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1、Mobile Product Deep Dive TrainingPRC ATSPRC ATSMarch. 2007March. 2007All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2 21.笔记本电脑平台基础知识2.英特尔笔记本平台产品线路3.SantaRosa平台深入介绍4.竞争对手比较AgendaAll dates, p
2、lans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice3 3笔记本电脑外观架构笔记本电脑外观架构显示部分显示部分 (A和和B面面)键盘部分键盘部分触摸板触摸板基础功能部分基础功能部分(C和和D面面)光存储光存储部分部分转轴和外盖转轴和外盖All dates, plans, features are preliminary and subject to chan
3、ge without noticeAll dates, plans, features are preliminary and subject to change without notice4 4笔记本结构笔记本结构 (显示部分显示部分)LCD无线天线无线天线LCD 支架支架LCD 支架支架LCD驱动模块驱动模块(Inverter board)转轴（转轴（Hinge）转轴转轴All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are
4、preliminary and subject to change without notice5 5笔记本结构笔记本结构 (基础功能部分基础功能部分)电池模块电池模块不同系统之间结构会有所不同不同系统之间结构会有所不同散热模块散热模块ODDHDD主机板主机板功能扩展卡功能扩展卡（Daughter board）功能扩展卡功能扩展卡（Daughter board）键盘键盘All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are prel
5、iminary and subject to change without notice6 6笔记本结构笔记本结构 (主要部件主要部件)All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice7 7更小的尺寸和封装更小的尺寸和封装方式方式 (PGA/BGA)更多和更深的睡眠更多和更深的睡眠状态状态 (C4, DC4, C6)Intel S
6、peedStep Technology 笔记本处理器主要功能定义笔记本处理器主要功能定义 更低的更低的TDP 2.6kg1.11.8”EX&SVCPU,TDP=35/44W13.3(W),14.1(W),15.4(W)1.82.6kg1.11.4”SVCPU,TDP=34/35W11,12.1(W)1-1.8kg0.851.1”LVCPU,TDP=15/17W111GbEthernetHighspeedwireless(802.11a,wireless-N,UWB,3G,WiMaxetc.)DigitalTVinterface(DVB-T,HDcontent)ExternalHDDExtern
7、alGraphicsCard34mm card标准标准54mm card标准标准1.8” HDIntel不断引领笔记本电脑标准的演化不断引领笔记本电脑标准的演化All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice1313笔记本电脑电池技术笔记本电脑电池技术笔记本电池模块由多个标准Li-ion18650圆柱电池电芯串并联而成标准电池个数
8、4芯，6芯，9芯等连接方法：2串2并，3串2并，3串3并电芯电压/电量(Volt)标准电压3.6or3.7电芯电量(Ah)-1.8/2.0/2.2/2.4/2.6/2.8电池模块容量(example)配置:6芯，3串2并模块电压:11.1=3.7*3模块电流:4.8=2.4*2电池模块总容量(Wh):53=11.1*4.8电池时间（BatteryLife）电池模块总容量(53Wh)平台的总耗电量(13W)4小时=53/13电池充电寿命:70%after300cycles主要笔记本电池技术Li-ion18650akacylindricalLi-ionPrismaticLi-polymer（锂聚合
9、体电池）FuelCell（燃料电池）All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice1414台式电脑台式电脑OEM-ODM合作模式合作模式多个零部件多个零部件ODM厂厂商提供商提供L3服务服务主板主板机箱机箱电源电源台式电脑台式电脑OEM厂商厂商完成系统设计，整完成系统设计，整合和合和L4-L10生产生产笔记本电脑笔记本电脑OEM
10、-ODM合作模式合作模式多个零部件多个零部件ODM厂厂商提供商提供L3服务服务LCD电池电池Barebone ODM厂厂商完成系统设计，商完成系统设计，整合和整合和L4-L7生产生产笔记本电脑笔记本电脑OEM厂厂商完成商完成L8-L10生产生产笔记本电脑笔记本电脑OEM & ODM业务模式业务模式零部件设计生产，零部件设计生产，冲压和模具冲压和模具零部件初级组装，零部件初级组装，喷漆喷漆机壳组装成型机壳组装成型电源，线缆，背电源，线缆，背板组装板组装软驱和系统风扇软驱和系统风扇组装组装主机板组装主机板组装光驱，键盘鼠标光驱，键盘鼠标组装组装扩展卡插入扩展卡插入插入插入CPU和内和内存存插入硬盘
11、，软件插入硬盘，软件安装测试安装测试12345678910OEM-ODM业业务耦合级别务耦合级别All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice1515笔记本电脑笔记本电脑OEM & ODM业务模式业务模式排名ODMMakerShipmentVolume(K)ShipmentShare1Quanta4,72030.0%2Compa
12、l3,97625.3%3Wistron2,47515.7%4Inventec1,74611.1%5Asus8675.5%6Foxconn4552.9%7Uniwill4322.7%8ECS2061.3%9Mitac1801.1%10Arima1791.1%11FIC1531.0%12Clevo1521.0%13MSI1300.8%14Twinhead730.5%Total-15,744100%3Q06 台湾台湾ODM厂商出货排名厂商出货排名一线ODM厂商(500KUperQ)重点聚焦在MNC以及日台系厂商Quanta:DELL,HP,SONY,F/S,LenovoCompal:DELL,HP,
13、Toshiba,LenovoWistron:Think,DELL,HPInventec:HP/Q,ToshibaASUS:80%自有品牌,20%白牌二三线ODM厂商多聚焦在欧洲和大陆LOEM以及渠道白牌市场国内OEM厂商合作TWODM：Uniwill/ECS，Quanta,MSI,Clevo,FIC等Mitac,Arima主要聚焦欧洲市场Unwill和ECS合并案MSI和Clevo65%份额来自渠道白牌市场正在崛起的本土ODM厂商Amoi,Topstar一一线线厂厂商商二二线线厂厂商商三三线线厂厂商商All dates, plans, features are preliminary and
14、subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice16161.笔记本电脑平台基础知识2.英特尔笔记本平台产品线路3.SantaRosa平台深入介绍4.竞争对手比较AgendaAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and s
15、ubject to change without notice17172007年第二季度年第二季度Santa Rosa & Santa Rosa 更新更新平台平台英特尔英特尔英特尔英特尔 酷睿酷睿酷睿酷睿2 2800 MHz 800 MHz MeromMerom英特尔英特尔英特尔英特尔 965GM/PM 965GM/PM 芯片组芯片组芯片组芯片组 (ICH8M)(ICH8M)英特尔英特尔英特尔英特尔 WiFi 4965AGN & WiFi 4965AGN & 4965AG4965AGRobsonRobson大于大于大于大于5 5小小小小时电时电池使用池使用池使用池使用时间时间 2007 San
16、ta Rosa 经济型平台经济型平台赛扬赛扬赛扬赛扬 (Merom-L)(Merom-L)533 533 MhzMhz英特尔英特尔英特尔英特尔 GL960GL960芯片组芯片组芯片组芯片组 (ICH8M)(ICH8M) 2006 Napa 经济型平台经济型平台赛扬赛扬赛扬赛扬 M M (Yonah-SC)(Yonah-SC)533 Mhz533 Mhz英特尔英特尔英特尔英特尔 940GML940GML (ICH7M)(ICH7M)英特尔英特尔英特尔英特尔 943GML943GML芯片组芯片组芯片组芯片组 (ICH7M)(ICH7M)英特尔移动平台基础英特尔移动平台基础英特尔移动平台基础英特尔移
17、动平台基础 2007-2008 2007-2008 展望展望展望展望 目前的平台目前的平台Napa & Napa更新更新 平台平台英特英特英特英特尔尔 酷睿酷睿酷睿酷睿667 MHz667 MHzYonahYonah英特尔英特尔英特尔英特尔 酷睿酷睿酷睿酷睿2 2 667 MHz667 MHzMeromMerom英特尔英特尔英特尔英特尔 945GM/PM 945GM/PM 芯片芯片芯片芯片组组 (ICH7M)(ICH7M)英特尔英特尔英特尔英特尔 PRO/3945ABG PRO/3945ABGPenrynPenryn 800 MHz800 MHz赛扬赛扬赛扬赛扬 MM(Merom-L)(Mer
18、om-L)533 Mhz533 Mhz2005 Sonoma 经济型平台经济型平台4545小小小小时电时电池使用池使用池使用池使用时间时间2008年第二季度年第二季度 Montavina 平台平台PenrynPenryn1066MHz FSB1066MHz FSBCatiga Catiga ICH9M ICH9M 芯片芯片芯片芯片组组Ebron WiMax/WiFiEbron WiMax/WiFiShiloh WiFiShiloh WiFiRobson v2.0Robson v2.0大于大于大于大于6 6小时电池使用时间小时电池使用时间小时电池使用时间小时电池使用时间All dates, pl
19、ans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice1818Q2082008 Montevina PlatformQ2072007 Santa Rosa & Refresh Platform 2007 Santa Rosa Value Platform 2006 Napa-Value Platform英特尔移动平台基础英特尔移动平台基础 2007-2008 2
20、007-2008 展望展望 平台功能演进平台功能演进 Current2006 Napa & Refresh Platform 首个笔首个笔记记本双核本双核处处理器理器 首个笔首个笔记记本酷睿架构本酷睿架构处处理器理器 ( (Napa Napa Refresh/Merom)Refresh/Merom) Intel 3.5Intel 3.5代代图图形核心形核心 双通道双通道 DDR2 667 DDR2 667 内存内存 完整完整产产品品线线支持支持Vista PremiumVista Premium 802.11ABG802.11ABG无无线连线连接接 45 45 电电池使用池使用时间时间2005
21、 Sonoma Value Platform CPUCPU性能增性能增强强技技术术 800 800MHz FSB, MHz FSB, 2GHz, IDA2GHz, IDA 首个首个4 45 5nm CPUnm CPU Penryn ( Penryn (在在SR SR Refresh Refresh 平台上采用，平台上采用，Q108)Q108) IntelIntel第四代第四代图图形核心形核心 ( (500MHz 500MHz 核心，核心，两倍速两倍速3D3D图图形性能形性能) ) Intel Clear Video technology & Intel Clear Video technolo
22、gy & 增增强强 3 3D D 图图形功能形功能 Intel Turbo Memory (512M/1G)Intel Turbo Memory (512M/1G) 最高到最高到300300Mbps Wireless-NMbps Wireless-N Centrino Pro iAMT v2.5Centrino Pro iAMT v2.5 Intel Media Share S/W Intel Media Share S/W 5Hr 5Hr 电电池使用池使用时间时间 CPU CPU 性能增性能增强强技技术术 1066 1066Mhz, Mhz, enhanced IDA, 45nm enhan
23、ced IDA, 45nm Intel Intel 第五代第五代图图形核心，支持形核心，支持DX10 DX10 3D3D图新接口图新接口 集成高清视频硬件解码集成高清视频硬件解码, , 支持支持HD-HD-DVD DVD 和和 Blu-rayBlu-ray规范和规范和LogoLogo 首个首个WiFi-WiMaxWiFi-WiMax二合一卡二合一卡 最高到最高到 450450Mbps Wireless-NMbps Wireless-N Intel Turbo Memory v2.0 Intel Turbo Memory v2.0 (2G/4G, OEM NVM)(2G/4G, OEM NVM)
24、 vPro iAMT v4.0, iTXT, iVT-dvPro iAMT v4.0, iTXT, iVT-d 6Hr 6Hr 电池使用时间电池使用时间 ( (新的新的CPUCPU睡眠睡眠状态状态C6)C6) 基于基于YonahYonah单单核心的核心的赛扬处赛扬处理器理器 Merom-L Merom-L 核心支持核心支持Intel 64 Intel 64 技技术术 Intel 3.5Intel 3.5代代图图形核心形核心 双通道双通道 DDR2 667 DDR2 667 内存内存 完整完整产产品品线线支持支持Vista PremiumVista Premium Merom-L Merom-L
25、 核心支持核心支持Intel 64 Intel 64 技技术术 IntelIntel第四代图形核心第四代图形核心 400MHz400MHz核心核心( (无无Intel Clear Video technology & Intel Clear Video technology & 增增强强 3 3D D 图形功能图形功能) ) 双通道双通道 DDR2 667 DDR2 667 内存内存 完整完整产产品品线线支持支持Vista PremiumVista PremiumAll dates, plans, features are preliminary and subject to change w
26、ithout noticeAll dates, plans, features are preliminary and subject to change without notice1919Q208PenrynPenrynPenrynPenrynPenrynPenrynT7500PenrynT7250Q107Q207Q307Q407Q108ExtremeMainstream Penryn is an Intel internal code name; actual product name TBD. NOTE: Intel processor numbers are not a measur
27、e of performance. Processor numbers differentiate features within each processor family, not across different processor families. See for details.Mobile Processor: RoadmapMobile Processor: Roadmap Performance WW04DC XET7600T7400P1T7600T7400MS3T7500MS2T7300T7500MS1T7100T7250PerformanceT7700T7500T725
28、0Intel Core2 Duo Processor(Napa Refresh)Intel Core2 Extreme processors. Intel Core2 Duo Processor, and Penryn processor (Santa Rosa)T7700T7200T5600T5500T7200T7500T5600T5500T7300T7100T7700T7800INTEL CONFIDENTIALX7800X7900PenrynPenrynPenrynX7900T7800T770025All dates, plans, features are preliminary an
29、d subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2020Q107Q207Q307Q4071H08NOTE: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different process
30、or families. See for details.V3-V1Intel Celeron Processor(Santa Rosa)Mobile Processor: RoadmapSEAM, Legacy and Value WW04520540550 550440540 540Intel Celeron-M Processor(Napa/Napa Refresh)430 530530520440520530530INTEL CONFIDENTIAL27SEAMT5200T2350T2250LegacyT5300T2450T2350 TBD TBDTBDTBDTBD TBD TBDT
31、BD TBDT2080T2060TBDTBDTBDOFF ROADMAP PRODUCTSAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2121Performance and MainstreamValueCurrentThe mobile Intel 965, 945 and 943 Express Chipset Famil
32、ies, with Integrated Graphics, are eligible for the Windows* Vista* Capable PC Program and the Windows* Vista* Premium Ready Logo Program (requires dual channel 2x512MB system memory and adequate memory bandwith to enable Windows Aero* interface on mobile platforms) Mobile Chipset: RoadmapMobile Chi
33、pset: RoadmapConsumer Platforms WW04 Q207Q307945PMDDR2-667/533FSB 667/533ICH7M, ICH7M-DHQ208Q407945GMDDR2-667/533FSB 667/533GFX 250MHzICH7M, ICH7M-DH945GMSDDR2-533FSB 667/533GFX 166 MHzICH7M, ICH7M-DH940GMLDDR2-533FSB 533GFX 166 MHzICH7M943GMLDDR2-533FSB 533GFX 200MHzICH7MGM965DDR2-667/533FSB800/533
34、GFX 500 MHzICH8M, ICH8M-EnhancedPM965DDR2-667/533FSB800/533ICH8M, ICH8M-DHCantiga GMICH9M, ICH9M-EnhancedCantiga PMICH9M, ICH9M-EnhancedGL960DDR2-533FSB 533GFX 400MHzICH8MSmall Form FactorPerformance Discrete GfxPerformance Integrated GfxQ108All dates, plans, features are preliminary and subject to
35、change without noticeAll dates, plans, features are preliminary and subject to change without notice2222WiMax/WifiCurrentMobile Communications: RoadmapMobile Communications: RoadmapPerformance WW04 Q207Q307Q208Q407WLANLANEbron1x2 AGNShiloh 1x2 AGNBoaz Digital OfficeEbron3x3 AGNBoaz FundamentalShiloh
36、 3x3 AGN82566MM82566MC1000PM1000PL4965AGN or AG3945ABG4965AGN3945ABGQ108WWANApply brand name to all version numbersIntel Wireless WiFi Link 4965AGN, Intel Wireless WWAN Link 1965HSD, Intel PRO/Wireless 3945ABG, Intel 82566MM Gigabit Network Connection, Intel 82566MC Gigabit Network Connection, Intel
37、 PRO/1000PM Network Connection, Intel PRO/1000PL Network Connection RoadmapsRoadmapsAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice23231.笔记本电脑平台基础知识2.英特尔笔记本平台产品线路3.SantaRosa平台深入介绍4.竞争对手比较Ag
38、endaAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2424SantaRosa平台销售卖点卓越的性能卓越的性能酷睿微架构大于2.0G主频(从07年4季度开始)800MHz前端总线英特尔动态加速技术(参考本文技术章节）2倍的图形处理性能倍的图形处理性能英特尔GMAX3100图形芯片增强3D处理能力,500MHzGFX核心频率清晰
39、视频技术提高显示质量，加速高清晰视频流畅回放Vista*钻石版全面支持supportsAeroGlassRobson 基于磁盘缓存技术的闪存基于磁盘缓存技术的闪存 (Flash Based Disk Caching)提高系统响应和延长电池使用时间提高系统响应和延长电池使用时间5倍无线带宽和倍无线带宽和2倍无线覆盖范围倍无线覆盖范围支持支持 802.11n 技术技术 下一代无线通讯技术下一代无线通讯技术新平台支持电池时间延长新平台支持电池时间延长(EBL) 技术，更长电池使用时间技术，更长电池使用时间大于5小时，动态FSB转换,更深度的处理器休眠，更低频运行模式All dates, plans,
40、 features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2525Santa Rosa平台处理器平台处理器Merom的特点的特点更高性能，更高的每瓦特性能更高性能，更高的每瓦特性能更高性能，更高的每瓦特性能更高性能，更高的每瓦特性能英特尔英特尔英特尔英特尔 酷睿酷睿酷睿酷睿 微架构微架构微架构微架构宽宽位位位位动态执动态执行行行行高高高高级级数字媒体增数字媒体增数字媒体增数
41、字媒体增强强智能内存智能内存智能内存智能内存访问访问高高高高级级智能高速智能高速智能高速智能高速缓缓存存存存智能功率智能功率智能功率智能功率调节调节IntelIntel 64 64性能性能性能性能领领先先先先2M/4M 2M/4M 二二二二级级高速高速高速高速缓缓存存存存800MHz FSB800MHz FSBIntel Dynamic AccelerationIntel Dynamic Acceleration提高性能和提高性能和提高性能和提高性能和电电源管理源管理源管理源管理 性能数据性能数据性能数据性能数据All dates, plans, features are preliminar
42、y and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2626下一代下一代45nm处理器处理器Penryn的主要增强功能的主要增强功能增强特性功能优势更深度的处理器休眠状态C6state在同样的平均功耗下提供更高性能;在休眠状态下近乎零功耗47新SSE多媒体指令集兼容SSE4.1在视频压缩，图像编辑和游戏上的性能提升（10%）增强的微架构,50%更大的on-die缓存容量提升计算性能单核心的加速模式针对单线程应用性能
43、提升10%PenrynMeromAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2727工作原理:应用条件：在双、多核处理器上，执行单线程应用或多线程串行编码的应用；-一个核心空闲(C3orlower)and另一个使用-当只有单一串行指令的应用程序运行时，IDA发挥作用-虽然多个应用程序被打开，但是处于“idle”状态，此时IDA
44、起作用-一些运行于后台的应用程序，采用了多任务模式，影响IDA发挥作用(ITupdates,Securityscans,OSactivities,compiling,HDDbackup,etc)好处:-提供额外的处理能力 -维持散热设计SV35W，LV17W和ULV10W-应用于薄轻型笔记本,中小型平板电脑当运行单一串行指令时，处理器在一个核心上提供额外的处理能力当运行单一串行指令时，处理器在一个核心上提供额外的处理能力英特尔迅驰平台技术应用：英特尔英特尔迅驰平台技术应用：英特尔 动态加速技术动态加速技术(IDA)All dates, plans, features are prelimina
45、ry and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2828MPEG-2 and WMV9MPEG-2 and WMV9内容流内容流畅畅回放回放增增强强高清晰高清晰视频视频 英特尔英特尔 清晰视频技术清晰视频技术 在英特尔在英特尔 GM965 高速芯片组应用高速芯片组应用减少静噪和减少静噪和动动噪影响噪影响色彩和光照色彩和光照调节调节HDTV, HDMI, DVI, Intel TV WizardHDTV, HD
46、MI, DVI, Intel TV Wizard锐丽锐丽画面画面质质量量绚丽绚丽色彩色彩高高级显级显示接口示接口英特尔迅驰平台技术应用：增强视频体验英特尔迅驰平台技术应用：增强视频体验All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice2929增强的增强的3D图形性能图形性能支持支持Shader Mode 3.0Shader Mode
47、 3.03D3D游游戏编戏编程接口，程接口，实现实现更加真更加真实实的的3D3D效果效果提升游提升游戏戏性能，减少性能，减少CPUCPU在在3D3D处处理上的消耗，从而理上的消耗，从而可以更可以更专专注在游注在游戏戏AIAI上；提升游上；提升游戏戏兼容性兼容性硬件透硬件透视视和光影和光影处处理理(T&L)(T&L)对对高高动态动态光影光影处处理更加真理更加真实实化化 ( (爆炸爆炸, , 强强光源光源, , 流体流体折射和反射等折射和反射等处处理理) )全精度的浮点全精度的浮点处处理理增强的增强的3D图形性能图形性能 在英特尔在英特尔 GM965 高速芯片组应用高速芯片组应用性能数据性能数据性
48、能数据性能数据All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice30301.1.两倍速度提升：应用程序调用和运行两倍速度提升：应用程序调用和运行2.2.两倍速度提升：从休眠到启动两倍速度提升：从休眠到启动3.3.0.4W0.4W系统级节电系统级节电英特尔迅驰平台技术应用：英特尔迅驰平台技术应用： Robson 技术技术Robson
49、支持支持读写写缓存存通过MicrosoftReadyBoost和ReadyDive技术实现性能提高，电池时间加长性能提高，电池时间加长Robson 减少硬盘访问，节省电减少硬盘访问，节省电力，提升系统性能力，提升系统性能All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice3131Robson 解决了什么问题解决了什么问题操作系统命令D
50、isk读读写写Robson是基于硬盘缓存技术的non-volatilememory没有Robson,硬盘不得不频繁旋转由于机械的延迟对性能造成影响由于频繁的硬盘旋转对功耗造成影响All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice3232ReadNVMRobsonCacheWriteNVMRobson 性能以及更好的电池使用时间性能以
51、及更好的电池使用时间写写(在空闲时)读 (ifmiss)操作系统命令Disk读写Robson通过MS的ReadyBoost*和ReadyDrive*技术支持读写缓存Robson Robson 减少磁盘访问，节省电能和提高系统性能减少磁盘访问，节省电能和提高系统性能性能数据性能数据性能数据性能数据All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without
52、notice3333Lenovo Test Result on Intel CRB. 系统和Robson完全按照文档NDARobsonES2AlphaPerformance08Dec2006.pdf中的推荐配置,1G的Robson在CRB上的测试结果：一、ApplicationLoadandRun-TimePerformance：1）无Robson：58.258.654.954.855.248.953.8；平均时间-55.02)有Robson：20.815.116.718.218.319.219.2；平均时间-18.2结论：系统存在Robson时，性能大约提高3.1倍左右上次的测试时,系统没有
53、安装游戏模拟人生2,用PhotoShop多打开了几张大的图片,所以系统不能并行运行。这次测试,没有找到模拟人生2，安装了实况足球2006和CS1.5两个游戏用来代替，系统反而可以并行运行几个测试程序。这两次的具体测试脚本见附件。All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice3434Expected Hybrid Hard Dri
54、ve Capabilities at Vista LaunchRobson offers everything the Hybrid drive does, and moreAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice3535Intel 新一代新一代Wireless-N技术技术高达5X的传输吞吐量,2X的覆盖范围最高可节省1个
55、小时电池寿命同时支持2.4GHzand5GHz可支持高清视频和音频流的实时传输英特尔ConnectwithCentrinoAP认证计划保证最大的兼容性Connect with ConfidencePerformance compares preproduction hardware to prior generation Intel components. Graphics performance measured by 3DMark06. Power savings (average power) compared to previous generation Intel component
56、s. Actual performance may vary. See for details.802.11N目前处在IEEE草案阶段，其核心技术是MIMOMIMOMulti-input&Multi-output,多路输入和输出技术，采用多发射和接受端子同时工作技术，从而实现高带宽，2x3技术可实现300Mbps带宽，未来3x3技术可实现450Mbps带宽All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminar
57、y and subject to change without notice3636Intel Wireless WiFi Link 4965AGN (Kedron)介绍介绍功能描述功能描述SKUs4965AGN&4965AG可管理性可管理性IntelActiveManagementTechnology(AMT)2.5主要功能主要功能Performance(802.11n*),wirelesssupportforIntelAMT尺寸尺寸SingleSidedPCIe*MiniCard商务机的安全性商务机的安全性Cisco*ClientExtensions(futureversions)&Bus
58、inessClassWirelessSuitev2Intel软件软件Lisbon软件兼容性软件兼容性KedronDiver&applicationsbackwardscompatiblewith3945ABGNetworkConnection*DependentonIEEEstandardsratification*Othernamesandbrandsmaybeclaimedasthepropertyofothers.Intelmaymakechangestospecificationsandproductdescriptionsatanytime,withoutnotice.All dat
59、es, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice3737Intel Next-Gen Wireless-N 性能和覆盖范围性能和覆盖范围Data Rate(bigger is better)802.11a/gDraft-N保证高清视频流(HiDef video 19 Mbps)的最远距离2xRangeVideo68mDatacloserange
60、Up to 5xFasterAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice3838Intel Centrino Duo Mobile Technology with Intel Next-Gen Wireless-N improves battery life!See appendix for system configurat
61、ions. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should
62、consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit *Third party brands and names are the property of their respective owners.Intel Centri
63、no Mobile Technology with Intel Next-Gen Wireless-N enables great battery life!All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice39391.笔记本电脑平台基础知识2.英特尔笔记本平台产品线路3.SantaRosa平台深入介绍4.竞争对手比较AgendaA
64、ll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice40402007: 笔记本处理器和平台技术定位和竞争态势笔记本处理器和平台技术定位和竞争态势CPUGoodGood SPP 5499SPP 7999SPP 7999( (OFF ROADMAP)OFF ROADMAP)SPP 5999-6999SPP 5999-6999Platform
65、Comp. 竞争争对手无手无对应产品品 Intel在移在移动计算的各个算的各个纬度都保持度都保持领先先 TL-6x TL-5x Mobile Turion ML-3x Mobile Sempron 3xxx+All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice4141Intel在所有移动计算的纬度上领先技术在所有移动计算的纬度上领先技
66、术性能和图形性能和图形性能和图形性能和图形1.1.IntelIntel双核，单核和赛扬处理器在主双核，单核和赛扬处理器在主双核，单核和赛扬处理器在主双核，单核和赛扬处理器在主要要要要BenchmarkBenchmark测试保持绝对领先地测试保持绝对领先地测试保持绝对领先地测试保持绝对领先地位位位位 PCMark, Sysmark PCMark, Sysmark2.2.IntelIntel图形和视频性能建立领先地位图形和视频性能建立领先地位图形和视频性能建立领先地位图形和视频性能建立领先地位3.3.IntelIntel目前全系列移动芯片组支持目前全系列移动芯片组支持目前全系列移动芯片组支持目前全
67、系列移动芯片组支持Vista Premium Aero GlassVista Premium Aero Glass电池使用时间电池使用时间电池使用时间电池使用时间1.1.在处理器平均功耗的领先地位在处理器平均功耗的领先地位在处理器平均功耗的领先地位在处理器平均功耗的领先地位2.2.多达多达多达多达1 1小时电池寿命的提升小时电池寿命的提升小时电池寿命的提升小时电池寿命的提升 v.s. v.s. AMD TurionAMD Turion3.3.多达多达多达多达1010种以上的平台节电技术种以上的平台节电技术种以上的平台节电技术种以上的平台节电技术轻薄的外观轻薄的外观轻薄的外观轻薄的外观1.1.处
68、理器处理器处理器处理器(35W)(35W)，芯片组，芯片组，芯片组，芯片组(8W)(8W)，无线，无线，无线，无线网络网络网络网络(0.2W)TDP(0.2W)TDP的领先地位的领先地位的领先地位的领先地位2.2.全系列处理器方案全系列处理器方案全系列处理器方案全系列处理器方案SV(35W), SV(35W), LV(17W), ULV (DC/9W, SC/5.5)LV(17W), ULV (DC/9W, SC/5.5)3.3.CPU, chipsetCPU, chipset和无线网卡更小的封和无线网卡更小的封和无线网卡更小的封和无线网卡更小的封装方式装方式装方式装方式无线连接无线连接无线连
69、接无线连接1.1.高带宽，大覆盖和低功耗的高带宽，大覆盖和低功耗的高带宽，大覆盖和低功耗的高带宽，大覆盖和低功耗的Wireless-NWireless-N技术技术技术技术2.2.商业级的安全性商业级的安全性商业级的安全性商业级的安全性 - CCX- CCX3.3.同时适应有线和无线网络的主动式同时适应有线和无线网络的主动式同时适应有线和无线网络的主动式同时适应有线和无线网络的主动式管理技术管理技术管理技术管理技术All dates, plans, features are preliminary and subject to change without noticeAll dates, pl
70、ans, features are preliminary and subject to change without notice4242ENDCopyright2006,IntelCorporation*OthernamesandbrandsmaybeclaimedasthepropertyofothersIntel Confidential NDA use only09.14.05Verdana Bold 8 in hendrerit in vulputate velit esse molestie consequat, vel illum dolore eu feugiat 43Int
71、el Core2 Duo mobile processors - Consumer PerformancePerformance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuratio
72、n may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http:/ Source: Intel. Test configuration
73、s in the AppendixBenchmark:PCMark*2005-CPUIntel Core Duo processor T2400 (1.83GHz, 2MB L2)4274Intel Core Duo processor T2500 (2.00GHz, 2MB L2)Intel Core Duo processor T2600 (2.16GHz, 2MB L2)46605057Intel Core Duo processor T2700 (2.33GHz, 2MB L2)5443AMD* Turion* 64 X2 TL 60 (2.00GHz, 1M L2)4030 Inte
74、l CoreTM 2 Duo processors are on a class of their own for consumer performance!Intel Core 2 Duo processor T5500 (1.66GHz, 2MB L2)4275Intel Core 2 Duo processor T5600 (1.83GHz, 2MB L2)4699Intel Core 2 Duo processor T7200 (2.00GHz, 4MB L2)5099Intel Core 2 Duo processor T7400 (2.16GHz, 4MB L2)5535Intel
75、 Core 2 Duo processor T7600 (2.33GHz, 4MB L2)5950 AMD mobile processors are notable to compete head-to-head with Intel Core 2 Duo processors!SEAM SKUSIntel Core 2 Duo processor T5200 (1.60GHz, 2MB L2)4091Copyright2006,IntelCorporation*OthernamesandbrandsmaybeclaimedasthepropertyofothersIntel Confide
76、ntial NDA use only09.14.05Verdana Bold 8 in hendrerit in vulputate velit esse molestie consequat, vel illum dolore eu feugiat 44Intel Core2 Duo mobile processors Productivity PerformanceBenchmark: SYSmark*2004 SEIntel Core Duo processor T2400 (1.83GHz, 2MB L2)205Intel Core Duo processor T2500 (2.00G
77、Hz, 2MB L2)Intel Core Duo processor T2600 (2.16GHz, 2MB L2)218229Intel Core Duo processor T2700 (2.33GHz, 2MB L2)239 Intel CoreTM 2 Duo processors are on a league of their own when it comes to productivity performance!Intel Core 2 Duo processor T5500 (1.66GHz, 2MB L2)213Intel Core 2 Duo processor T5
78、600 (1.83GHz, 2MB L2)228Intel Core 2 Duo processor T7200 (2.00GHz, 4MB L2)246Intel Core 2 Duo processor T7400 (2.16GHz, 4MB L2)260Intel Core 2 Duo processor T7600 (2.33GHz, 4MB L2)272AMD* Turion* 64 X2 TL 60 (2.00GHz, 1M L2)194Performance tests and ratings are measured using specific computer system
79、s and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or
80、components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http:/ Source: Intel. Test configurations in the AppendixIntel Core 2 Duo processor T5200 (1.60GHz, 2MB L2)204No current AMD mobile processors areable to compete head
81、-to-head with Intel Core 2 Duo processors!SEAM SKUSCopyright2006,IntelCorporation*OthernamesandbrandsmaybeclaimedasthepropertyofothersIntel Confidential NDA use only09.14.05Verdana Bold 8 in hendrerit in vulputate velit esse molestie consequat, vel illum dolore eu feugiat 45Intel CoreDuo processors
82、- Consumer PerformanceBenchmark:PCMark*2005-CPUIntel Core Duo processor T2400 (1.86GHz, 2MB L2)42743901Intel Core Duo processor T2500 (2.00GHz, 2MB L2)Intel Core Duo processor T2600 (2.16GHz, 2MB L2)46605057Intel Core Duo processor T2700 (2.33GHz, 2MB L2)5443AMD* Turion* 64 X2 TL 50 (1.60GHz, 512k L
83、2)3228AMD* Turion* 64 X2 TL 52 (1.60GHz, 1MB L2)3248AMD* Turion* 64 X2 TL 56 (1.80GHz, 1MB L2)3618AMD* Turion* 64 X2 TL 60 (2.00GHz, 1MB L2)4030 Intel CoreTM Duo processors are clearly ahead on consumer performance!Intel Core Duo processor T2050 (1.60GHz, 2MB L2)3728 * Only Intel Core Duo processor
84、T2300 was measured. Performance fro T2300 on PCMark*2005 CPU is equal to T2300E Source: Intel. Test configurations in the AppendixSEAM SKUSIntel Core Duo processor T2250 (1.73GHz, 2MB L2)4050Intel Core Duo processor T2300/T2300E* (1.66GHz, 2MB L2)Performance tests and ratings are measured using spec
85、ific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the perfor
86、mance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http:/ Copyright2006,IntelCorporation*OthernamesandbrandsmaybeclaimedasthepropertyofothersIntel Confidential NDA use only09.14.05Verdana Bold 8 in
87、 hendrerit in vulputate velit esse molestie consequat, vel illum dolore eu feugiat 46Benchmark: SYSmark*2004 SE-OverallIntel Core Duo processor T2400 (1.86GHz, 2MB L2) 205194Intel Core Duo processor T2500 (2.00GHz, 2MB L2)Intel Core Duo processor T2600 (2.16GHz, 2M L2)218229Intel Core Duo processor
88、T2700 (2.33GHz, 2MB L2)239AMD* Turion* 64 X2 TL 50 (1.6GHz, 512k L2)165AMD* Turion* 64 X2 TL 52 (1.6GHz, 1MB L2)166AMD* Turion* 64 X2 TL 56 (1.8GHz, 1MB L2)180AMD* Turion* 64 X2 TL 60 (2.0GHz, 1MB L2)194Intel CoreTM Duo processors are clearly ahead when it comes to business productivity performance!
89、Intel CoreDuo processors - Productivity PerformanceIntel Core Duo processor T2050 (1.60GHz, 2MB L2)185Intel Core Duo processor T2250 (1.73GHz, 2MB L2)197Intel Core Duo processor T2300/T2300E* (1.66GHz, 2MB L2) * Only Intel Core Duo processor T2300 was measured. Performance fro T2300 on SYSMark* 2004
90、 SE is equal to T2300E Source: Intel. Test configurations in the AppendixPerformance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software de
91、sign or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http:/ SEAM SKUSCopy
92、right2006,IntelCorporation*OthernamesandbrandsmaybeclaimedasthepropertyofothersIntel Confidential NDA use only09.14.05Verdana Bold 8 in hendrerit in vulputate velit esse molestie consequat, vel illum dolore eu feugiat 47Intel Celeron M processor 410 (1.46GHz, 1M L2)2425Intel Core Solo processor T130
93、0 (1.66GHz, 2M L2)2747Mobile AMD* Sempron* 3100+ (1.80GHz, 256K L2)AMD* Turion* 64 ML 34 (1.80GHz, 1MB L2)AMD* Turion* 64 ML 37 (2.00GHz, 1MB L2)287326052573AMD* Turion* 64 ML 32 (1.80GHz, 512K L2)2602AMD* Turion* 64 ML 30 (1.60GHz, 1MB L2)2319Intel Celeron M processor 420 (1.60GHz, 1M L2)2638Single
94、 Core Consumer Mobile Performance Benchmark:PCMark*2005-CPUIntel Core Solo processor T1400 (1.83GHz, 2M L2)3002AMD* Turion* 64 MK 36 (2.00GHz, 512K L2) 2873Intel Celeron M processor 430 (1.73GHz, 1M L2)2852Mobile AMD* Sempron* 3300+ (2.00GHz, 128K L2)2798Mobile AMD* Sempron* 3200+ (1.60GHz, 512K L2)
95、2296Mobile AMD* Sempron* 3400+ (1.80GHz, 256K L2)2520Intel Celeron M processor 450 (2.00GHz, 1M L2)3266AMD* Turion* 64 ML 40 (2.20GHz, 1MB L2)3176Intel Celeron M processor 380 (1.60GHz, 1M L2)2563Intel Celeron M processor 440 (1.86GHz, 1M L2)3029Mobile AMD* Sempron* 3500+ (1.80GHz, 512K L2)2583Perfo
96、rmance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult oth
97、er sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http:/ Source: Intel. Test configurations in the AppendixSEAM SKUSIntel Core Solo processor T1350
98、(1.86GHz, 2M L2)3087Copyright2006,IntelCorporation*OthernamesandbrandsmaybeclaimedasthepropertyofothersIntel Confidential NDA use only09.14.05Verdana Bold 8 in hendrerit in vulputate velit esse molestie consequat, vel illum dolore eu feugiat 48Intel Celeron M processor 410 (1.46GHz, 1M L2)130Intel C
99、ore Solo processor T1300 (1.66GHz, 2M L2)149Mobile AMD* Sempron* 3100+ (1.80GHz, 128K L2)AMD* Turion* 64 ML 34 (1.80GHz, 1MB L2)148141107AMD* Turion* 64 ML 32 (1.80GHz, 512K L2)138AMD* Turion* 64 ML 30 (1.60GHz, 1MB L2)130Intel Celeron M processor 420 (1.60GHz, 1M L2)138Single Core Productivity Perf
100、ormance Benchmark:SYSmark* 2004 SE - OverallIntel Core Solo processor T1400 (1.83GHz, 2M L2)157AMD* Turion* 64 MK 36 (2.00GHz, 512K L2)147Intel Celeron M processor 430 (1.73GHz, 1MB L2)146111Mobile AMD* Sempron* 3300+ (2.00GHz, 128K L2)AMD* Turion* 64 ML 37 (2.00GHz, 1MB L2)Mobile AMD* Sempron* 3200
101、+ (1.60GHz, 512K L2)128Mobile AMD* Sempron* 3400+ (1.80GHz, 256K L2)136Intel Celeron M processor 450 (2.00GHz, 1M L2)158AMD* Turion* 64 ML 40 (2.20GHz, 1MB L2)158Intel Celeron M processor 380 (1.60GHz, 1M L2)117Intel Celeron M processor 440 (1.86GHz, 1MB L2)152Mobile AMD* Sempron* 3500+ (1.80GHz, 51
102、2K L2)138Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers shou
103、ld consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http:/ Source: Intel. Test configurations in the AppendixIntel Core Solo processor T
104、1350 (1.86GHz, 2M L2)158SEAM SKUSIntelConfidentialInternalUseOnly49CPU Power ComparisonsMeromMerom2.0GHz/4MB2.0GHz/4MBTurion*64 X2Turion*64 X22.0GHz/2x512K2.0GHz/2x512KBulldozer Bulldozer 65nm65nmIdleIdleSleep StateSleep State0.45-0.50.45-0.5WWDC4DC40.8-1.20.8-1.2WWC3C30.50.5WWC4C4MobileMark*2005 Mo
105、bileMark*2005 Office ProductivityOffice Productivity(Average power)(Average power)1.11.1WW1.26-1.841.26-1.84WWTBDTBDCPU Power (W)AMDs current processors today are uncompetitive in idleand average powerExpect “bulldozer” to catchup to Merom on idle power and potentially average powerwith C4 support A
106、MD claims that with C4, theycan achieve 0.5W idle power vs.Merom at 0.45W.IntelConfidentialNDAonlyMobileMark* 2005 Office Productivity (Battery Life in Minutes) Battery Life. More Freedom.* As measured by MobileMark* 2005 Office ProductivityOutstanding Battery LifeOutstanding Battery Life vs. compet
107、ition vs. competition* *43 Watt hour43 Watt hourNormalized to AMD* Turion* 64 X2 TL-60Over 1 hour longer!AMD*Turion*64X2processor-basednotebookwithTL-60processor(2.0GHz,2x512KL2)Compaq*Presario*V3000zIntelCentrinoDuomobiletechnologyplatformwithIntelCoreTMDuoprocessorT2500(2.0GHz,2MBL2,667MHzFSB)Comp
108、aq*Presario*V3000tSource: IntelCorporation.Configuration: Intel Core Duo processor T2500, withIntel945GMExpressChipsetonCompaq*Presario*v3000t,BIOSV.F.05withdefaultsettings,GraphicsIntelGraphicsMediaAccelerator(GMA) 950 with128MBDynamicVideoMemoryTechnology,graphicsdriverIntel6.14.10.4543,IntelChips
109、etSoftwareInstallationFile(INF)7.1.0,WirelessNetworkIntelPRO/Wireless3945ABGwithdriver10.1.0.15, NetworkCardIntelPRO/1000VE,NetworkcarddriverV8.0.19.0.HDD80GB5400rpmSATAWesternDigital*WD800BEVS,MemoryHynix*2x512MBDDR2-5334-4-4-12.AMD* Turion* 64 X2 TL-60, withnVidia*GeForce*Go6150ChipsetonCompaq*Pre
110、sario*v3000z,BIOSHPV.F.06withdefaultsettings,GraphicsintegratednVidia*GeForceGo*6150with256MBsharedmemory,graphicsdriverNVIDIA*V.8.4.6.1,WirelessNetworkBroadcom*802.11a/b/gWLAN,driverBroadcom*V.4.10.40.1,NetworkCardIntegratedBroadcom*Ethernet,NetworkcarddriverNVIDIA*V.50.2.4.0.HDD80GB5400rpmSATAHita
111、chi*Travelstar*HTS541080G9SA00,MemorySamsung*DDR2-5334-4-4-12. All Platforms: Screensize14.1”WXGATFT.ScreenResolution1024x768Screen32bit,Microsoft*Windows*XPProfessional*Build2600onNTFSfilesystemSP2, Microsoft*DirectX*9.0c,Weight5.75lbs,PowerManagementsettoAlwaysOnforallbenchmarks.IntelCompetitionMi
112、nutesPerformancetestsandratingsaremeasuredusingspecificsystemsand/orcomponentsandreflectapproximateperformanceofIntelproductsasmeasuredbythosetests.Anydifferenceinsystemhardware,software,orconfigurationmayaffectactualperformance.Buyersshouldconsultothersourcesofinformationtoevaluateperformanceofsyst
113、emsorcomponentstheyareconsideringpurchasing.FormoreinformationonperformancetestsandperformanceofIntelproducts,visithttp:/ Strictly No Leave BehindsNote:AboveBenchmarksarebasedonNapaRefreshversionsofCore2Duo.SantaRosaupdatespendingAll dates, plans, features are preliminary and subject to change witho
114、ut noticeAll dates, plans, features are preliminary and subject to change without notice5151Summary: Santa Rosa EBL Techniques TechnologyTechnologyFeature/BenefitsFeature/BenefitsAvg Pwr Avg Pwr SavingsSavings1 1BOM BOM AdderAdder2 2D D2 2PO* PanelsPO* PanelsEnablessupportforinterlacedlocalD2POflatp
115、anelstoreducepowerconsumptionbydynamicallyswitchingbetweenprogressiveandinterlacedscanmodesbasedoncontentandpowerpolicy400mWConsultPanelVendorLCD Refresh Rate LCD Refresh Rate SwitchingSwitchingSupportslowerrefreshrateswhenpowermodechangesfromACtoDCtoreducepowerconsumption200mW$0IntelIntel DPST 3.0
116、DPST 3.0Maintainsvisualexperiencebymanagingdisplayimagebrightnessandcontrastwhileadaptivelydimmingbacklighttoreducedisplaybacklightpower.Improvedcolor&accuracyoverDPST2.0400mW$0RobsonRobsonNon-volatilememorydiskcachingtechnologyreducingHDDactivity400mWTBDIntel Matrix Storage Intel Matrix Storage Man
117、ager 7.0Manager 7.0EnablesAHCILinkPowerManagement(LPM)tosavepowerbyplacinglinkbetweenICHandHDD/ODDdevicestosleepduringperiodsofinactivity400mW$0Intel ACBSIntel ACBSShutsdownGbEcontrollerpowerrailswhennoLANcablepresentandautomaticallypowersonwhencableinsertedtoreducepowerconsumption100mW$0.20AC/DC Li
118、nk StepAC/DC Link StepLANLinkspeedautomaticallyadjustedwhenpowermodechangesfromACtoDCtoreducepowerconsumption(1000MBPSonAC,10/100MBPSonDC)Upto950mw$0Graphics Render Graphics Render StandbyStandbyAllowsrenderenginetoenterstandbyduringtimesofinactivity,enablesaveragepowersavingsbydynamicallyloweringre
119、ndercorevoltage105mW$2-3Santa Rosa offering Significant Platform Average Santa Rosa offering Significant Platform Average Power Savings OpportunitiesPower Savings OpportunitiesNEWNEWNEWNEWNEWNEWNEWNEWNEWNEWEnhancedEnhancedEnhancedEnhancedNEWNEW33WWAll dates, plans, features are preliminary and subje
120、ct to change without noticeAll dates, plans, features are preliminary and subject to change without notice5252PCMark*2005 OverallPCMark*2005 OverallIntel Centrino Duo: Powering the Next Generation Mobile Consumer PlatformPCMark*2005 CPUPCMark*2005 CPUIntel Centrino Duo, Intel Core2 Duo T7600 (2.33GH
121、z, 4MB L2, 667MHz FSB), Mobile Intel 945GM Express ChipsetIntel Centrino Duo, Intel Core Duo T2700 (2.33GHz, 2MB L2, 667MHz FSB), Mobile Intel 945GM Express ChipsetNext-Generation Intel Centrino Platform, Intel Core2 Duo T7700 (2.40GHz, 4MB L2, 800MHz FSB), Mobile Intel GM965 express (Crestline-GM)
122、ChipsetTheabovemeasurementsarebasedoncustomerreferenceboards.Theseboardsaredesignedforengineeringvalidationandnotvolumeproduction.Performanceandpowertestsandratingsarehigh-confidencemeasurementsusingspecificcomputersystemsand/orcomponentsandreflecttheapproximateperformanceofIntelproductsasmeasuredby
123、thosetests.Anydifferenceinsystemhardwareorsoftwaredesignorconfigurationmayaffectactualperformance” Performancetestsandratingsaremeasuredusingspecificsystemsand/orcomponentsandreflectapproximateperformanceofIntelproductsasmeasuredbythosetests.Anydifferenceinsystemhardware,software,orconfigurationmaya
124、ffectactualperformance.Buyersshouldconsultothersourcesofinformationtoevaluateperformanceofsystemsorcomponentstheyareconsideringpurchasing.FormoreinformationonperformancetestsandperformanceofIntelproducts,visit/ Enhanced Performance to Enjoy a Rich Digital Enhanced Performance to Enjoy a Rich Digital
125、 Entertainment Experience On The GoEntertainment Experience On The GoSYSmark*2004 SE OfficialSYSmark*2004 SE OfficialAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice5353HighQualityGraphicsPe
126、rformance:TheFutureMark*3Dmark*05benchmarkcombinesthelatestDirectX*9.0supportwithuniqueandupdatedhighqualitygame,image&soundtestsandgraphics.ItisthefirstbenchmarktorequireaDirectX9.0complianthardwarewithsupportforPixelShaders2.0orhigher!3DMark*06istheworldwidestandardinadvanced3Dgameperformancebench
127、marking.Itusesadvancedreal-time3DgameworkloadstomeasurePCperformanceusingasuiteofDirectX93Dgraphicstests,CPUtests,and3Dfeaturetests.3DMark06testsincludeallnewHDR/SM3.0graphicstests,SM2.0graphicstests,AIandphysicsdrivensingleandmultiplecoresorprocessorCPUtestsandacollectionofcomprehensivefeaturetests
128、toreliablymeasurenextgenerationgamingperformancetoday.3 3DMark*2005 OverallDMark*2005 OverallCrestline-GM: The Next Generation Mobile Integrated Graphics Chipset* CPU frequencies normalized for this graphics-centric comparison3 3DMark*2006 OverallDMark*2006 OverallGen4 Gfx Delivering 2x Gain!Intel C
129、entrino Duo, Intel Core2 Duo T7600 (2.33GHz, 4MB L2, 667MHz FSB), Mobile Intel 945GM Express ChipsetIntel Centrino Duo, Intel Core Duo T2700 (2.33GHz, 2MB L2, 667MHz FSB), Mobile Intel 945GM Express ChipsetNext-Generation Intel Centrino Platform, Intel Core2 Duo T7700 (2.40GHz, 4MB L2, 800MHz FSB),
130、Mobile Intel GM965 express (Crestline-GM) ChipsetEnhanced 3D Performance with Crestline Gen 4 Graphics!Enhanced 3D Performance with Crestline Gen 4 Graphics!Theabovemeasurementsarebasedoncustomerreferenceboards.Theseboardsaredesignedforengineeringvalidationandnotvolumeproduction.Performanceandpowert
131、estsandratingsarehigh-confidencemeasurementsusingspecificcomputersystemsand/orcomponentsandreflecttheapproximateperformanceofIntelproductsasmeasuredbythosetests.Anydifferenceinsystemhardwareorsoftwaredesignorconfigurationmayaffectactualperformance” Performancetestsandratingsaremeasuredusingspecifics
132、ystemsand/orcomponentsandreflectapproximateperformanceofIntelproductsasmeasuredbythosetests.Anydifferenceinsystemhardware,software,orconfigurationmayaffectactualperformance.Buyersshouldconsultothersourcesofinformationtoevaluateperformanceofsystemsorcomponentstheyareconsideringpurchasing.Formoreinfor
133、mationonperformancetestsandperformanceofIntelproducts,visit/ System Configuration Details All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice5454Source: Intel.Configuration: Baseline Platform I
134、ntelCore2DuoX66002.66GProcessorandIntelBearlakeChipset,1GB(2x512MB)DDRII800;Hitachi*HitachiDeskstarHTD7225(160G)3GB/sSATAHardDrive,7200rpmSATAharddiskdrive;WindowsVista*RTM, IntelMatrixStorageManager7.5Alpha,Robson1.0Alpha,PCMarkPro1.3Performancetestsandratingsaremeasuredusingspecificcomputersystems
135、and/orcomponentsandreflecttheapproximateperformanceofIntelproductsasmeasuredbythosetests.Anydifferenceinsystemhardwareorsoftwaredesignorconfigurationmayaffectactualperformance.Robson对磁盘子系统性能提升测试对磁盘子系统性能提升测试 - PCMark Pro 1.3 HDD Robson v.s. None-RobsonAll dates, plans, features are preliminary and su
136、bject to change without noticeAll dates, plans, features are preliminary and subject to change without notice5555系统从休眠状态恢复到工作状态时间测试系统从休眠状态恢复到工作状态时间测试Robson v.s. None-RobsonRun1istreatedaswarm-up,toallowMicrosoftVista*tofilltheMicrosoftReadyBoost*cache.ThemedianforRuns2-10demonstratesRobsonperforms2X
137、bettercomparedtobaseline.Performancewillvarydependingonconfigurationandcalculation.Thisworkloadportraysausagemodelofloadingseveralapplicationsthenputtingthesysteminhibernate(S4).ThetimetoreturntoproductivityfromhibernateismeasuredanddemonstrateshowMicrosoftVistatreatsRobsonsNVCacheaspersistentacross
138、hibernate.TheworkloadscriptusedhereisavailablefromIntel.2x 2x 的速度提升的速度提升的速度提升的速度提升Your performance measurements and observations may differ from these notedAll dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change
139、without notice5656PC系统整合定义系统整合定义All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features are preliminary and subject to change without notice5757All dates, plans, features are preliminary and subject to change without noticeAll dates, plans, features
140、are preliminary and subject to change without notice5858INTEL CONFIDENTIALIntel Confidential Internal Use Only59Measuring Energy Efficiency (EE):Current Practices Lack EE MeaningThermal Design Power (TDP)Average PowerIdle Powermeasured under specific loaddesign specmeasured while platform is inactive
