOUND WAVES BEYOND THE AUDIBLE RANGE BREAKS DOWN DIRT PARTICLES DUE TO FREQUENCY THAT RANGE OF 15 TO 40 kHz. .由于频率在由于频率在15-40KHz15-40KHz之间，超出听力范围的声波的能量之间，超出听力范围的声波的能量将污物微粒分解将污物微粒分解55ALKALINE CLEANING 碱洗CATHODIC ELECTROCLEANING阴极电除油阴极电除油bHYDROGEN LIBERATED AT THE CATHODE. THE

38、VOLUME OF THE HYDROGEN IS TWICE THAT OF OXYGEN GENERATED AT THE ANODE.阴极释放出氢气，氢气量是阳极释放的氧气量的两倍阴极释放出氢气，氢气量是阳极释放的氧气量的两倍.bACTIVATES SURFACE.活化表面活化表面.bCERTAIN OXIDE FILMS ARE REDUCED.某些氧化膜被还原某些氧化膜被还原.bA DISADVANTAGE IS THAT METALLIC IONS CAN DEPOSIT ON THE WORK AS A LOOSE ADHERENT SMUT.缺点是金属离子会以疏松的污物形式沉积

39、在工件表面缺点是金属离子会以疏松的污物形式沉积在工件表面.56ALKALINE CLEANING 碱洗ANODIC ELECTROCLEANING阳极电解除油阳极电解除油bOXYGEN LIBERATED AT THE ANODE. THIS TYPE OF CLEANING WILL REMOVE SMUT. 阳极释放出氧气，这种形式的清洗能除去污垢阳极释放出氧气，这种形式的清洗能除去污垢.bMETALLIC CONTAMINATES WILL NOT DEPOSIT ON WORK.金属污染物不会沉积在工件表面金属污染物不会沉积在工件表面.bFORMS OXIDES产生氧化膜产生氧化膜bP

40、ASSIVATES SURFACE钝化表面钝化表面.57ELECTROCLEANING REACTIONS电解除油反应ANODE REACTION 阳极反应阳极反应4(OH)- - 4e 2H2O + O2CATHODE REACTION 阴极反应阴极反应4H2O + 4e 4(OH)- + 2H258ALKALINE CLEANING 碱洗ULTRASONIC 超声波超声波b ULTRASONIC GENERATORS ARE USED TO CREATE SOUND WAVES WHICH IN TURN ARE CONVERTED WITHIN THE SOLUTION TO MECHA

41、NICAL ENERGY.超声波发生器被用来产生声波，它在溶液中会被转化成机械超声波发生器被用来产生声波，它在溶液中会被转化成机械能能.bULTRASONIC ENERGY ALTERNATELY COMPRESSES AND EXPANDS THE SOLUTION WHICH PRODUCES SEVERAL CONCURRENT EFFECTS.超生波可选择性地压缩和膨胀液体，使之产生几种同步效应超生波可选择性地压缩和膨胀液体，使之产生几种同步效应bCAVITATION DUE TO FREQUENCY ASSISTS THE PHYSICAL REMOVAL OF SOILS.由于高频

42、率导致的气穴现象导致污物被物理方法去除由于高频率导致的气穴现象导致污物被物理方法去除.59ALKALINE CLEANING 碱洗SPRAY CLEANING 喷射清洁喷射清洁bSOLUTION IS USUALLY MILDLY ALKALINE DEPENDING UPON THE BASE METAL.根据基材的不同，溶液常常含有微碱性。根据基材的不同，溶液常常含有微碱性。bACCOMPLISHED BY PUMPING THE CLEANING SOLUTION THROUGH A SERIES OF PIPES AND JETS.通过一系列的管和喷射装置，通常由泵来输送清洗剂通过一系

43、列的管和喷射装置，通常由泵来输送清洗剂.bACTION OF PHYSICAL IMPACT AND CHEMICAL ACTION REMOVES DUST, METAL FINES, CARBON SMUT AND OTHER RESIDUES.物理的冲击作用和化学反应去除了灰尘、金属物理的冲击作用和化学反应去除了灰尘、金属微尘微尘、碳、碳化物和其它的残留物。化物和其它的残留物。60TYPE OF CLEANING 清洗的类型ACID PICKLING 过酸过酸bWHY DO WE PICKLE? 为什么要用酸浸泡？为什么要用酸浸泡？bTO REMOVE OXIDES FROM THE S

44、URFACE OF THE METAL TO OBTAIN GOOD BONDING OF THE SUBSEQUENT DEPOSIT.去除金属表面的氧化膜，使后来的金属镀层得到好的结合力。去除金属表面的氧化膜，使后来的金属镀层得到好的结合力。bNEUTRALIZE ANY RESIDUAL ALKALINE FILM LEFT ON THE SURFACE.中和残留在表面的碱性膜。中和残留在表面的碱性膜。61ACID PICKLING 过酸去氧化膜CHEMISTRY OF PICKLING 过酸的化学反应过酸的化学反应bACID酸酸 + BASE基材基材 H2O水水 + SALT盐盐Sul

45、furic Acid + Caustic Soda Water + Sodium Sulfate硫酸硫酸氢氧化钠氢氧化钠水水硫酸钠硫酸钠bACID酸酸 + METAL金属金属 H2 氢气氢气 + SALT盐盐Sulfuric Acid + Steel Hydrogen + Ferrous Sulfate硫酸硫酸 不锈钢不锈钢氢气氢气硫酸亚铁硫酸亚铁bACID酸酸 + METALLIC OXIDE金属氧化物金属氧化物 H2O水水 + SALT盐盐Sulfuric Acid + Copper Oxide Water + Copper Sulfate硫酸硫酸氧化铜氧化铜水水硫酸铜硫酸铜62ACID

46、PICKLING酸浸泡METALS金属金属CHEMICALS 过酸使用的化学品过酸使用的化学品 STEELH2SO4 or HCl不锈钢不锈钢ACID SALTS ( NH4HF )酸性盐酸性盐COPPER & H2SO4 or HClCu ALLOYSORGANIC ACIDS 有机酸有机酸铜及铜合金铜及铜合金ACID FORMING SALTS 酸盐酸盐ALUMINUM H2SO4, H3PO4, HNO3 or HF铝铝 ZINC & ALLOYS ACID FORMING SALTS 酸盐酸盐锌及锌合金锌及锌合金63SOAK CLEANER TYPE热浸清洗剂的类型bNON ETCHI

47、NG 不发生浸蚀的不发生浸蚀的bBUFFING COMPOUND REMOVAL除腊水除腊水bUSED AS ULTRASONIC CLEANER超声波清洗用清洗剂超声波清洗用清洗剂bLIGHT DIRT AND SOIL REMOVAL轻微脏物和污物去除剂轻微脏物和污物去除剂64CLEANING & PICKLING清洗与过酸活化SUMMARY总结总结bPRE-CLEANING - VERY IMPORTANT.预清洗预清洗非常重要非常重要bSELECTION OF PRE-CLEANING CYCLE IS DEPENDENT ON NATURE OF SOIL & BASE METAL.

48、预清洗流程的选择根据污染物和基材的特性而定预清洗流程的选择根据污染物和基材的特性而定bELECTRO-CLEANING IS ESSENTIAL IN PRODUCING HIGH QUALITY METAL DEPOSITS.要获得高品质的金属镀层，电解清洗是必需的要获得高品质的金属镀层，电解清洗是必需的bTHOROUGH RINSING AFTER EVERY CLEANING AND PICKLING SOLUTION IS IMPORTANT IN PRODUCTION OF HIGH QUALITY DEPOSITS.在高品质电镀的生产中，每一个除油和过酸步骤后的彻底漂洗是非在高品质

49、电镀的生产中，每一个除油和过酸步骤后的彻底漂洗是非常重要的常重要的bCLEANED AND RINSED PARTS ARE PICKLED TO REMOVE OXIDES AND ACTIVATE THE SURFACE OF THE BASE METAL.彻底除油并水洗后的工件过酸是为了除去氧化物和活化基材的表面彻底除油并水洗后的工件过酸是为了除去氧化物和活化基材的表面.65 BRIGHT ACID COPPER PLATINGBRIGHT ACID COPPER PLATING光亮酸铜电镀光亮酸铜电镀66 BRIGHT ACID COPPER PLATINGBRIGHT ACID CO

50、PPER PLATING光亮酸铜电镀光亮酸铜电镀67APPLICATIONS APPLICATIONS 应用应用bbDECORATIVE DECORATIVE INTERMEDIATE INTERMEDIATE COATINGCOATING装饰的中间层装饰的中间层装饰的中间层装饰的中间层Steel 不锈钢不锈钢Zinc Die Casting 锌压铸锌压铸Brass 黄铜黄铜Plastics 塑料塑料Aluminum 铝铝bbINDUSTRIAL COATING工业用的镀层工业用的镀层 Electroforming 电成型电成型Electrotyping 电铸电铸Rotogravure 印刷用

51、滚筒印刷用滚筒Electroclading 电镀金属包层电镀金属包层Stop-Off in Case hardening 中转镀层中转镀层68ACID COPPER PROCESS FEATURESACID COPPER PROCESS FEATURES酸铜流程特点酸铜流程特点bBRIGHT 光亮光亮bGOOD LEVELING 好好的填平的填平bDUCTILE 延展性好延展性好bSTRESS FREE 无应力无应力bFINE GRAIN DEPOSITS镀层结晶细致镀层结晶细致bEASY TO CONTROL 容易控制容易控制bFAST PLATING 快速电镀快速电镀bEASILY BUF

52、FED 容易抛光容易抛光bGOOD ELONGATION 好的延展性好的延展性bGOOD MICROTHROW 好的微观均镀性好的微观均镀性bMACHINEABLE 好的机械加工性能好的机械加工性能bGOOD ELECTRICAL CONDUCTIVITY 好的电导性好的电导性69Why Acid Copper ?Why Acid Copper ?为什么用酸铜为什么用酸铜Provides Leveling of Polishing/Buffing ScratchesProvides Leveling of Polishing/Buffing Scratches抛抛/磨光后提供好的填平效果磨光后

53、提供好的填平效果Mirror Smooth Surface180 GritScratches70LEVELING LEVELING 填平填平MACROTHROW宏观上的均镀宏观上的均镀THE ABILITY TO DEPOSIT METAL RELATIVELY UNIFORMLY OVER A BROAD CURRENT DENSITY RANGE 在一个宽的电流密度范围在一个宽的电流密度范围内相对地镀层均匀分布的内相对地镀层均匀分布的能力能力MICROTHROW 微观上的均镀微观上的均镀THE ABILITY TO DEPOSIT METAL IN GROOVES, PORES, CRAC

54、KS AND SURFACE IMPERFECTIONS OF MICROSCOPIC NATURE在凹槽、小孔、裂纹和其在凹槽、小孔、裂纹和其他表面微观缺陷上沉积镀他表面微观缺陷上沉积镀层的能力层的能力.71Why Acid Copper ? Why Acid Copper ? 为何用酸铜？为何用酸铜？Provides Leveling of Scratches将砂痕印填平将砂痕印填平DgTgTsGood LevelingMicrothrow好的填平好的填平 及微观均镀及微观均镀Poor/No Leveling差差/无填平无填平% Leveling = Tg- Ts x 100 Dg72Wh

55、y Acid Copper ? Why Acid Copper ? 为何用酸铜为何用酸铜Provides A Bright, Easy to Buff Surface for Coverage of Very Minor Blemishes in Castings, Aluminum or Plastic 提供一个光亮的、电镀后容易抛光覆盖压铸件提供一个光亮的、电镀后容易抛光覆盖压铸件,铝材或塑料表面铝材或塑料表面的微小缺陷的镀层的微小缺陷的镀层.Bright Surface That Requires Little/No Buffing少少/ 不要求抛光的光亮表面不要求抛光的光亮表面.Lon

56、g Term Protection Against Corrosion长期耐蚀长期耐蚀Microscopic Section Of A Porous Casting. Plating Has Bridged Surface Pores多孔压铸件的横截面图，电镀镀层覆盖了多孔压铸件的横截面图，电镀镀层覆盖了表面表面的微孔的微孔.SpotsSurface Pores表面微孔表面微孔73TYPICAL BATH FORMULATIONTYPICAL BATH FORMULATION传统的槽液配方及条件传统的槽液配方及条件bCopper Sulfate 硫酸铜硫酸铜bSulfuric Acid 硫酸硫

57、酸bChloride 氯离子氯离子bUltra Agents 添加剂添加剂bTemperature 温度温度bAnode Current Density 阳极电流密度阳极电流密度bCathode Current Density 阴极电流密度阴极电流密度20-32 oz/gal (150 - 240 g/l)6-12 oz/gal (45 - 90 g/l)20 - 120 ppm (mg/l)As Recommended72 - 90F (22 - 32C)15 - 30 AS (1.5 - 3.0 A/dm2)20 - 80 A/Ft2 (2.0 - 8.0 A/dm2)74BATH CHE

58、MISTRYBATH CHEMISTRY槽液化学物槽液化学物bCuSO4 Cu+ + SO4= Cathode Anode阴极阴极阳极阳极bH2SO4 2H+ + SO4=CathodeAnode阴极阴极阳极阳极bHCl H+ + Cl-Cathode Anode75Acid Copper PlateAcid Copper Plate酸铜电镀酸铜电镀Key Ingredients 关键成份关键成份:Copper Sulfate 硫酸铜硫酸铜180-225 g/LSulfuric Acid 硫酸硫酸45-90 g/L76Acid Copper PlateAcid Copper Plate酸铜电镀

59、酸铜电镀Other Ingredients 其它成份其它成份:Chloride 氯化物氯化物80-120 mg/LUltra mu 开缸剂开缸剂8-10 ml/LUltra A 添加剂添加剂0.3-0.5 ml/LUltra B 添加添加剂0.3-0.5 ml/L77COPPER SULFATE COPPER SULFATE 硫酸铜硫酸铜bbHIGH CONC.高浓度高浓度LOSS OF BRIGHTNESS AND LEVELING光亮度光亮度和填平性能的减少和填平性能的减少 ,并并且阳极易结晶、钝化且阳极易结晶、钝化 240 g/lbbLOW CONC.低浓度低浓度LOSS IN LEVE

60、LING AND BATH CONDUCTIVITY槽液导槽液导电性和填平性能的减少电性和填平性能的减少 113 g/l78Function of Ingredients Function of Ingredients 各成份的功能各成份的功能At 113 gL At 285 g/LLow copper content can cause reduced leveling, slow deposition, and a narrow current density range铜含量低将减少填平性能、沉积慢和电流密度铜含量低将减少填平性能、沉积慢和电流密度范围窄范围窄.Concentration

61、s 248 g/L copper sulfate may produce crystals on tank walls, and anode bags, yielding rough deposits, and poor anode corrosion.硫酸大于硫酸大于248g/L会在槽壁中、阳极袋中产生会在槽壁中、阳极袋中产生结晶结晶,引起粗糙的沉积和阳极溶解不好引起粗糙的沉积和阳极溶解不好.79Low Copper SulfateLow Copper Sulfate低硫酸铜低硫酸铜The Hull Cell indicates that at 113 g/L Copper Sulfate

62、a deposit that is burned at very high current densities is produced.赫氏槽实验显示赫氏槽实验显示113g/L浓度下的硫浓度下的硫酸铜液中沉积的金酸铜液中沉积的金属在高电流密度下属在高电流密度下出现烧焦的情况出现烧焦的情况80SULFURIC ACID SULFURIC ACID 硫酸硫酸bGRAIN REFINEMENT晶粒细化晶粒细化bSOLUTION CONDUCTIVITY溶液导电溶液导电bREDUCES ANODE POLARIZATION减少阳极极化减少阳极极化bIMPROVES THROWING POWER提高均镀

63、能力提高均镀能力81SULFURIC ACID SULFURIC ACID 硫酸硫酸HIGH CONC.HIGH CONC.高浓度高浓度高浓度高浓度b INCREASED ANODE CORROSION增加阳极溶解增加阳极溶解b INCREASE IN COPPER CONTENT铜含量增加铜含量增加LOW CONC.LOW CONC.低浓度低浓度低浓度低浓度b HCD BURNING高电流密度烧焦高电流密度烧焦b NODULATION结瘤结瘤b POOR LEVELINGb填平差填平差b DULLNESS颜色暗颜色暗82Function of IngredientsFunction of I

64、ngredients各成份的作用各成份的作用180 g/L Sulfuric Acid = high current density area burning and anode passivation.浓度大于浓度大于180g/L的硫酸会使高电的硫酸会使高电流密度区烧焦，并使阳极钝化。流密度区烧焦，并使阳极钝化。Concentrations 120 ppm光亮度及填平度降低光亮度及填平度降低bSTRIATION起条纹起条纹bNODULATION起块起块起块起块LOW CONC.LOW CONC.低浓度低浓度 bDULLNESS IN HCD AREA高电流密度区颜色发暗高电流密度区颜色发暗b

65、POOR LEVELING填平差填平差bPOOR ANODE CORROSION阳极溶解差阳极溶解差87The Chloride Helps Anodes Dissolve And Works With Brightener For Full Brightness And Leveling氯化物帮助阳极溶解，氯化物帮助阳极溶解，并与光亮剂配合以增加并与光亮剂配合以增加光亮度和填平效果光亮度和填平效果Effect of Chloride ConcentrationEffect of Chloride Concentration氯化物浓度的影响氯化物浓度的影响0 ppm50 ppm 375 ppm

66、88Effect of Chloride ConcentrationEffect of Chloride Concentration氯化物浓度的影响氯化物浓度的影响Hull Cell Plated With Chloride at 150 ppm氯化物含量为氯化物含量为150ppm的赫氏槽电镀片的赫氏槽电镀片Dull At HighCurrent Density高密度区颜色暗高密度区颜色暗89Effect of Chloride ConcentrationEffect of Chloride Concentration氯化物浓度的影响氯化物浓度的影响Low (15 ppm) Chloride

67、低氯离子浓度低氯离子浓度 (15ppm）Streaky “Rippled” Deposit条纹状的条纹状的“波纹波纹”沉积沉积90Chloride Chloride vsvs Anode Appearance Anode Appearance氯化物与阳极外观氯化物与阳极外观Hull Cell Anode赫氏槽阳极赫氏槽阳极Normal Anode Appearance正常的阳极外观正常的阳极外观White Film = High Chloride白膜白膜=高氯离子高氯离子91Additives Additives 添加剂添加剂Panel Plated In Solution With No A

68、dditives没有使用添加剂的电镀试片没有使用添加剂的电镀试片 EK- C EK- BMELEKTRA III 92Additives Additives 添加剂添加剂Panel Plated In Solution With Panel Plated In Solution With No AdditivesNo Additives Add. 1 Add. 2Additives添加剂添加剂 Hull Cell Panel With High Current Density Burn高电流密度烧焦的赫氏槽片高电流密度烧焦的赫氏槽片93AdditivesAdditives添加剂添加剂Panel

69、 Plated In Solution With Panel Plated In Solution With No AdditivesNo Additives Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive添加剂添加剂 Hull Cell Plated, With Add. 1 1.0% , Add 2 0.25% 赫氏槽电镀，赫氏槽电镀，1.0%的添加剂的添加剂1，0.25%的的添加剂添加剂294Additives Additives 添加剂添加剂Panel Plated In Solution With Panel Plated In Solution With N

70、o AdditivesNo Additives Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive 添加剂添加剂 Low Add.2 Concentration (0.1% /Volume)添加剂添加剂2低浓度（低浓度（0.1%，体积百分比），体积百分比）95Additives Additives 添加剂添加剂 Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive添加剂添加剂High Add. 2 (1.0%/ Volume)添加剂添加剂2高浓度（高浓度（1.0%，体积百分比），体积百分比）Dull & Lumpy暗且粗糙暗且粗糙96Additives A

71、dditives 添加剂添加剂 Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive 添加剂添加剂 Panel Plated in Solution With Add. 1 At 1.5%/ Volume溶液中含溶液中含1.5%（体（体积百分比）的添加剂积百分比）的添加剂1的电镀片的电镀片Small Loss ofBrightness光亮度稍有降低光亮度稍有降低97CONTAMINANTS CONTAMINANTS 杂质杂质bIRON铁铁bZINC锌锌bCHROMIUM铬铬 bALUMINUM铝铝bORGANICS有机物有机物bWETTING AGENTS润湿剂润湿剂bIMP

72、ROPER FILTER MEDIA不适当的过滤杂质不适当的过滤杂质bNICKEL镍镍98CONTAMINANTS CONTAMINANTS 杂质杂质IRONIRON 铁铁铁铁bHIGH TOLERANCE UP TO 2.3 g/l高容忍度，可高达高容忍度，可高达2.3g/lbDECREASES PLATING SPEED降低电镀速度降低电镀速度bREDUCES COPPER SULPHATE SOLUBILITY减少硫酸铜的可溶性减少硫酸铜的可溶性bBUILDS COPPER SULPHATE IN BATH在槽液中置换硫酸铜在槽液中置换硫酸铜99CONTAMINANTS CONTAMIN

73、ANTS 杂质杂质ZINC 锌锌bHIGH TOLERANCE UP TO 2.3 g/l高容忍度，可高达高容忍度，可高达2.3g/lbREDUCES CHLORIDES氯化物减少氯化物减少bREDUCES COPPER SULPHATE SOLUBILITY降低了硫酸铜的可溶性降低了硫酸铜的可溶性降低了硫酸铜的可溶性降低了硫酸铜的可溶性100CONTAMINANTS CONTAMINANTS 杂质杂质NICKEL 镍镍bHIGH TOLERANCE UP TO 2.3 g/l高容忍度，可高达高容忍度，可高达2.3g/lbREDUCES COPPER SULPHATE SOLUBILITY降低

74、了硫酸铜的可溶性降低了硫酸铜的可溶性降低了硫酸铜的可溶性降低了硫酸铜的可溶性101CONTAMINANTS CONTAMINANTS 杂质杂质CHROMIUM Cr6+OVER 100 PPM六价铬六价铬超过超过100PPMbOXIDIZES BRIGHTENERS氧化光亮剂氧化光亮剂bBURNING烧焦烧焦bSKIP PLATING漏镀漏镀bSTRIATIONS 条纹条纹bPOOR ADHESION结合力差结合力差结合力差结合力差102CONTAMINANTS CONTAMINANTS 杂质杂质FILTER MEDIA - IMPROPERFILTER MEDIA - IMPROPER过滤介

75、质过滤介质过滤介质过滤介质 不适当的不适当的不适当的不适当的b L.C.D. DULLNESS低密度区发暗低密度区发暗b ROUGHNESS, SPECKLING粗糙粗糙粗糙粗糙/ /毛刺、麻点毛刺、麻点毛刺、麻点毛刺、麻点bUSE DIATOMACEOUS EARTH - ONLY使用硅藻土使用硅藻土使用硅藻土使用硅藻土 只能使用它只能使用它只能使用它只能使用它103Inorganic Impurities Inorganic Impurities 无机杂质无机杂质Good Tolerance 好的容忍度好的容忍度At concentrations 1000 mg/L, iron and n

76、ickel may reduce the electrolyte conductivity and throwing power浓度大于浓度大于1000mg/L时，铁和镍会减少电解液的导电性和均镀时，铁和镍会减少电解液的导电性和均镀能力能力Hull Cell Panel Plated In Acid Copper Containing 1,000 ppm Zinc含含1000ppm锌的酸铜液中镀出来的赫氏片锌的酸铜液中镀出来的赫氏片104Organic ImpuritiesOrganic Impurities有机杂质有机杂质Can produce dull appearance in low

77、current density areas 在低密度区会产生暗的外观在低密度区会产生暗的外观Sources来源来源:Tank linings 缸的内衬缸的内衬, Row material 原材料原材料, Plastic Mandrels 塑料填充物塑料填充物, Brightener Breakdown Products 光亮剂的分解物光亮剂的分解物 Treatment处理处理:Activated Carbon removes organics活性碳活性碳In some cases a hydrogen peroxide treatment may also be required.双氧水双氧水

78、105CONTAMINANTS CONTAMINANTS 杂质杂质ORGANICORGANIC有机物有机物有机物有机物bPITTING 针孔针孔bDULLNESS发暗发暗bCOARSE GRAINED DEPOSIT 镀层结晶粗糙镀层结晶粗糙bBURNING 烧焦烧焦bSTRIATION条纹条纹b LOSS OF LEVELING 填平差填平差106Organic Impurities Organic Impurities 有机杂质有机杂质Carbon Treatment 碳处理碳处理bMove Solution To Separate Treatment Tank把溶液移入独立的处理槽把溶液

79、移入独立的处理槽bAdd 3-12 g/L Activated Carbon加加3-12g/L的活性碳的活性碳bAgitate Thoroughly充分搅拌充分搅拌bAllow To Settle 2 hours (but not too long, 8 hours max.)静置静置2小时（不要太长，最多小时（不要太长，最多8小时）小时）bTransfer To Second Treatment Tank, Test For Presence of Carbon转入第二个槽，测试是否还含有碳粉转入第二个槽，测试是否还含有碳粉.bIf Carbon Free, Transfer Back To

80、 Plating Tank如果没有碳粉了，则泵回原来的电镀槽如果没有碳粉了，则泵回原来的电镀槽.107Oxidation Treatments Oxidation Treatments Oxidation Treatments Oxidation Treatments 氧化处理氧化处理氧化处理氧化处理Hydrogen Peroxide Hydrogen Peroxide 双氧水双氧水双氧水双氧水 Oxidize Complex Organics Oxidize Complex Organics 氧化复杂的有机物氧化复杂的有机物氧化复杂的有机物氧化复杂的有机物 1mL/L (35% H1mL/L

81、 (35% H22OO22) ) Dilute 50% Before Adding Dilute 50% Before Adding 添加前稀释添加前稀释添加前稀释添加前稀释50%50%Potassium Permanganate Potassium Permanganate 高锰酸钾高锰酸钾高锰酸钾高锰酸钾 Amount Required Varies Amount Required Varies 需要的加入量是变化需要的加入量是变化需要的加入量是变化需要的加入量是变化的的的的; ; Determine with Hull Cell Determine with Hull Cell 用赫氏槽

82、方法决定用赫氏槽方法决定用赫氏槽方法决定用赫氏槽方法决定; ;108Actual Current Density Depends On The Distance Between A Spot On The Part And The Anode真实的电流密度决定于工件上真实的电流密度决定于工件上A点和阳点和阳极间的距离极间的距离.Cathode Current Density (CCD)Cathode Current Density (CCD)阴极电流密度阴极电流密度109Cathode Current Density (CCD)Cathode Current Density (CCD)阴极电流

83、密度阴极电流密度High Current Density Area高电流密度区高电流密度区Medium Current Density Area中电流密度区中电流密度区Low Current Density Area低电流密度区低电流密度区Average CCD = Amperes of Current Area in Square Feet平均的阴极电流密度平均的阴极电流密度=平方英尺面积的安培数平方英尺面积的安培数110Plating Thickness Calculation Plating Thickness Calculation 镀层的厚度计算镀层的厚度计算Thickness (m

84、ils) = A/ft2 x Hours厚度厚度 (密尔密尔) 17.8If amps/ft2 = 15, and plating time is 20 minutes (0.33 hours), then the thickness will be: 如果安培如果安培/平方英尺平方英尺=15，电镀时间为，电镀时间为20分钟（分钟（0.33小时），则厚度为：小时），则厚度为： Thickness (mils) = 15 x 0.33 = 0.28 mils 厚度厚度 17.8 (0.00028) )111Plating Time CalculationPlating Time Calculat

85、ion电镀时间的计算电镀时间的计算Calculating Plating Time 计算电镀时间计算电镀时间:If we want 20u of thickness, plating at 3 A/dm2:如果我们想得到如果我们想得到20u的厚度的厚度,在在3 A/dm2下电镀：下电镀：Thickness (u) = A/dm2 x min x 0.2厚度厚度 20u = 3A/dm2 x 33.3 min x 0.2 112Medium Agitation中搅拌中搅拌Low Agitation低搅拌低搅拌Agitation Level Agitation Level 搅拌程度搅拌程度113A

86、gitation Level Agitation Level 搅拌程度搅拌程度Panel Plated With No Agitation无搅拌的电镀片无搅拌的电镀片114Anodes for Acid Copper PlatingAnodes for Acid Copper Plating用于酸铜电镀的阳极用于酸铜电镀的阳极Phosphorized 磷铜磷铜(0.02-0.06%P) rolled copper anodes or phosphorized slugs含含P 0.02-0.06%的磷铜的磷铜球球/块块115COPPER ANODES COPPER ANODES 铜阳极铜阳极A

87、NODESANODES WITH 0.02 - 0.065 % P WITH 0.02 - 0.065 % P 含含0.02 0.065%磷的磷铜阳极磷的磷铜阳极bROUGHNESS毛刺毛刺bHIGH BRIGHTENER CONSUMPTION 光亮剂消耗量大光亮剂消耗量大bPOOR LEVELING填平差填平差填平差填平差bPOOR ANODE CORROSION阳极溶解不好阳极溶解不好阳极溶解不好阳极溶解不好116COPPER ANODES COPPER ANODES 铜阳极铜阳极117ANODE BASKETS ANODE BASKETS 阳极篮阳极篮Anodes baskets sh

88、ould be 3-5 inches shorter than the longest rack being plated. 阳极钛篮应该比最长的电阳极钛篮应该比最长的电镀挂具短镀挂具短3-5英寸英寸.Partially Filled Titanium Anode Basket 没有装满磷铜的没有装满磷铜的阳极钛篮阳极钛篮.118ANODE BAGS ANODE BAGS 阳极袋阳极袋Bag The Anodes Using Dynel Or Napped Polypropylene Bags (8 oz/yd2). 使用代纳尔合成纤维使用代纳尔合成纤维或聚丙烯材料做阳极或聚丙烯材料做阳极袋袋

89、.Loose Fit Is Best!稍松的填装最好！稍松的填装最好！Tops of Bags Need To Be ABOVE Liquid Level!阳极袋的封口须高于液面！阳极袋的封口须高于液面！119ANY QUESTIONS ?ANY QUESTIONS ?有问题吗？有问题吗？120NICKEL PLATINGNICKEL PLATING镀镍镀镍121HISTORY OF NICKEL PLATINGHISTORY OF NICKEL PLATING电镀镍的历史电镀镍的历史b1840 - Joseph Shore applied for first patent 1840年, Jo

90、seph Shore申请了第一个专利.b1842 - Bottger - used nickel ammonium salt 1842年，Bottger使用了胺盐镍b1849 - Roseleur - good nickel deposit 1849年， Roseleur得到了良好的镍镀层b1869 - Adams - US. patent - 93,157 with ammonium salts 1869年， Adams申请了胺盐镀镍的专利（美国专利号：93,157）122HISTORY OF NICKEL PLATINGHISTORY OF NICKEL PLATING镀镍的历史b1878

91、 - Weston - U. S. patent - 211,071 using boric acid 申请了硼酸镀镍的专利（美国专利211,071）b1906 - Bancroft - use of chlorides 使用氯化物b1916 - O. P. Watts - the first standard formulation for high current density 第一个高电流密度的槽液标准配方b1936 - Schlotter - first real bright nickel plating process 第一次真正的光亮镍电镀工艺b1945 - Harshaw -

92、 U. S patent for semi-bright using coumarin 香豆素用于镀半光亮镍申请了美国专利123NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺TYPES OF NICKEL SOLUTIONS.TYPES OF NICKEL SOLUTIONS.镍溶液的种类镍溶液的种类镍溶液的种类镍溶液的种类bNICKEL STRIKE (WOODS) 预镀预镀镍（镍（WOODS）bNICKEL STRIKE (WATTS)预镀镍（预镀镍（WATTS）bSEMI BRIGHT NICKEL 半光亮镍半光亮镍bHIGH SULFUR NICKEL S

93、TRIKE 高硫镍高硫镍bBRIGHT NICKEL 光亮镍光亮镍bMICROPOROUS NICKEL 微孔镍（镍封）微孔镍（镍封）bNOBLE NICKEL 电位较正的镍层电位较正的镍层bNICKEL SULPHAMATE 氨基磺酸镍氨基磺酸镍bELECTROLESS NICKEL 化学沉镍化学沉镍124PLATING DISTRIBUTION PLATING DISTRIBUTION 电镀分布电镀分布CATHODE 阴极阴极 ANODE 阳极阳极125NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺TYPES OF NICKEL SOLUTIONS.镍溶液的种

94、类镍溶液的种类NICKEL STRIKE( WOODS )REASON FOR USE.使用的原因使用的原因bINITIAL NICKEL LAYER FOR ADHESION. 用于用于加强结合力的起始镍层加强结合力的起始镍层bACTIVATION FOR PLATING ON STAINLESS STEEL AND REPLATES 为在不锈钢上电镀和返为在不锈钢上电镀和返镀进行的活化镀进行的活化bLOW pH 1.0 低低pH 值，值， pH 1.0126NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺TYPES OF NICKEL SOLUTIONS.镍溶液

95、的种类镍溶液的种类NICKEL STRIKE ( WOODSWOODS )SOLUTION COMPOSITIONSOLUTION COMPOSITION镀液的组成镀液的组成镀液的组成镀液的组成bNICKEL CHLORIDE 氯化镍氯化镍 - 240 g/lbHYDROCHLORIC ACID 盐酸盐酸-10-15 %/vol.体积比体积比bBORIC ACID 硼酸硼酸 - 15 - 22 g/lbpH 酸碱度酸碱度 - 1.0bTEMPERATURE温度温度 - ROOM室温室温bCATHODE CURRENT DENSITY 阴极电流密度阴极电流密度 10-100 asf（）bANOD

96、E CURRENT DENSITY 阳极电流密度阳极电流密度 30 asf bAGITATION 搅拌搅拌 NONE不需要不需要127NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺TYPES OF NICKEL SOLUTIONS镍溶液的种类镍溶液的种类NICKEL STRIKE( WATTSWATTS) REASON FOR USEREASON FOR USE. .使用的原因使用的原因使用的原因使用的原因bINITIAL NICKEL LAYER FOR ADHESION.用于加强结用于加强结合力的起始镍层合力的起始镍层bGOOD FOR REPLATES AD

97、HESION.对返镀的结合力对返镀的结合力有帮助有帮助bPREVENTS BUILD UP OF IRON IN SEMI BRIGHT NICKELS. 防止在半光亮镍中铁杂质的累积防止在半光亮镍中铁杂质的累积bGOOD COVERAGE AT VARIOUS CURRENT DENSITIES. 在各种电流密度下均有良好的覆盖在各种电流密度下均有良好的覆盖bpH RANGES FROM 2.0 - 4.0 酸碱度在酸碱度在2.0-4.0之间之间128NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺TYPES OF NICKEL SOLUTIONS.镍溶液的种类镍

98、溶液的种类NICKEL STRIKE ( WATTS )WATTS )SOLUTION COMPOSITIONSOLUTION COMPOSITION镀液的组成镀液的组成镀液的组成镀液的组成bNICKEL SULPHATE 硫酸镍硫酸镍 - 150- 450 g/lbNICKEL CHLORIDE 氯化镍氯化镍- 37-150 g/lbBORIC ACID 硼酸硼酸 - 37- 57 g/lbpH 酸碱度酸碱度 - 2 - 4bTEMPERATURE 温度温度 - 50 - 70CbCATHODE CURRENT DENSITY 阴极电流密度阴极电流密度 10- 60 asfbANODE CU

99、RRENT DENSITY 阳极电流密度阳极电流密度 20 asf bAGITATION 搅拌搅拌 MILD AIR 轻微打气轻微打气129NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺TYPES OF NICKEL SOLUTIONS. 镍溶液的种类镍溶液的种类SEMI BRIGHT SEMI BRIGHT NICKEL 半光亮镍半光亮镍REASON FOR USE. 使用的原因使用的原因bCORROSION PROTECTION 防腐防腐bHIGH LEVELING 高填平高填平bVERY DUCTILE 延展性好延展性好bCOLUMNAR STRUCTURE

100、 柱状结构柱状结构bNOBLE DEPOSIT 镀层电位较正镀层电位较正bSULFUR FREE DEPOSIT含硫量低至含硫量低至 500 500 PPMPPMbPRECIPITATE AS CALCIUM SULPHATE作为硫酸钙沉淀作为硫酸钙沉淀bNEEDLE LIKE CRYSTALS, CAUSES ROUGHNESS形成像晶体一样的针状物，会导致粗糙毛刺形成像晶体一样的针状物，会导致粗糙毛刺bCLOGS UP AIR LINES 堵塞空气管堵塞空气管bINTRODUCED FROM HARD WATER 由硬水引起由硬水引起REMEDYREMEDY补救补救补救补救bUSE DEI

101、ONIZED WATER 用去离子水用去离子水bHIGH TEMP FILTRATION 用高温过滤器用高温过滤器bSODIUM BIFLUORIDE TREATMENT 用氟化钠处理用氟化钠处理163NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺EFFECT OF METALLIC IMPURITIES金属杂质的影响金属杂质的影响ALUMINIUM 铝铝 50 PPMbDULLNESS 发暗发暗bROUGHNESS 粗糙粗糙bSPONGY DEPOSITS 海绵状的沉积海绵状的沉积REMEDY补救补救bHIGH pH TREATMENT 高酸碱度下处理高酸碱度下

102、处理164NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺ORGANIC IMPURITIES有机杂质有机杂质TYPESTYPES种类种类种类种类bGREASE AND OIL 油脂油脂bBUFFING COMPOUND 抛光腊抛光腊bDRAWING COMPOUNDS 油墨类油墨类bINADEQUATELY DE-SIZED ANODE BAGS 阳极袋的阳极袋的填充料填充料bEXCESS ADDITION AGENTS 过多的添加剂过多的添加剂bBRIGHTENER BREAKDOWN PRODUCTS光亮剂分解产物光亮剂分解产物REMEDYREMEDY补救补救

103、补救补救bCARBON, PEROXIDE TREATMENT碳、过氧化物处理碳、过氧化物处理165NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺CARBON PEROXIDE TREATMENT碳、过氧化物处理碳、过氧化物处理PROCEDUREPROCEDURE流程流程流程流程bCOOL SOLUTION TO 100-110F, ADD H2O2 ( 1ml/L )冷却溶液至冷却溶液至100-110F，添加添加H2O2 ( 1ml/L )bAGITATE SOLUTION FOR AT LEAST 2 HRS搅拌溶液至少搅拌溶液至少2小时小时b RAISE T

104、EMP TO 160F TO REMOVE EXCESS PEROXIDE升高温度至升高温度至160F ，除去多余的过氧化物除去多余的过氧化物bADD 0.5-0.7 Kg CARBON PER 100 L SOLUTION AND AGITATED FOR AT LEAST 2 HRS.每每100L溶液加溶液加0.5-0.7Kg碳，搅拌至少碳，搅拌至少2小时小时bALLOW SOLUTION TO SETTLE 将溶液静置将溶液静置bFILTER AID ADDED TO MAINTAIN EVEN FLOW RATE (0.1Kg /100 L) 加入过滤介质加入过滤介质0.1Kg/100

105、L，慢速过滤慢速过滤bPUMPED BACK TO PLATING TANK用泵将之抽回电镀槽中用泵将之抽回电镀槽中bADJUST pH AND ADD ADDITION AGENTS调节酸碱度，加入添加剂调节酸碱度，加入添加剂166NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺PHYSICAL AND MECHANICAL PROPERTIES物理及机械特性物理及机械特性DUCTILITYDUCTILITY延展性延展性延展性延展性bVERY IMPORTANT, POOR DUCTILITY CAN LEAD TO POOR CORROSION PROTECTI

106、ON (i.e. BOLT HOLE CRACKING, STRESS)非常重要，差的延展性会导致差的防腐（如瓶口有裂纹、应力）非常重要，差的延展性会导致差的防腐（如瓶口有裂纹、应力）bLOW DUCTILITY IS USUALLY A SIGN OF BATH CONTAMINATION低延展性通常表示镀槽中含污染物低延展性通常表示镀槽中含污染物bTESTED BY BENDING, CHRYSLER METHOD (T/2R) (ASTM-B-490)用用CHRYSLER公司公司的方法弯曲实验测试的方法弯曲实验测试(T/2R) (见见ASTM-B-490)bBRIGHT NICKEL 光

107、亮镍光亮镍0.1 AS T/2RbSEMI BRIGHT半光亮镍半光亮镍 0.5 AS T/2R167NICKEL PROCESS NICKEL PROCESS 镀镍工艺镀镍工艺PHYSICAL AND MECHANICAL PROPERTIES物理及机械特性物理及机械特性INTERNAL STRESSINTERNAL STRESS内应力内应力内应力内应力bELECTRODEPOSITED METALS ARE IN A STRESSED CONDITION 电沉积金属是在应力条件下沉积的电沉积金属是在应力条件下沉积的bNICKELS CAN BE TENSILE i.e. SEMI-BRIG

108、HT镍会是张应力，如：镍会是张应力，如：半光亮镍半光亮镍bNICKELS CAN BE COMPRESSIVE i.e. BRIGHTS镍也会是压应力，镍也会是压应力，如：光亮镍如：光亮镍bORGANIC ADDITIVES GREATLY AFFECT INTERNAL STRESS有有机添加剂极大地影响着内应力机添加剂极大地影响着内应力bORGANIC AND METALLIC IMPURITIES AFFECT INTERNAL STRESS有机和金属杂质也影响了内应力有机和金属杂质也影响了内应力bMEASURED BY SPIRAL CONTRACTOMETER用螺旋应力仪测量用螺旋应

109、力仪测量bSEMI BRIGHT 5,000-25,000 PSI TENSILE半光亮镍张应力为半光亮镍张应力为5,000-25,000 PSI bBRIGHT NICKEL 5,000-20,000 PSI COMPRESSIVE光亮镍压应力为光亮镍压应力为5,000-20,000 PSI 168NICKEL PROCESSNICKEL PROCESS镀镍工艺镀镍工艺PHYSICAL AND MECHANICAL PROPERTIES物理及物理及机械特性机械特性ADHESIONADHESION附着力附着力附着力附着力bPERFECT BOND STRENGTH SHOULD BE ACHI

110、EVED TO ENSURE GOOD QUALITY确保好的品质，必须有很好的结合力确保好的品质，必须有很好的结合力bPOOR ADHESION CAUSED BY: SURFACE FILMS, OIL GREASE, OXIDES, BI-POLARITY, HEXAVALENT CHROMIUM, COPPER IMMERSION, POOR CLEANING, BROKEN ELECTRICAL CONTACTS, CURRENT INTERRUPTION差的附着强度的出现原因有：表面的膜层、油脂、氧化差的附着强度的出现原因有：表面的膜层、油脂、氧化物、双极性、六价铬、置换铜、清洗不

111、够、电接触不良、物、双极性、六价铬、置换铜、清洗不够、电接触不良、电流中断电流中断169NICKEL PROCESSNICKEL PROCESS镀镍工艺镀镍工艺CORROSION PROTECTION防腐防腐HOW THE SYSTEM WORKS系统如何工作系统如何工作bSULFUR FREE SEMI BRIGHT 无硫半光镍无硫半光镍( 0.005% wt) THICKNESS 厚度厚度- 0.0008 - 0.0012 in.bHIGH SULFUR STRIKE 高硫镍高硫镍(0.1- 0.2% wt ) THICKNESS厚度厚度 - 0.0001 in.bBRIGHT NICKE

112、L光亮镍光亮镍 ( 0.04- 0.08 % wt ) THICKNESS 厚度厚度- 0.0003 - 0.0006 in.bMICRODISCONTINUOUS NICKEL 微孔镍微孔镍 ( MORE NOBLE THAN BRIGHT 电位比光电位比光亮镍正亮镍正)bCHROMIUM 铬铬(8 TO 20 MILLIONTHS)170NICKEL PROCESSNICKEL PROCESS镀镍工艺镀镍工艺CORROSION PROTECTION防腐防腐HOW THE TRIPLEX SYSTEM WORKSHOW THE TRIPLEX SYSTEM WORKS三层镍系统如何工作三层镍

113、系统如何工作bSULFUR CONTAINING LAYER CORRODE LATERALLY FASTER THEN THE OTHER NICKEL DEPOSITS含硫镀层（高硫镍）其横向腐蚀速度比其它镍层快含硫镀层（高硫镍）其横向腐蚀速度比其它镍层快bMICRODISCONTINUOUS NICKEL INDUCES MICROPOROSITY IN CHROMIUM LAYER WHICH SPREADS THE CORROSION MECHANISM OVER THE ENTIRE SURFACE微孔镍导致铬层出现微孔，从而将腐蚀分散到整个表面微孔镍导致铬层出现微孔，从而将腐蚀分

114、散到整个表面上，而不会集中在某一点上，而不会集中在某一点bSEMI BRIGHT NICKELS CORRODE THE SLOWEST 半光亮镍的腐蚀最慢半光亮镍的腐蚀最慢171NICKEL CORROSION ON PLASTICNICKEL CORROSION ON PLASTIC塑料上的镍腐蚀塑料上的镍腐蚀SINGLE LAYER NICKEL COATING单层镍单层镍BRIGHT NICKEL光亮镍光亮镍COPPER铜CHROMIUM铬铬CORROSION SITE腐蚀点腐蚀点Pd/Sn LAYER钯钯/锡层锡层Cu-Link172NICKEL CORROSION ON PLAST

115、ICNICKEL CORROSION ON PLASTIC塑料上的镍腐蚀塑料上的镍腐蚀DOUBLE LAYER NICKEL COATING双层镍双层镍BRIGHT NICKEL光亮镍光亮镍COPPER铜CHROMIUM铬铬CORROSION SITE腐蚀点腐蚀点SEMI BRIGHT NICKEL半光半光亮镍亮镍DUPLEX SYSTEM双层系统双层系统ABS/PC PLASTIC塑料塑料Cu-LinkPd/Sn LAYER钯钯/锡层锡层173NICKEL CORROSION ON PLASTICNICKEL CORROSION ON PLASTIC塑料上的腐蚀塑料上的腐蚀TRIPLE LA

116、YER NICKEL COATING三层镍三层镍BRIGHT NICKEL光亮镍光亮镍CHROMIUM铬铬CORROSION SITE腐蚀点腐蚀点SEMI BRIGHT NICKEL半光半光亮镍亮镍TRIPLEX SYSTEM三层镍系统三层镍系统HIGH SULFUR LAYER高硫镍高硫镍ABS/PC PLASTIC塑料塑料Pd/Sn LAYER钯钯/锡层锡层Cu-LINK LAYER174NICKEL CORROSION ON PLASTICNICKEL CORROSION ON PLASTIC塑料上的镍腐蚀塑料上的镍腐蚀MICRODISCONTINUOUS CHROMIUM WITH Q

117、UADRUPLE NICKEL COATING带四层镍的微间断镍涂层带四层镍的微间断镍涂层BRIGHT NICKEL光亮镍光亮镍CHROMIUM铬铬CORROSION SITESSEMI BRIGHT NICKEL半光半光亮镍亮镍QUADRUPLE SYSTEM四层镍四层镍HIGH SULFUR LAYER高硫镍高硫镍PARTICLE NICKEL镍封镍封COPPER铜铜ABS/PC LAYERCu-LINK LAYERPd/Sn LAYER钯钯/锡层锡层175NICKEL CORROSION ON ALUMINUMNICKEL CORROSION ON ALUMINUM铝上的镍腐蚀铝上的镍腐

118、蚀MICRODISCONTINUOUS CHROMIUM WITH QUADRUPLE NICKEL COATING带四层镍的微间断铬涂层带四层镍的微间断铬涂层BRIGHT NICKEL光亮镍光亮镍COPPERCHROMIUM铬铬CORROSION SITES腐蚀点腐蚀点SEMI BRIGHT NICKEL光亮光亮镍镍QUADRUPLE SYSTEM四层镍系统四层镍系统HIGH SULFUR LAYER高硫层高硫层PARTICLE NICKEL镍封镍封ALUMINUM铝铝176NICKEL PROCESSNICKEL PROCESS镀镍工艺镀镍工艺S.T.E.P. TESTWHAT IS IT

119、 ?它是什么？它是什么？bSIMULTANEOUS同步的同步的 THICKNESS厚度厚度 AND ELECTROCHEMICAL电化学电化学 POTENTIAL电位电位bMEASURE THICKNESS & POTENTIAL DIFFERENCE BETWEEN NICKEL LAYERS AT THE SAME TIME同时测量镍层之间的厚度和电位差同时测量镍层之间的厚度和电位差bTHE MILLIVOLT POTENTIAL DIFFERENCE BETWEEN SEMI AND BRIGHT SHOULD BE GREATER THAN 100 mv半光亮镍和光亮镍之间的半光亮镍和

120、光亮镍之间的电位电位差应该超过差应该超过100mv177ANY QUESTIONS ?ANY QUESTIONS ?有问题吗？有问题吗？178DECORATIVE CHROMIUM DECORATIVE CHROMIUM PLATINGPLATING装饰铬电镀装饰铬电镀179CHROMIUM PLATING CHROMIUM PLATING 电镀铬电镀铬WHY DO WE CHROME PLATE ?为何电镀铬为何电镀铬bCHROMIUM IS APPLIED AS THE FINAL COATING IN A DECORATIVE SYSTEM BECAUSE OF ITS HIGH TAR

121、NISH RESISTANCE在装饰性电镀里，铬由于耐变暗性而作为最后的镀层在装饰性电镀里，铬由于耐变暗性而作为最后的镀层bHARD DEPOSIT有硬度有硬度bTHICKNESS OF 0.1in. to 0.5 u.厚度在厚度在0.1 0.5 u之间之间bDURABILITY 经久耐用经久耐用180CHROMIUM PLATING CHROMIUM PLATING 电镀铬电镀铬STANDARD FORMULATION 标准配方标准配方CHROMIC ACID 铬酸铬酸 150-400g/lSULPHATE RADICAL 硫酸根硫酸根0.15- 0.40 g/lRATIO 比率比率 100

122、-400:1CATALYST(FLUORIDE) 0.3 - 1.0 g/l催化剂（氟化物）催化剂（氟化物）181CHROMIUM PLATING CHROMIUM PLATING 电镀铬电镀铬OPERATING CONDITIONS 操作条件操作条件bTEMPERATURE 温度温度 41 - 52CbCURRENT DENSITY 电流密度电流密度 0.5 - 2.5 A/in2bVOLTAGE 电压电压 4 - 25 vbANODES 阳极阳极 LEAD 铅铅(7% tin锡锡 )bPOWER SUPPLY 电源电源 D.C. 300 g/lb INCREASED CONDUCTIVIT

123、Y增加导电性增加导电性b LOWER VOLTAGE 降低电压降低电压bLOWER THROWING POWER降低均镀能力降低均镀能力bLOWER HARDNESS 降低硬度降低硬度bLOWER CATHODE EFFICIENCY降低阴极效率降低阴极效率 bLOW第第 22 g/l CAUSES INCREASED RESISTANCE TO A POINT THAT THE BATH SHUTS DOWN在电镀过程中形成的一种杂质，它能提高均在电镀过程中形成的一种杂质，它能提高均镀能力镀能力( 1 3.5 g/l ) 及及 22 g/l 电阻电阻将增加将增加到达槽液无法使用到达槽液无法使

124、用192FUNCTION OF FLUORIDE CATALYSTFUNCTION OF FLUORIDE CATALYST催化剂的作用催化剂的作用bCATALYST ( FLUORIDE, SILICOFLUORIDE IONS ) NECESSARY FOR THE REDUCTION REACTION OF CHROMIC ACID TO METALLIC CHROMIUM催化剂（催化剂（CR-843）对还原铬酸变成金属）对还原铬酸变成金属铬是必须的铬是必须的193FUNCTION OF MIST SUPPRESENTFUNCTION OF MIST SUPPRESENT抑雾剂的作用抑雾

125、剂的作用bCREATS A FOAM BLANKET TO REDUCE CHROME MISTING INTO THE AIR产生泡沫减少铬雾挥发到空气中产生泡沫减少铬雾挥发到空气中bREDUCES SURFACE TENSION OF THE PLATING BATH减少镀液的表面张力减少镀液的表面张力194EFFECTS OF CATALYST EFFECTS OF CATALYST 催化剂的影响催化剂的影响SULPHATE SULPHATE 硫酸盐硫酸盐bREDUCED CATHODE EFFICIENCY WITH CrO3:SO4 RATIO GREATER THAN 100:1

126、CrO3:SO4 比率增大超过比率增大超过100:1使阴极效率降低使阴极效率降低bREDUCED PLATING RANGE减少电镀范围减少电镀范围bBETTER THROWING POWER100/1更好的均镀能力更好的均镀能力100/1bHIGHER VOLTAGE 高电压高电压bREDUCED BURNING(HIGH) 减少烧焦（高）减少烧焦（高）195EFFECTS OF CURRENT DENSITYEFFECTS OF CURRENT DENSITY电流密度的影响电流密度的影响bBETTER RESULTS WITH HIGHER CURRENT DENSITY 1.4 A/in

127、2 较高的电流密度，如大于较高的电流密度，如大于1.4 A/in2时，结果会更好：时，结果会更好：- INCREASE CATHODE EFFICIENCY 增加阴极效率增加阴极效率- INCREASE THROWING POWER 增加均镀能力增加均镀能力- INCREASE DEPOSITION RATE 增加沉积速率增加沉积速率- INCREASED HARDNESS 增加硬度增加硬度196EFFECTS OF TEMPERATUREEFFECTS OF TEMPERATURE温度的影响温度的影响HIGHER 较高较高b USE HIGHER CURRENT DENSITIES使用较高的

128、电流密度使用较高的电流密度b LOWER THROWING POWER较低的均镀能力较低的均镀能力b REDUCED HARDNESS减少硬度减少硬度LOWER 较低较低b LOWER CURRENT DENSITY较低的电流密度较低的电流密度b HIGHER THROWING POWER较高的均镀能力较高的均镀能力b INCREASED HARDNESS增加硬度增加硬度197EFFECTS OF IMPURITIESEFFECTS OF IMPURITIES杂质的影响杂质的影响METALLIC ( CATIONS) 金属金属阳离子阳离子bTRIVALENT,IRON COPPER, NICK

129、EL, ALUMINIUM - INCREASED RESISTANCE, KEEP BELOW 22 g/l AS TOTAL METAL三价铁离子、铜、镍、铝三价铁离子、铜、镍、铝增增加电阻，总的金属离子杂质应加电阻，总的金属离子杂质应小于小于22g/l.NON METALLIC (ANIONS) 非金属阴离子非金属阴离子b CHLORIDES, NITRATES, PHOSPHATES - HAZES, REDUCED THROWING POWER, EFFICIENCY氯化物、硝酸盐、磷酸氯化物、硝酸盐、磷酸盐盐雾，减少了均镀能雾，减少了均镀能力和效率力和效率198WHAT IS MI

130、CRO-CRACKED CHROMIUM ?WHAT IS MICRO-CRACKED CHROMIUM ?什么是微裂纹铬？什么是微裂纹铬？bCHROMIUM DEPOSITS WITH FINE CRACKS OVER BRIGHT NICKEL FOR IMPROVED CORROSION PERFORMANCE为提高耐腐蚀表现，铬沉积在光亮镍上为提高耐腐蚀表现，铬沉积在光亮镍上并有细小的裂纹并有细小的裂纹.199MICROCRACKED CHROMIUMMICROCRACKED CHROMIUM微裂纹铬微裂纹铬X 375200WHAT IS MICRO- POROUS CHROMIUM

131、?WHAT IS MICRO- POROUS CHROMIUM ?什么是微孔铬？什么是微孔铬？bCHROMIUM DEPOSITED OVER A BRIGHT NICKEL STRIKE CONTAINING NON CONDUCTIVE SOLIDS TO IMPROVED CORROSION PERFORMANCE在含有非导电固体的光亮镍上沉积铬，在含有非导电固体的光亮镍上沉积铬，以提高耐腐蚀表现以提高耐腐蚀表现.201MICROPOROUS CHROMIUMMICROPOROUS CHROMIUM微孔铬微孔铬X 150202WHY USE MIST SUPPRESSANTS ?WHY

132、USE MIST SUPPRESSANTS ?为什么使用抑雾剂？为什么使用抑雾剂？bCHROME PLATING HAS POOR CATHODE EFFICIENCY (12 - 25% ) WHICH PRODUCES A LOT OF MISTING电镀铬的阴极效率差（电镀铬的阴极效率差（12-25%），产生了很多），产生了很多雾雾bTHEY REDUCE SURFACE TENSION THEREFORE REDUCING DRAG OUT它们减少了表面张力，因此也减少了带出损失它们减少了表面张力，因此也减少了带出损失.bFORMS A FOAM BLANKET ON TOP OF T

133、HE SOLUTION TO PREVENT MISTING在溶液上形成了一层泡沫层，以防止雾气挥发在溶液上形成了一层泡沫层，以防止雾气挥发203COMMON CHROMIUM PLATING PROBLEMSCOMMON CHROMIUM PLATING PROBLEMS电镀铬中的常见问题电镀铬中的常见问题 b CHROME BURNS IN THE HIGH CURRENT DENSITY AREA铬在高电流密度区烧焦铬在高电流密度区烧焦bPOOR CHROMIUM COVERAGE差的铬覆盖差的铬覆盖bHAZY, MILKY DEPOSITS暗的暗的,奶白色镀层奶白色镀层bWHITE W

134、ASH, STAINING水流痕水流痕,迹迹.204CHROMIUM PLATING CHROMIUM PLATING 电镀铬电镀铬PROBLEMS OCCURRING IN NICKEL TANK镍缸中的问题镍缸中的问题bORGANIC CONTAMINATION - POOR COVERAGEPOOR COVERAGE有机杂质有机杂质差的覆盖率差的覆盖率bMETALLIC CONTAMINATION BURNINGBURNING金属杂质金属杂质烧焦烧焦bGREASE, OIL - MILKY DEPOSITSMILKY DEPOSITS油脂油脂乳状沉积乳状沉积bHIGH NICKEL BR

135、IGHTENER - POOR COVERAGEPOOR COVERAGE高镍光亮剂高镍光亮剂差的覆盖率差的覆盖率bHIGH NICKEL WETTER - HAZY DEPOSITSHAZY DEPOSITS高镍湿润剂高镍湿润剂有雾状的沉积有雾状的沉积205CHROMIUM PLATING CHROMIUM PLATING 电镀铬电镀铬PROBLEMS OCCURRING AFTER NICKEL PLATING 镀镍后产生的问题镀镍后产生的问题bNICKEL RECLAIM SOLUTIONS AT TOO HIGH IN pH - WHITE WASHWHITE WASH酸碱度太高的镍回

136、收液酸碱度太高的镍回收液水迹水迹bFRESHLY PLATED NICKEL CAN BECOME PASSIVE WHEN HELD IN RINSE WATER FOR A LONG PERIOD - WHITE WASH, POOR CHROME WHITE WASH, POOR CHROME COVERAGECOVERAGE新电镀的镍在新电镀的镍在漂洗水中时间太长会变得钝化漂洗水中时间太长会变得钝化水迹水迹,差的差的铬覆盖率铬覆盖率bDIRTY RINSE WATER STAININGSTAINING脏的漂洗水脏的漂洗水迹迹.206CHROMIUM PLATING CHROMIUM P

137、LATING 电镀铬电镀铬PROBLEMS OCCURRING IN CHROMIUM TANK 在铬缸中的产生的问题在铬缸中的产生的问题bLOW CATALYST BURNING BURNING 低催化剂低催化剂烧焦烧焦bHIGH CATALYST HAZYHAZY高催化剂高催化剂有雾有雾bRATIO OUT OF SPEC - POOR COVERAGEPOOR COVERAGE超出说明要求的比率超出说明要求的比率差的覆盖率差的覆盖率bPOOR D.C. CURRENT, HIGH RIPPLE - WHITE WASHWHITE WASH差的直流电源，高波纹率差的直流电源，高波纹率发白发

138、白bELECTRICAL SHORTS - WHITE WASHWHITE WASH短暂断电短暂断电发白发白bBI-POLARITY - WHITE WASH WHITE WASH 双极性双极性发发白白bINACTIVE ANODES - POOR COVERAGEPOOR COVERAGE阳极钝化阳极钝化差的覆盖率差的覆盖率207CHROMIUM PLATING CHROMIUM PLATING 电镀铬电镀铬RACKING FOR GOOD COVERAGE电镀挂具电镀挂具bSTURDY RACK CONSTRUCTION ADEQUATE TO CARRY THE CURRENT坚实的结构

139、坚实的结构,能够保障电流通过能够保障电流通过.bPROPER SPACING 适当的空间适当的空间bPROPER POSITIONING 正确的位置正确的位置bGOOD DRAINAGE 好的排水好的排水bAUXILIARY ANODES 辅助阳极辅助阳极bSHIELDS 屏蔽板屏蔽板bROBBERS 抢掉高电流区的一部抢掉高电流区的一部 分电流分电流208ANY QUESTIONS ?ANY QUESTIONS ?有问题吗？有问题吗？209TESTINGTESTING测试测试210TYPICAL DEPOSIT CHARACTERISTICSTYPICAL DEPOSIT CHARACTER

140、ISTICS典型的镀层特性典型的镀层特性bADHESION 结合力结合力bBONDABILITY 可弯曲性能可弯曲性能bCORROSION RESISTANCE 耐腐蚀性耐腐蚀性bHARDNESS 硬度硬度bPOROSITY 孔隙孔隙bRESIDUAL STRESS 残余应力残余应力bSURFACE ROUGHNESS 表面粗糙度表面粗糙度bTHERMAL SHOCK 热冲击热冲击bOPTICAL PROPERTIES 光学特性光学特性bAPPEARANCE 外观外观bCONTACT RESISTANCE 接触电阻接触电阻bDUCTILITY 延展性延展性bHEAT RESISTANCE 热阻

141、热阻bPURITY 纯度纯度bSOLDERABILITY 可焊性可焊性bTHICKNESS 厚度厚度bWEAR RESISTANCE 耐磨性耐磨性211CHARACTERISTICS PERTAINING TO CHARACTERISTICS PERTAINING TO COPPER NICKEL CHROME DEPOSITSCOPPER NICKEL CHROME DEPOSITS有关铜镍铬的特征有关铜镍铬的特征bADHESION 结合力结合力bCORROSION RESISTANCE 防腐防腐bSTRESS 应力应力bSURFACE ROUGHNESS 表面粗糙度表面粗糙度bAPPEAR

142、ANCE 外观外观bDUCTILITY 延展性延展性bTHICKNESS 厚度厚度212ADHESION TEST METHODSADHESION TEST METHODS附着测试方法附着测试方法bBEND 弯曲弯曲bSAW 锯开锯开bFILE 锉刀锉刀bIMPACT 冲击冲击bPEEL STRENGTH 剥离强度剥离强度bGRIND 摩擦摩擦bCHISEL 凿凿bKNIFE 劈开劈开bSCRATCH 刮刮213ADHESIONADHESION 结合力结合力bTHE ATTRACTION FORCE THAT EXISTS BETWEEN THE ELECTRODEPOSIT AND ITS

143、SUBSTRATE, MEASURED AS THE FORCE REQUIRED TO SEPARATE THE ELECTRODEPOSITION FROM ITS SUBSTRATE.是一种存在于电镀层和基体之间的吸引力，是一种存在于电镀层和基体之间的吸引力，测量时将电镀层从其基体上剥离出来所需测量时将电镀层从其基体上剥离出来所需的力。的力。214bA SECTION OF THE PLATED PART IS BENT THROUGH SOME SPECIFIED ANGLE OVER A MANDREL HAVING A SPECIFIC DIAMETER. FLAKING FROM

144、 THE SUBSTRATE INDICATES FAILURE.电镀工件的一部分绕着一定直径的轴弯曲一定电镀工件的一部分绕着一定直径的轴弯曲一定的角度，镀层从基材上有碎片剥落表示测试失的角度，镀层从基材上有碎片剥落表示测试失败。败。BEND TEST BEND TEST 弯曲测试弯曲测试215GRIND, SAW, CHISEL, KNIFE FILE, GRIND, SAW, CHISEL, KNIFE FILE, IMPACT AND SCRATCHIMPACT AND SCRATCH磨、锯、凿、劈、锉、冲击和刮磨、锯、凿、劈、锉、冲击和刮 bMECHANICAL STRESS IS A

145、PPLIED TO THE PLATED PART AND VISUAL EXAMINING THE DEPOSIT FOR ADHESION IN THE AREA WHERE THE STRESS WAS APPLIED.机械外力使用于电镀件上机械外力使用于电镀件上,目测外力使用的区域目测外力使用的区域的电镀层的结合力。的电镀层的结合力。216APPEARANCE APPEARANCE 外观外观bDEPOSIT APPEARANCE IS FREQUENTLY SPECIFIED BECAUSE COLOUR AND TEXTURE OF THE DEPOSIT NOT ONLY AFFE

146、CTS ITS PERFORMANCE BUT ALSO INDICATES THE USE OF PROPER CONTROL DURING THE PREPARATION AND DEPOSITION PROCESS.镀层的外观经常都会有明确的要求，因为颜色镀层的外观经常都会有明确的要求，因为颜色和结构不仅影响其表现，同时也表明前处理和和结构不仅影响其表现，同时也表明前处理和电镀工艺中是否进行了正确的控制电镀工艺中是否进行了正确的控制.217PEEL STRENGTH PEEL STRENGTH 剥离强度剥离强度bIT MEASURES THE PEEL STRENGHT OF THE W

147、EAKEST LAYER OF THE METAL SUBSTRATE TO THE PLASTIC 用于测量最弱的金属层到塑料的剥离用于测量最弱的金属层到塑料的剥离强度强度.218CORROSION RESISTANCE CORROSION RESISTANCE 耐蚀性耐蚀性bTHERE ARE A WIDE VARIETY OF TESTS EMPLOYED AND SPECIFIED TO MEASURE THE CORROSION RESISTANCE OF PLATED PRODUCT.测试电镀产品有非常多的方法测试电镀产品有非常多的方法219TYPICAL CORROSION TE

148、STSTYPICAL CORROSION TESTS典型的腐蚀测试典型的腐蚀测试bFIELD EXPOSURES野外暴露大气野外暴露大气bMIXED GAS TESTS 混合空气测试混合空气测试bSINGLE GAS TESTS 单一空气测试单一空气测试bPOROSITY TESTS孔隙测试孔隙测试bSALT SPRAY TESTS 盐雾实验盐雾实验bHUMIDITY TESTS湿度实验湿度实验bTHERMAL CYCLE冷热循环冷热循环220FIELD EXPOSURES SITESFIELD EXPOSURES SITES暴气实验点暴气实验点bKURE BEACH, NCbSTATE CO

149、LLEGE, PAbACT, SOUTHFIELD, MIbMONTREAL, CANADA221TYPICAL SALT SPRAY TESTSTYPICAL SALT SPRAY TESTS典型的盐雾实验典型的盐雾实验bNEUTRAL SALT SPRAY 中性盐雾实验中性盐雾实验 - ASTM B-117bACETIC ACID SALT SPRAY 乙酸盐雾实验乙酸盐雾实验 - ASTM G-85bCOPPER ACCELERATED ACETIC ACID SALT SPRAY ( CASS ) 铜加速乙酸实验铜加速乙酸实验CASS - ASTM B-368bCORRODKOTE T

150、EST 腐蚀膏实验腐蚀膏实验 - ASTM B- 380222SALT SPRAY CHAMBER SALT SPRAY CHAMBER 盐雾箱盐雾箱AIR空气空气BUBBLE TOWER泡沫塔泡沫塔AIR LINE空气线空气线SALT SOLUTION ATOMIZER TANK盐水喷雾缸盐水喷雾缸DISPERSION TOWER分散塔分散塔LEVEL CONTROL SYSTEM水平控制系统水平控制系统WATER JACKET水套水套223NEUTRAL SALT SPRAY NEUTRAL SALT SPRAY 中性盐雾实验中性盐雾实验ASTM B-117ASTM B-117bSPRAY

151、ING THE SPECIMENS WITH A MIST OF 5% SODIUM CHLORIDE SOLUTION AT A pH OF 6.5 TO 7.2 IN A CLOSED CABINET UNDER STRICT SPECIFIED CONDITIONS OF TEMPERATURE AND SPRAY RATE.在封闭的箱中在封闭的箱中,严格按照要求的温度和喷严格按照要求的温度和喷雾速度喷洒雾速度喷洒5%氯化钠，酸碱度控制在氯化钠，酸碱度控制在6.5-7.2之间。之间。224ACETIC ACID SALT SPRAY TESTACETIC ACID SALT SPRAY

152、TEST乙酸盐雾实验乙酸盐雾实验ASTM G-85 FORMERLY B-287ASTM G-85 FORMERLY B-287bSIMILAR TO B-117 EXCEPT THAT THE pH IS BETWEEN 3.1 TO 3.3 WITH ACETIC ACID. THIS PROCEDURE IS APPLICABLE TO FERROUS, NON FERROUS METALS AND ALSO FOR ORGANIC AND INORGANIC COATINGS. 除了酸碱度在除了酸碱度在3.1-3.3之间呈酸性，此实验与中性盐之间呈酸性，此实验与中性盐雾实验（雾实验（B

153、-117）类似，适用于铁及非铁金属镀层，）类似，适用于铁及非铁金属镀层，也适用于有机和无机镀层。也适用于有机和无机镀层。225COPPER-ACCELERATED ACETIC ACID SALT COPPER-ACCELERATED ACETIC ACID SALT SPRAY ASTM B-368SPRAY ASTM B-368铜加速乙酸盐雾实验铜加速乙酸盐雾实验bFOR THE EVALUATION OF COPPER/ NICKEL/ CHROMIUM DEPOSITS ON STEEL, ALUMINUM, PLASTIC AND ZINC ALLOYS FOR SEVERE SER

154、VICE IN AN ENCLOSED CHAMBER AT CONTROLLED TEMPERATURE , SPRAY RATE AND pH. THE SOLUTION CONTAINS SODIUM CHLORIDE, COPPER CHLORIDE AND ACETIC ACID AT A pH OF 3.1 TO 3.3.在控制的温度、喷雾速度和酸碱度下，在密闭的箱中，评在控制的温度、喷雾速度和酸碱度下，在密闭的箱中，评估在不锈钢、铝、塑料和锌合金上的铜估在不锈钢、铝、塑料和锌合金上的铜/镍镍/铬镀层的铬镀层的防腐防腐性能。溶液含氯化钠、氯化铜和乙酸，酸碱度在性能。溶液含氯化钠、氯

155、化铜和乙酸，酸碱度在3.1-3.3之间之间226CORRODKOTE TESTCORRODKOTE TESTASTM B-380ASTM B-380bFOR THE EVALUATION OF CORROSION PERFORMANCE OF COPPER/ NICKEL/ CHROMIUM DEPOSITS ON STEEL, ZINC ALLOYS, ALUMINUM AND PLASTIC SUBSTRATES. A SLURRY CONTAINING CORROSIVE SALTS IS APPLIED TO THE DEPOSIT AND EXPOSED TO HIGH HUMIDI

156、TY FOR A PERIOD OF TIME.评估在不锈钢、锌合金、铝和塑料基材上的铜评估在不锈钢、锌合金、铝和塑料基材上的铜/镍镍/铬铬镀层的镀层的腐蚀表现腐蚀表现。含腐蚀盐的盐浆涂于镀层上，并暴。含腐蚀盐的盐浆涂于镀层上，并暴露在高湿度下一定时间露在高湿度下一定时间227DUCTILITY TESTS DUCTILITY TESTS 延展性测试延展性测试bBEND TEST弯曲测试弯曲测试bBULGE TEST膨胀测试膨胀测试bTENSILE TEST张力测试张力测试bMANDREL TEST 轴测试轴测试bMICROMETER TEST 千分尺测试千分尺测试228DUCTILITY D

157、UCTILITY 延展性延展性bTHE ABILITY OF A MATERIAL TO DEFORM PLASTICALLY WITHOUT FRACTURING.没有龟裂的情况下，一种材料具有可塑性没有龟裂的情况下，一种材料具有可塑性的能力的能力229BEND TEST BEND TEST 弯曲测试弯曲测试bASTM - B-489 BEND TEST FOR DUCTILITY OF ELECTRODEPOSITED AND AUTOCATALYTICALLY DEPOSITED METAL COATINGS ON METALS.ASTM B-489 为测在金属上的电沉积层和自催为测在金

158、属上的电沉积层和自催化沉积层的延展性进行的弯曲测试化沉积层的延展性进行的弯曲测试bASTM B-490 MICROMETER BEND TEST FOR DUCTILITY OF ELECTRODEPOSITS ( CHRYSLER DUCTILITY TEST ).ASTM B-490 为测电沉积物的延展性为测电沉积物的延展性（CHRYSLER延展性测试）进行的千分尺弯曲延展性测试）进行的千分尺弯曲测试测试230BEND TEST BEND TEST 弯曲测试弯曲测试bA QUALITATIVE MEASUREMENT OF DUCTILITY BY PLACING A PLATED SAM

159、PLE STRIP IN THE JAWS OF A VISE AND BENDING BACK AND FORTH THROUGH 90 DEGREES UNTIL IT BREAKS. THE NUMBER OF BENDS INDICATES THE DUCTILITY.定量测试延展性，将一片电镀的样品条放在定量测试延展性，将一片电镀的样品条放在夹钳的夹口处来回弯曲夹钳的夹口处来回弯曲90度直至断裂。弯曲度直至断裂。弯曲的次数表示其延展性能的好坏的次数表示其延展性能的好坏231BEND TEST BEND TEST 弯曲测试弯曲测试VISEA PLATED SECTION 电镀部分电镀部

160、分ANGLE OF DEFLECTION弯曲的角度弯曲的角度232MICROMETER TEST MICROMETER TEST 千分尺测试千分尺测试bA NICKEL STRIP 6.35 mm THICK IS BENT INTO A “U” SHAPE AND PLACED BETWEEN THE ANVILS OF A MICROMETER. THE MICROMETER IS CLOSED UNTIL THE THE SAMPLE BREAKS. 厚度为厚度为6.35mm的镍条在千分尺上的夹口处弯曲成的镍条在千分尺上的夹口处弯曲成“U”形，夹紧千分尺直至样品断裂。形，夹紧千分尺直至样

161、品断裂。DUCTILITY = THICKNESS厚度厚度延展性延展性 MICROMETER READING HICKNESS 千分尺厚度读数千分尺厚度读数233MICROMETER TEST MICROMETER TEST 千分尺千分尺NICKEL FOIL 镍箔镍箔MICROMETER 千分尺千分尺D = T/2R234MANDREL TEST MANDREL TEST 轴测试轴测试bA SECTION OF A NICKEL PLATED PART IS BENT AROUND MANDRELS OF SUCCESSIVELY SMALLER DIAMETER UNTIL CRACKIN

162、G OF THE DEPOSIT IS OBSERVED.镀镍工件的一部分围绕轴弯曲，连续绕成更小的直径，镀镍工件的一部分围绕轴弯曲，连续绕成更小的直径，直至镀层上能看见裂纹。直至镀层上能看见裂纹。DUCTILITY % = 100 THICKNESS厚度厚度 ( COMPOSITE合成物合成物 ) 延展性延展性 DIAMETER直径直径 ( MANDREL轴轴) + THICKNESS厚度厚度 ( COMPOSITE合合成物成物)235MANDREL TEST MANDREL TEST 轴测试轴测试MANDREL轴轴PLATED STRIP电镀条电镀条D(%) = 100t d + t236

163、BULGE TEST BULGE TEST 膨胀测试膨胀测试bTHIS TEST YIELDS ACCURATE DUCTILITY RESULTS. THIS TEST CAN ALSO BE USED TO MEASURE THE TENSILE STRENGTH AND DUCTILITY OF A DEPOSIT THAT HAS BEEN STRIPPED FROM THE SUBSTRATE .能测试出精确的延展性结果。此测试也能用来测试能测试出精确的延展性结果。此测试也能用来测试张力和从基材上剥离出的镀层的延展性。张力和从基材上剥离出的镀层的延展性。237BULGE TESTBU

164、LGE TEST 膨胀测试膨胀测试NICKEL FOIL镍箔镍箔OILor WATER油或水油或水PRESSURE压力压力PRESSURE压力压力238SURFACE ROUGHNESS SURFACE ROUGHNESS 表面粗糙度表面粗糙度bTHE PROFILE OF SURFACE DEFECTS AND IMPERFECTIONS. THIS ROUGHNESS CAN BE DUE TO SUBSTRATE PREPARATION AND OR ELECTROPLATING. THE SURFACE PROFILE CAN BE MEASURED BY MOVING A STYLU

165、S TRAVERSE THE SURFACE OF THE SPECIMEN AND RECORDING THE VERTICAL DISPLACEMENT. 即表面的外形的缺陷和不完整性。粗糙度可能缘即表面的外形的缺陷和不完整性。粗糙度可能缘自底材处理，也可能来自电镀，它能用在样本的自底材处理，也可能来自电镀，它能用在样本的表面移动铁笔，根据记录的垂直移动量来衡量。表面移动铁笔，根据记录的垂直移动量来衡量。239INTERNAL STRESS INTERNAL STRESS 内应力内应力bINTERNAL (RESIDUAL ) STRESS IS DISTORTION OF THE CRY

166、STAL LATTICE OF THE ELECTRODEPOSIT. ATOMS ARE CLOSER TOGETHER THEN NORMAL, TENSILE STRESS OCCURS AND WHEN ATOMS ARE FURTHER AWAY, COMPRESSIVE STRESS OCCURS. INTERNAL STRESS IS MEASURED BY RGID STRIP OR SPIRAL CONTRACTOMETER.内（残余）应力是电镀层晶格的扭曲，其中的原子内（残余）应力是电镀层晶格的扭曲，其中的原子比正常时靠得更紧，张应力产生；当原子离得比平比正常时靠得更紧，张

167、应力产生；当原子离得比平时松散，产生压应力。内应力可以用钢条或螺旋应时松散，产生压应力。内应力可以用钢条或螺旋应力仪测试。力仪测试。240INTERNAL STRESS INTERNAL STRESS 内应力内应力RIGID STRIP RIGID STRIP 钢条钢条DEPOSIT 沉积沉积TENSILE拉伸拉伸COMPRESSIVE压缩压缩ZERO零零241SPIRAL CONTRACTOMETERSPIRAL CONTRACTOMETER螺旋应力仪螺旋应力仪GAUGE 量规量规HELIX 螺旋螺旋242THICKNESS THICKNESS 厚度厚度bTHICKNESS IS AN IM

168、PORTANT FACTOR FOR CORROSION RESISTANCE.AND ALSO FOR WEAR. THICKNESS CAN BE MEASURED BY DESTRUCTIVE AND NON DESTRUCTIVE METHODS. 对防腐和耐磨来说，厚度都是一个重要的因素。对防腐和耐磨来说，厚度都是一个重要的因素。厚度有破坏性和非破坏性两种测试方法。厚度有破坏性和非破坏性两种测试方法。243THICKNESS MEASUREMENTSTHICKNESS MEASUREMENTS厚度测试厚度测试bSTRIP AND WEIGH 剥离再称重剥离再称重bDROPPING T

169、EST 下落实验下落实验- ASTM B-555b*COULIMETRIC - ASTM B-504 库仑法库仑法b*BETA BACKSCATTER - ASTM B-567b*EDDY CURRENT TEST涡流测试涡流测试 - ASTM B-244b*MAGNETIC TEST 磁力测试磁力测试 - ASTM B-530bMICROMETER TESTS 千分尺测试千分尺测试- ASTM B-767b*MICROSCOPIC TEST 显微测试显微测试- ASTM B-588b*X-RAY TEST X射线测试射线测试 - ASTM B-568 244COULOMETRIC TESTC

170、OULOMETRIC TEST？ASTM B-504ASTM B-504bTHE DEPOSIT IS DISSOLVED ANODIC WITH A SPECIFIED SOLUTION AT 100 % EFFICIENCY在特定的溶液中镀层阳极溶解，电流效率在特定的溶液中镀层阳极溶解，电流效率100%.bSTRIPPING CURRENT AND TIME IS RECORDED TO DETERMINE THE THICKNESS记录的退镀记录的退镀电流电流和时间决定厚度和时间决定厚度bA CHANGE IN POTENTIAL WILL SHUT OFF THE INSTRUMENT

171、 WHEN THE SUBSTRATE IS EXPOSED 当基材暴露出来时，电压的改变会让测试终止当基材暴露出来时，电压的改变会让测试终止.245COULOMETRIC COULOMETRIC 电解测厚电解测厚STRIP TESTSTRIP TESTAGITATOR搅拌搅拌STRIPPING ELECTROLYTE剥离电解液剥离电解液GASKET垫圈垫圈CELL 槽槽SPECIMEN样品样品246THICKNESS INSTRUMENT厚度设备厚度设备STAND立式立式 & CELL电池电池247bUSED FOR MEASURING A VARIETY OF DEPOSITS 可以用来测

172、量许多镀层可以用来测量许多镀层bNON DESTRUCTIVE USING LOW LEVEL OF BETA RADIATION THAT IS BACKSCATTERED ( REFLECTED ) FROM THE SPECIMEN AND IS COUNTED BY A GEIGER-MULLER TUBE使用低水平的使用低水平的B射先进行非破坏测试，它是从样品射先进行非破坏测试，它是从样品进行？（反射的），用进行？（反射的），用GEIGER-MULLER管来测管来测bTHE AMOUNT OF BACKSCATTER RADIATION VARIES WITH THICKNESS ？

173、射线的量随着厚度的变化而变化？射线的量随着厚度的变化而变化BETA BACKSCATTERBETA BACKSCATTER？ASTM B-567ASTM B-567248bIF THE ATOMIC NUMBER OF THE DEPOSIT AND THE UNDERPLATE DIFFER BY MORE THAN FOUR THEN THE THICKNESS CAN BE DETERMINE如果沉积物的原子序数和底材相差四倍，则厚度如果沉积物的原子序数和底材相差四倍，则厚度可测可测 bTHICKNESS AS LOW AS 0.04um ARE MEASUEABLE厚度低于厚度低于0.

174、04um的也可测的也可测BETA BACKSCATTERBETA BACKSCATTER? ? ASTM B-567ASTM B-567249BETA BACKSCATTER ?BETA BACKSCATTER ?COATING涂层涂层SUBSTRATE基材基材APERATURE PLATEN?ISOTOPE 同位素同位素GEIGERMULLER TUBE管管250BETA SCOPE BETA SCOPE ？PRINTERBETA BACK SCATTERCOMPUTER251EDDY CURRENT TEST EDDY CURRENT TEST 电流测试？电流测试？ASTM B-244AS

175、TM B-244bA NON DESTRUCTIVE METHOD 一种非破坏性方法一种非破坏性方法bMAINLY USED TO DETERMINE THE THICKNESS OF AN ANODIC COATING OF ALUMINUM 主要用于测量铝的阳极镀层的厚度主要用于测量铝的阳极镀层的厚度bMEASUMENT IS MADE WITH AN ELECTROMAGNETIC INSTRUMENT THAT MEASURES THE CHANGE IN APPARENT IMPEDENCE OF THE COIL INDUCING THE EDDY CURRENT INTO THE

176、 BASIC METAL用电磁设备测量，测量箔将电流导入基础金属的外观？用电磁设备测量，测量箔将电流导入基础金属的外观？252EDDY CURRENT INSTRUMENTEDDY CURRENT INSTRUMENT电流设备电流设备COMPUTER电脑电脑PRINTER打印机打印机STAND 立式立式& PROBE 探测探测253X-RAY TEST XX-RAY TEST X射线测试射线测试ASTM B-568ASTM B-568bA NON DESTRUCTIVE TEST METHOD一种非破坏性测试方法一种非破坏性测试方法 bABILITY TO MEASURE THICKNESS

177、IN SMALL AREA能测出小面积范围内的厚度能测出小面积范围内的厚度254X-RAY TEST XX-RAY TEST X射线测试射线测试ASTM B-568ASTM B-568bTHE ENERGY OF THE PHOTON WILL BE ABSORBED BY AN ELECTRON IN AN ENERGY LEVEL OF THE ATOM OF THE SAMPLE AND LEAVING IT IN AN EXCITED STATE.光子的能量将在样品原子能量水平下被电子吸收，光子的能量将在样品原子能量水平下被电子吸收，离开时使之处于一种活化、被激发的状态离开时使之处于一

178、种活化、被激发的状态bTHE PHOTON ENERGY IS CALLED X-RAY FLUORESCENCE AND DETECTABLE BY A PROPORTIONAL COUNTER光子的能量被称为光子的能量被称为X射线荧光，能被一个均横的射线荧光，能被一个均横的计数器探测计数器探测255X-RAY FLUORESCENCEX-RAY FLUORESCENCEX X射线荧光射线荧光X-RAY SOURCE X射线源射线源PROPORTIONAL COUNTER均衡的计数器均衡的计数器X-RAY EMISSION X射线发射射线发射SHUTTER 关闭关闭COLLIMATOR 瞄准

179、仪瞄准仪X-RAY射线射线SPECIMEN样品样品XYZ STAGE256X-RAY UNITPRINTERCOMPUTERX-RAY FLUORESCENCE X射线荧光射线荧光257MICROSCOPIC TEST MICROSCOPIC TEST 显微测试显微测试258MAGNETIC TEST MAGNETIC TEST 磁测试磁测试259S.T.E.P. TESTS.T.E.P. TESTbSIMULTANEOUS THICKNESS AND ELECTROCHEMICAL POTENTIAL DETERMINATION OF INDIVIDUAL LAYERS IN MULTILA

180、YER NICKEL DEPOSITS同步厚度电化学电压能测定多层镍中不同镀层同步厚度电化学电压能测定多层镍中不同镀层的厚度的厚度bA MODIFIED METHOD OF COULOMETRIC THICKNESS MEASUREMENT是库仑测厚仪的改良方法是库仑测厚仪的改良方法.260S.T.E.P. TESTS.T.E.P. TEST261ANY QUESTIONS ?ANY QUESTIONS ?有问题吗？有问题吗？262FILTRATION AND CARBON FILTRATION AND CARBON TREATMENTTREATMENT过滤及碳处理过滤及碳处理263WHAT

181、IS FILTRATION ?WHAT IS FILTRATION ?什么是过滤？bTHE REMOVAL OF SUSPENDED SOLIDS FROM THE PLATING SOLUTION THAT MAY CAUSE ROUGHNESS OR OTHER IMPERFECTION IN THE DEPOSIT.b从镀液中除去可能会引起粗糙或其它非从镀液中除去可能会引起粗糙或其它非良好状态的悬浮的固体良好状态的悬浮的固体264bSUSPENDED PARTICLES REMOVED BY FILTRATION被过滤除去的悬浮微粒被过滤除去的悬浮微粒bDISSOLVED ORGANIC

182、S REMOVED BY ADSORPTION BY ACTIVATED CARBON被活性碳吸附除去的溶解有机物被活性碳吸附除去的溶解有机物bINORGANIC REMOVED BY ELECTROLYTIC PURIFICATION可被电解净化除去的无机物可被电解净化除去的无机物TYPES OF IMPURITIESTYPES OF IMPURITIES杂质的类型杂质的类型265bDRAG IN ON WORK 工件带入的工件带入的bPRECIPITATES沉淀沉淀bANODE SLUDGE阳极泥阳极泥bUNDISSOLVED SALTS不溶解盐不溶解盐bDUST尘尘bPOLISHING

183、GRIT研磨砂研磨砂bBUFFING COMPOUND抛光膏抛光膏bHYDROXIDES氢氧化物氢氧化物bMETAL FILINGS金属屑金属屑SOURCES OF IMPURITIESSOURCES OF IMPURITIES杂质的来源杂质的来源266SIZING THE FILTERSIZING THE FILTER确定过滤器的尺寸确定过滤器的尺寸bTYPE OF SOLUTION 溶液的种类溶液的种类bADEQUATE FILTER AREA适当的过滤面积适当的过滤面积bADEQUATE SOLIDS HOLDING CAPACITY足够的容积足够的容积bADEQUATE PUMP CA

184、PACITY足够的容量足够的容量267FILTER AREA NEEDEDFILTER AREA NEEDED需要的过滤面积需要的过滤面积bACID BATH酸槽酸槽 0.98 SQUARE METERS PER 100 LITRES PER HOUR每小时每每小时每100升升0.98平方米平方米bALKALINE BATH碱槽碱槽 1.63 SQUARE METERS PER 100 LITRES PER HOUR每小时每每小时每100升升1.63平方米平方米268TYPE OF FILTRATIONTYPE OF FILTRATION过滤的类型过滤的类型bBATCH 批处理式批处理式bIN

185、TERMITTENT 间断式间断式bCONTINUOUS 连续式连续式269INTERMITTENT FILTRATIONINTERMITTENT FILTRATION间断式过滤间断式过滤bTHE SOLUTION IS FILTERED AS REQUIRED溶液按要求过滤溶液按要求过滤270CONTINUOUS FILTRATION CONTINUOUS FILTRATION 连续过滤连续过滤bA PORTION OF THE PLATING SOLUTION IS CONTINUOUSLY PUMPED THROUGH THE FILTER AS WORK IS BEING PROCES

186、SED 工作进行中，部分镀液被连续用泵抽出流经过滤工作进行中，部分镀液被连续用泵抽出流经过滤器器bTHE TURNOVER RATE SHOULD BE TWO TO FIVE TURNOVERS PER HOUR流动速率为每个小时流动速率为每个小时2-5个循环个循环.271BATCH FILTRATIONBATCH FILTRATION批处理过滤批处理过滤bTHE WHOLE PLATING SOLUTION IS FILTERED TO A SEPARATE TANK , THEN FILTERED BACK TO THE PLATING TANK.所有的镀液被过滤至另一个独立的缸，然后再

187、过所有的镀液被过滤至另一个独立的缸，然后再过滤回镀缸。滤回镀缸。272WHEN IS BATCH FILTRATION NECESSARY ?WHEN IS BATCH FILTRATION NECESSARY ?何时需要批处理？何时需要批处理？bNEWLY PREPARED PLATING SOLUTIONS - REMOVE UNDISSOLVED SALTS, PRECIPITATES, SOLIDS AND CARBON新开缸的镀液，除去不溶解的盐、沉淀物、固体和新开缸的镀液，除去不溶解的盐、沉淀物、固体和碳碳bAFTER A PURIFICATION TREATMENT - CARB

188、ON AND PRECIPITATES净化处理后净化处理后碳和沉淀碳和沉淀bAFTER LARGE CHEMICAL ADDSbAFTER DRAG-IN OF SOLIDS 加入大量的化学品加入大量的化学品(主盐主盐)和带进了固体颗粒和带进了固体颗粒.273PUMP CAPACITY PUMP CAPACITY 泵的容量泵的容量bSUFFICIENT FLOW IN LITRES PER HOUR每小时有足够量的升数在流动每小时有足够量的升数在流动bDEVELOP SUFFICIENT PRESSURE TO A MAXIMUM OF 40 PSI BEFORE CHANGING调节前压力最

189、多为调节前压力最多为40PSI274ESTIMATING PUMP SIZE AND FILTER AREAESTIMATING PUMP SIZE AND FILTER AREA估计的泵的大小和过滤面积估计的泵的大小和过滤面积YOU HAVE你有你有YOU WANT 你想要你想要YOU NEED你需要你需要YOU NEED你需要你需要ACID BATH1000 LITRES 1000升酸槽升酸槽TO FILTER AT 2 TANK TURNOVERS PER HOUR 每小时过滤两每小时过滤两个循环个循环PUMP CAPACITY 2000 LITRES PER HOUR泵的流量为泵的流量

190、为每小时为每小时为2000升升2.0 SQUARE METRES OF FILTER AREA ( 1000 LPH/M2 ) OR 25 GPH/Ft2过滤面积为过滤面积为2.0平方米平方米(1000lph/m2)或或25gph/ft2275FILTER AIDS FILTER AIDS 过滤辅助物过滤辅助物bTYPES 类型类型lDIATOMACEOUS EARTH硅藻土硅藻土lPERLITE珍珠岩珍珠岩lCELLULOSE MATERIAL纤维素材质纤维素材质bUSES 使用使用lPRECOAT滤料层滤料层lBODY TREAT大量处理大量处理276TYPES OF IMPURITIES

191、 TYPES OF IMPURITIES 杂质的种类杂质的种类bSUSPENDED - REMOVED BY FILTRATION悬浮物悬浮物过滤除去过滤除去bDISSOLVED - ORGANIC - REMOVED BY 溶解的有机物体溶解的有机物体ADSORPTION 吸附表除去吸附表除去 - INORGANIC - REMOVED BY ELECTROLYSIS, PRECIPITATION, ION EXCHANGE溶解的无机物溶解的无机物 用电解、沉淀、离子交换除去用电解、沉淀、离子交换除去277SOURCE OF ORGANIC IMPURITIESSOURCE OF ORGAN

192、IC IMPURITIES有机杂质的来源有机杂质的来源bDRAG IN FROM CLEANING CYCLE前处理循环中带入前处理循环中带入bLUBRICANTS润滑剂润滑剂bTANK LINING缸内衬缸内衬bRACK COATING 架上的镀层架上的镀层bANODE BAGS阳极袋阳极袋bBREAKDOWN OF BRIGHTENERS光亮剂的分解光亮剂的分解278CARBON ADSORPTION CARBON ADSORPTION 碳吸附碳吸附bTHE ADHERENCE OF ATOMS, MOLECULES OR IONS OF A GAS OR LIQUID TO THE SU

193、RFACE OF ANOTHER SUBSTANCE气体或液体的原子、分子或离子吸附在另一种基气体或液体的原子、分子或离子吸附在另一种基材上材上bACTIVATED CARBON IS A MICROPOROUS MATERIAL WITH A LARGE ACTIVE SURFACE AREA活性碳是一种多微孔的材料，上面有大量的活性活性碳是一种多微孔的材料，上面有大量的活性表面区域表面区域279ADSORPTION OF CARBONADSORPTION OF CARBON 碳吸附碳吸附MACROPORE大孔径大孔径MICROPORE微孔微孔AREA AVAILABLE TO ABSORB

194、ATES & SOLVENT可吸收可吸收/溶解的面积溶解的面积AREAAREA AVAILABLE ONLY TO SOLVENT & SMALL ADSORBATE可溶解可溶解/小吸收的面积小吸收的面积AREA AVAILABLE ONLY TO SOLVENT只可用于只可用于溶解的面积溶解的面积280ADSORPTION OF CARBON ADSORPTION OF CARBON 碳吸附碳吸附PORE STRUCTURE OF VARIOUS ACTIVATED CARBON各种活性碳的孔结构各种活性碳的孔结构281bSOLUTION IS PUMPED THROUGH A FILTER

195、 CHAMBER THAT CONTAINS PROPER FILTER MEDIA 溶液被泵过含有合适的过滤介质的过滤箱溶液被泵过含有合适的过滤介质的过滤箱bFILTER MEDIA CAN BE PAPER, CLOTH, SCREEN, WOUND FABRIC OR SPECIAL MATERIALS过滤介质可以是纸、布、框、过滤介质可以是纸、布、框、编织物或特殊材料编织物或特殊材料bDIATOMACEOUS EARTH SHOULD BE USED FOR ACIDIC SOLUTIONS硅藻土可用于酸溶液硅藻土可用于酸溶液b ALKALINE SOLUTIONS USE CELLU

196、LOSE MEDIA (SOLKA-FLOC)碱溶液使用纤维素介质碱溶液使用纤维素介质HOW A FILTER WORKSHOW A FILTER WORKS过滤器如何工作过滤器如何工作282ANY QUESTIONS ?ANY QUESTIONS ?有问题吗？有问题吗？283THE PRINCIPLES OF THE PRINCIPLES OF TROUBLESHOOTINGTROUBLESHOOTING现场故障处理的原则284GUIDE LINES TO TROUBLESHOOTINGGUIDE LINES TO TROUBLESHOOTING现场故障处理指南现场故障处理指南bDEFINE

197、 THE PROBLEM 确认问题确认问题bOBSERVE观察观察bMAKE INQUIRIES调查调查bVERIFY检验检验285DEFINING THE PROBLEM DEFINING THE PROBLEM 确认问题确认问题uKNOW THE PROBLEM了解了解问题问题uDETERMINE THE TRUE NATURE OF PROBLEM确定问题的确定问题的真正真正状态状态uPROCEED TO WORK ON THE PROBLEM着手解决问题着手解决问题uKEEP IN MIND THAT YOU MAY NOT HAVE CORRECTLY DEFINED THE PRO

198、BLEM切记你可能切记你可能没有没有正确地定义问题正确地定义问题286OBSERVATIONS OBSERVATIONS 观察观察uOBSERVATION IS ESSENTIAL IN ESTABLISHING THE PROBLEM在确定问题时观察是非常必要的在确定问题时观察是非常必要的uNOT ONLY LOOK BUT SEE不要仅仅只是不要仅仅只是瞧瞧，要用心去，要用心去看看uEXAMINE, SCRUTINIZE AND UNDERSTAND WHAT IS BEING OBSERVED验证、细细观察，并了解观察到什么验证、细细观察，并了解观察到什么287INQUIRIES INQ

199、UIRIES 调查调查uGATHER INFORMATION AND DETAIL ABOUT THE PROBLEM收集问题的信息和细节收集问题的信息和细节uUNDERSTAND THE PROCESS ASSOCIATED WITH THE PROBLEM了解有关问题的工艺了解有关问题的工艺uASK QUESTIONS AND PROBE FOR INFORMATION提问并推测提问并推测uDO NOT BE CRITICAL OF ANSWERS对回答不要评论对回答不要评论uREFER TO DATA SHEETS AND TECHNICAL INFORMATION AVAILABLE参

200、考可用的数据表和技术信息参考可用的数据表和技术信息288VERIFICATION TECHNIQUE VERIFICATION TECHNIQUE 确认技巧确认技巧uROUTINE CONTROL常规控制常规控制uELECTRICAL & MECHANICAL CHECKS电器及机械检查电器及机械检查uCHEMICAL CONTROLS 化学控制化学控制uDETERMINE A PATTERN 决定模式决定模式uINTERCHANGE PARTS OR TANKS换工件或缸换工件或缸uVERIFICATION OF PROBLEM 确认问题确认问题uCOMMUNICATION & CORREC

201、TION 沟通与纠正沟通与纠正uSKEPTICISM 怀疑论怀疑论289ROUTINE CONTROL ROUTINE CONTROL 常规控制常规控制uWHAT IS THE TEMPERATURE ? 温度是多少？温度是多少？uWHAT IS THE CONCENTRATION OF THE ADDITIVES ? 添加剂的浓度是多少？添加剂的浓度是多少？uWHAT IS THE CONCENTRATION OF THE SOLUTION ? 溶液的浓度是多少？溶液的浓度是多少？uWHAT IS THE pH ? 酸碱度是多少？酸碱度是多少？uWHAT IS THE CURRENT DEN

202、SITY ? 电流密度是多少？电流密度是多少？uWHAT IS THE VOLTAGE ? 电压是多少？电压是多少？uWHAT IS THE CONDITION OF THE ANODES ? 阳极条件是什么？阳极条件是什么？uIS THERE ENOUGH ANODE AREA ? 是否有足够的阳极面积？是否有足够的阳极面积？290ELECTRICAL & MECHANICAL CHECKSELECTRICAL & MECHANICAL CHECKS电气和机械检查电气和机械检查uCHECK RECTIFIER FOR OUTPUT & RIPPLE检查整流器输出和波纹检查整流器输出和波纹uC

203、HECK THE BUSBAR CONNECTION检查导电巴的接线检查导电巴的接线uCHECK THE HEATING & COOLING SYSTEMS检查加热及冷却系统检查加热及冷却系统uCHECK THE TANK FOR FALLEN PARTS检查缸中是否有掉落的工件检查缸中是否有掉落的工件uCHECK THE RACKS OR BARRELS检查挂具或桶检查挂具或桶uCHECK THE FILTERS检查过滤器检查过滤器291DETERMINE A PATTERN DETERMINE A PATTERN 确定模式确定模式uOBSERVE PARTS BEING LOADED AN

204、D UNLOADED TO DETERMINE A PATTERN 观察挂上及取下的工件以确定一个模式观察挂上及取下的工件以确定一个模式uWORK BACKWARDS TO FIND THE CORRECT CAUSE从后向前工序观察，发现真正的原因从后向前工序观察，发现真正的原因292INTERCHANGE PARTS OR TANKSINTERCHANGE PARTS OR TANKS换工件或缸换工件或缸uCHANGE POSITION OF PARTS ON THE RACK改变挂具上工件的位置改变挂具上工件的位置uCHANGE RACK FOR SAME PART同样的工件，改变挂具同

205、样的工件，改变挂具uCHANGE PROCESS TANK FOR PARTS 改变工艺改变工艺293VERIFY THE PROBLEM VERIFY THE PROBLEM 确认问题确认问题uVERIFY THE PROBLEM BY REPRODUCING IT再操作一次以确认问题再操作一次以确认问题uWORK TO DETERMINE THE SOURCE OF THE PROBLEM确认问题产生的来源确认问题产生的来源294COMMUNICATION & CORRECTIONCOMMUNICATION & CORRECTION沟通与纠正沟通与纠正uCOMMUNICATE IN TER

206、MS THAT ARE UNDERSTOOD用大家都理解的术语沟通用大家都理解的术语沟通uSPEAK IN COMMON TECHNICAL LANGUAGE用常用的技术语言用常用的技术语言uCOMMUNICATE WITH PEOPLE NOT DOWN TO THEM与人进行沟通而非与人进行沟通而非藐视现场人员藐视现场人员.uALWAYS WRITE OUT YOUR INSTRUCTIONS SO AS NOT TO HAVE ANY MISUNDERSTANDING LATER记录你的指示与建议以免日后有错误的理解记录你的指示与建议以免日后有错误的理解295SKEPTICISM SKE

207、PTICISM 怀疑怀疑uALWAYS RE-EVALUATE THE ENTIRE SITUATION时常重新评估整件事情时常重新评估整件事情uASK YOURSELF THE QUESTIONS-经常问自己经常问自己-HAS THE PROBLEM BEEN CORRECTLY DEFINED ?问题定义正确吗？问题定义正确吗？-ARE THE OBSERVATIONS PROPERLY INTERPRETED ? 观察是否正确？观察是否正确？-WAS THE INFORMATION RECEIVED CORRECT ? 收到的信息正确吗？收到的信息正确吗？-HAS ENOUGH INFO

208、RMATION BEEN COLLECTED ? 收集到了足够的信息了吗？收集到了足够的信息了吗？296WALKING THE LINE WALKING THE LINE 在生产线巡回观察在生产线巡回观察uSLOWLY WALK THE LINE AND OBSERVE EVERY PHASE OF THE OPERATION在生产线上慢行，观察生产运作中的在生产线上慢行，观察生产运作中的每一部分每一部分297AT THE LOADING UNLOADING AREAAT THE LOADING UNLOADING AREA在上挂及下挂区在上挂及下挂区uARE THE PARTS RACKED

209、 CORRECTLY工件是否被正确挂上架工件是否被正确挂上架uARE THE PARTS REPLATES 工件是返镀件吗工件是返镀件吗uIS THERE BUILDUP ON THE CONTACTS 工件与挂具建立了工件与挂具建立了有效接触吗？有效接触吗？uARE THE PARTS MAKING GOOD CONTACT 工件具有良好的工件具有良好的接触吗？接触吗？uARE THE PARTS CLEAN 工件清洁吗？工件清洁吗？uNATURE OF SOIL ON THE PARTS 工件上脏物的特性工件上脏物的特性uARE THE PARTS FINISHED PROPERLY 工件

210、被正确完工了吗工件被正确完工了吗uARE THE PARTS READY FOR PLATING 工件准备好进行电镀工件准备好进行电镀了吗？了吗？298AT THE SOAK TANKAT THE SOAK TANK在浸泡缸中在浸泡缸中uIS THE TANK AT OPERATING LEVEL ?缸在操作水平上吗？缸在操作水平上吗？uIS THE OPERATING TEMPERATURE CORRECT ? 操作温度正确吗？操作温度正确吗？uIS THERE EXCESS OIL ON THE TANK SURFACE ? 在缸的表面有多余的油脂吗？在缸的表面有多余的油脂吗？uIS TH

211、E AGITATION WORKING PROPERLY ?搅拌正确吗？搅拌正确吗？uIS THERE EXCESSIVE FOAM OR NOT ENOUGH? 泡沫是否超多或不够？泡沫是否超多或不够？299AT THE ELECTROCLEANER TANKAT THE ELECTROCLEANER TANK在电解槽中在电解槽中uIS THE TANK AT OPERATING LEVEL ?槽在操作水平吗？槽在操作水平吗？uIS THE OPERATING TEMPERATURE CORRECT ? 操作温度正确吗？操作温度正确吗？uIS THE RECTIFIER ON ? 整流器开了

212、吗？整流器开了吗？uARE THE CONTACTS CLEAN ? 接触点干净吗接触点干净吗uIS THERE EXCESSIVE FOAM ? 有过多的泡沫有过多的泡沫吗吗uIS THE VOLTAGE & AMPERAGE NORMAL ?电压和电流正常吗？电压和电流正常吗？300AT THE RINSE TANK AT THE RINSE TANK 在漂洗槽在漂洗槽uIS THE RINSE FLOW ADEQUATE ?漂洗水流动充分吗？漂洗水流动充分吗？uIS THE RINSE WATER TOO COLD OR WARM? 漂洗水是否太冷或太热？漂洗水是否太冷或太热？uIS T

213、HE AIR AGITATION WORKING PROPERLY ? 空气搅拌器工作正常吗？空气搅拌器工作正常吗？uIS THERE SCUM ON THE RINSE TANK SURFACE ? 漂洗槽表面有浮渣吗？漂洗槽表面有浮渣吗？uWHAT IS THE pH OF THE RINSE ? 漂洗水的漂洗水的酸碱度是多少？酸碱度是多少？uIS THERE EXCESSIVE FOAM ? 有无过多的有无过多的泡沫？泡沫？301AT THE ACID TANK AT THE ACID TANK 在酸槽中在酸槽中uIS THE TEMPERATURE CORRECT ?温度正确吗？温度正

214、确吗？uIS THE OPERATING LEVEL CORRECT ? 操操作水平正确吗？作水平正确吗？uIS THERE OIL OR SCUM ON THE ACID SURFACE ? 表面是否有油或浮渣表面是否有油或浮渣uIS THE DIP TIME CORRECT ? 浸泡时间正确浸泡时间正确吗？吗？uIS THERE EXCESSIVE FOAM ? 有无过多的有无过多的泡沫？泡沫？302AT THE PLATING TANK AT THE PLATING TANK 在电镀槽中在电镀槽中uIS THE TANK AT OPERATING LEVEL ?槽是否在操作水平？槽是否在

215、操作水平？uIS THE OPERATING TEMPERATURE CORRECT ?操作温度正确吗？操作温度正确吗？uIS THE SOLUTION AT THE PROPER pH ? 溶液在合适的酸碱度范围内吗？溶液在合适的酸碱度范围内吗？uIS THE PLATING RECTIFIER TURNED ON ?电镀的整流器开着吗？电镀的整流器开着吗？uIS THERE SUFFICIENT ANODE AREA ? 有无足够的阳极面积有无足够的阳极面积uARE THE ANODE BASKETS FILLED ? 阳极篮填满了吗？阳极篮填满了吗？uARE THE TANK BUSBA

216、RS CLEAN ? 导电杠清洁吗？导电杠清洁吗？303AT THE PLATING TANK AT THE PLATING TANK 在电镀槽中在电镀槽中uIS THE AGITATION ADEQUATE ? 打气充分吗？打气充分吗？uIS THERE EXCESSIVE FOAM ? 有无过多泡沫有无过多泡沫uIS THERE THE PROPER AMPERAGES ? 安培数是安培数是否正确否正确uDO THE PARTS LOOK NORMAL AFTER PLATING ? 电镀后工件看起来正常吗？电镀后工件看起来正常吗？uARE THE PARTS DULL OR BRIGHT

217、 ? 工件暗还是工件暗还是亮？亮？uIS THE FILTER WORKING PROPERLY ? 过滤器工作过滤器工作正常吗？正常吗？uIS THERE COMPLETE COVERAGE ? 工件完全被覆工件完全被覆盖吗？盖吗？304AT THE FINAL RINSE TANK AT THE FINAL RINSE TANK 在最后的漂洗缸在最后的漂洗缸uIS THE RINSE CLEAN ? 漂洗干净否？漂洗干净否？uIS THE TEMPERATURE CORRECT ?温度正确吗温度正确吗uIS THE RINSE AT THE PROPER OPERATING LEVEL ?

218、是在正确的操作是在正确的操作水平下漂洗吗？水平下漂洗吗？uARE THE PARTS DRY AFTER THE FINAL RINSE TANK ? 最后漂洗完后工最后漂洗完后工件干燥了吗？件干燥了吗？305TROUBLESHOOTING TOOLSTROUBLESHOOTING TOOLS故障处理的工具故障处理的工具CHEMICAL AND PHYSICAL INSTRUMENTATION化学和物理仪器化学和物理仪器306CHEMICAL ANALYSIS EQUIPMENTCHEMICAL ANALYSIS EQUIPMENT 化学分析设备化学分析设备uATOMIC ABSORPTION

219、 SPECTROSCOPY原子吸收光谱原子吸收光谱uUV & VIS SPECTROSCOPY紫外及可见紫外及可见光谱光谱uWET ANALYSIS APPARATUS AND CHEMICALS 湿分析设备和化学品湿分析设备和化学品307PHYSICAL ANALYSIS EQUIPMENT PHYSICAL ANALYSIS EQUIPMENT 物理分析设备物理分析设备uHULL CELL AND RELATED EQUIPMENT赫氏槽和相关设备赫氏槽和相关设备uCENTRIFUGE离心分离机离心分离机uSTALAGMOMETER表面张力（滴重计）表面张力（滴重计）upH METER酸碱

220、度计酸碱度计uMAGNIFYING GLASS OR MICROSCOPE放大镜或显微镜放大镜或显微镜uMAGNET磁铁磁铁308ATOMIC ABSORPTIONATOMIC ABSORPTION原子吸收原子吸收uDETERMINATION OF METALLIC IMPURITIES SUCH AS NICKEL, COPPER, ZINC, ALUMINUM, CHROMIUM etc.确定金属杂质，如：镍、铜、锌、铝、确定金属杂质，如：镍、铜、锌、铝、铬铬309UV, VIS SPECTROSCOPYUV, VIS SPECTROSCOPY紫外、可见光谱紫外、可见光谱uDETERMIN

221、ATION OF ADDITIVES IN NICKEL PLATING SOLUTIONS AND OTHER ORGANIC COMPONENTS ALONG WITH IMPURITIES THROUGH COLOURMETRIC ANALYSIS.通过光度分析镍电镀液中的添加剂和其它有机通过光度分析镍电镀液中的添加剂和其它有机组分中的杂质组分中的杂质.310WET ANALYSISWET ANALYSIS湿分析湿分析uDETERMINATION OF INDIVIDUAL CONSTITUENTS IN A PLATING SOLUTION, CONCENTRATION OF CLEA

222、NERS, ACIDS, CHROMIUM PLATING, NICKEL PLATING, COPPER PLATING AND ZINCATES. 确定镀液中的个体要素，如：清洗剂、确定镀液中的个体要素，如：清洗剂、酸、铬、镍、铜和锌盐的浓度酸、铬、镍、铜和锌盐的浓度311HULL CELLHULL CELL赫氏槽赫氏槽uA 267 ml CAPACITY MINIATURE PLATING CELL THAT PRODUCES A DEPOSIT AT ALL CURRENT DENSITIES WITHIN THE RANGE COVERED IN PRODUCTION在生产中涉及的所

223、有电流密度的范围在生产中涉及的所有电流密度的范围,用用267ml容量容量的小电镀的小电镀HULL CELL槽产生一个镀层模拟槽产生一个镀层模拟.uTHE OPERATING PERIMETERS CAN BE ALTERED TO MEET THE REQUIREMENTS OF PRODUCTION SUCH AS TIME, TEMPERATURE, CURRENT DENSITY AND AGITATION运作的周长能被改变，以满足生产的需要，如：时运作的周长能被改变，以满足生产的需要，如：时间、温度、电流密度和搅拌间、温度、电流密度和搅拌312HULL CELL HULL CELL 赫

224、氏槽赫氏槽ANODE阳极阳极CATHODE阴极阴极AIR GITATION空气搅拌空气搅拌313VALUE OF THE HULL CELLVALUE OF THE HULL CELLuTROUBLESHOOTING 故障处理故障处理uPREVENTATIVE MAINTENANCE 预防性预防性维护维护uPROCESS DEVELOPMENT 工艺研发工艺研发uPROCESS MODIFICATION 工艺改良工艺改良314MEASURABLE PROPERTIES AS A MEASURABLE PROPERTIES AS A FUNCTION OF CURRENT DENSITYFUNC

225、TION OF CURRENT DENSITY 电流密度的测量uBRIGHTNESS光亮光亮uBURNING RANGE烧焦范围烧焦范围uLEVELING填平填平uDUCTILITY延展性延展性uCOVERING POWER覆盖能力覆盖能力uTHROWING POWER均镀能力均镀能力uEFFICIENCY效率效率uAGITATION搅拌搅拌315EFFECTS ON PROPERTIESEFFECTS ON PROPERTIES有关特性的影响有关特性的影响uADDITIVES 添加剂添加剂uCHEMICAL BALANCE 化学平衡化学平衡uTEMPERATURE 温度温度uIMPURITI

226、ES 杂质杂质uCARBON TREATMENT 碳处理碳处理uDUMMY ELECTROLYSIS 假阴极电解假阴极电解uFILTRATION 过滤过滤316METHOD OF HULL CELL TESTMETHOD OF HULL CELL TEST赫氏槽测试的方法赫氏槽测试的方法uUSE CLEAN HULL CELL 使用干净的赫氏槽使用干净的赫氏槽uCLEAN PROPER CATHODE PANEL干净合干净合适的阴极片适的阴极片uSET CONDITIONS FOR PLATING设定电镀设定电镀条件条件- TEMPERATURE 温度温度- CURRENT 电流电流- TIM

227、E 时间时间- AGITATION 搅拌搅拌uPLATE PANEL “AS IS？照原样电镀试片？照原样电镀试片.317CENTRIFUGE CENTRIFUGE 离心分离机离心分离机uUSED TO DETERMINE THE SULPHATE IN A CHROMIUM PLATING BATH AND ALSO USED TO DETERMINE THE SOLIDS IN A MICROPOROUS NICKEL PLATING SOLUTION用来测定铬槽中的硫酸盐，也可测镍封液中的固用来测定铬槽中的硫酸盐，也可测镍封液中的固体体318STALAGMOMETER STALAGMOM

228、ETER 表面张力滴重计表面张力滴重计uUSED TO DETERMINE THE SURFACE TENSION OF A PLATING SOLUTION.用于测镀液中的表面张力用于测镀液中的表面张力uSURFACE TENSION IS THE WETABILITY OF A SOLUTION ON A SURFACE 在某一表面，表面张力是工件表面上溶液可润湿在某一表面，表面张力是工件表面上溶液可润湿性的标志性的标志.uTHE LOWER SURFACE TENSION REDUCES PITTING, ROUGHNESS AND MISTING IN A PLATING BATH镀槽

229、中低的表面张力减少了麻点、粗糙度和薄雾镀槽中低的表面张力减少了麻点、粗糙度和薄雾的出现的出现319pH METER pH METER pHpH计计uUSED TO MEASURE THE pH OF ANY SOLUTION FOR CONTROL OF A PLATING BATH , WASTE TREATMENT 用于测定任何溶液的酸碱度，用于测定任何溶液的酸碱度，以控制镀槽以控制镀槽和和废水处理废水处理uIT MEASURES THE ACIDITY OR ALKALINITY OF A SOLUTION 测量溶液的酸碱度测量溶液的酸碱度320MAGNIFYING INSTRUMENT

230、MAGNIFYING INSTRUMENT放大的设备放大的设备uUSED TO VIEW A DEFECT OF A DEPOSIT THAT CAN NOT BE EASILY SEEN BY THE NAKED EYE用于看镀层中肉眼看不见的疵点用于看镀层中肉眼看不见的疵点uA MAGNIFYING GLASS IS THE CHEAPEST AND MOST HANDY TOOL放大镜是最便宜也最方便的工具放大镜是最便宜也最方便的工具uA STEREO MICROSCOPE IS GOOD FOR 3D VIEWING 立体显微镜可看立体显微镜可看3维图像维图像uAN ELECTRON MICROSCOPE FOR VIEWING FLAWS CLOSE TO ATOMIC SIZE电子显微镜可看到原子大小的疵点电子显微镜可看到原子大小的疵点321MAGNET MAGNET 磁铁磁铁uUSED TO DETERMINE THE MAGNETIC PROPERTIES OF A METAL - FERROUS OR NO FERROUS, NICKEL OR NOT用于测量金属的磁特性用于测量金属的磁特性含铁的或不含铁含铁的或不含铁的，含镍的或不含镍的的，含镍的或不含镍的322ANY QUESTIONS ?ANY QUESTIONS ?有问题吗？有问题吗？323