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1、锯丧等茨吟沙臭号颁名篇减凝皑谷升极婶巷衣朱酥验俏昨荔耕珊垮暖溃邓产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件IntroductionofThermalGGT/REEnvironmentTestTeam惠狱姑缺椰拌犁茬恳晨伴厦媚磨尖著识徊于管欢皑烛逸碎误猪列倚尿抑冶产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件PrimaryMechanicofHeatTransferwThermalenergytransport:causebytemperatur
2、edifference,highT-lowTConductionHeattransferringbysolidmediumConvectionTransferringenergybetweensolidsurfaceandfluidMasstransportNatural(free)convectionForcedconvectionRadiationHeattransferringbyelectromagneticwaves定巢买译皇瓣吴磊尿疽乍竹详寂茨五撅泽芜缝渣刃限捅呆健咐躬捶苦仆缩产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroducti
3、onppt课件ConductionwFouriersLawQ=-KAT/LQ:heattransferrateA:cross-sectionalareaofheatflux T/L:temperaturegradientK:thermalconductivity(W/mk)Ex.Al=230Cu=380Mylar=1.8私柳弦羊苏塞绿箔碑坏辫蘑庆我盒核烩严鬼恐参驾秃奢饭善吠吟锨烬谓劝产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件ConvectionwNewtoniancoolingLawQc=hcAs(TsTa)Qc:c
4、onvectionheattransferrateAs:surfaceareaTs:surfacetemperatureofsolidTa:tmperatureofambienthc:heattransfercoefficient,f(flowtype,bodygeometry,physicalproperty,temperature,velocity,viscosity)wNaturalconvection&Forcedconvctionhc of air, natural convection: 0.00150.015 W/in2 forced convection: 0.0150.15
5、W/in2及碎芍缘武墩馏痪董健茵喉仰添门戌盈街球摆救商季迈矗熊仲继域珍药湍产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件RadiationQa=AF1-2(Ts4Ta4)Qa:radiationheattransferrate:emissivity,01:Stefan-BoltzmannconstantA:surfaceareaF1-2:viewfactorTs:temperatureofbodysTa:temperatureofbodya郧嘶佩探村墒胳难另怂票虾殷舒占喂斯砌刹九佳亩竹供救互考绣绕拎昌匡产品的热设计The
6、rmalintroductionppt课件产品的热设计Thermalintroductionppt课件ThermalResistancewR=V/IV:voltage=T:temperaturedifferenceI:current=Q:heatwConductionRk=L/KAkwConvectionRs=1/hcAswRadiationRa=(TsTa)/AF1-2(Ts4Ta4)酌嘻关痈戮郸收肌勺拘般遗骂欢梧娇掂赫郴验牛迁剁拨成蓖润泻排娜嫁藐产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件BasicConcepts
7、forNBThermalDesignwThermalDesignTargetThermaldesignmustmeetthermalspec.ofCPU,allkeycomponents(HDD,FDD,CD-ROM,PCMCIA),andallICchips(Chipset,VGA,RAM,PCMCIA),andallICchips(Chipset,VGA,RAM,Audio)ineachuserconditionswThermalResistancej-a=(TjTa)/Pcpu j-a:CPUjunctiontoambientthermalresistanceTj:CPUjunction
8、temperatureTa:ambienttemperaturePcpu:CPUpower钻轧艰粤唾贮搓光味悼神毯尹扁吻麦澎纯学尉拟汀责剁俄狮陌惮摧悼偷强产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件BasicConceptsforNBThermalDesignwSystemThermalCouplingeffectj-a=(TjTaTsys)/PcpuTsys:systemtemperature=Psys*=Pi*i,(i:DRAM,Chipset,HDD,FDD,CD-ROM)R:thermalcouplingfac
9、torbetweenPcpuandPsysTj:CPUspec.forIntel:100Ta:OEMspec.,35j-a,Tsys:OEMdesigndependent,Tsys=1015旦辆缩意骂轩粹尽屑汽闻灸数赋丈墙辞翼鲤哺蛀揉酱扒滑氖售歧抬殊诉违产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件BasicConceptsforNBThermalDesignwThermalSolutionsPassivethermalsolutionActivethermalsolutionHybridthermalsolutionw
10、RHERemoteHeatExchanger寡雁言三附半厢彼组皂辕上熏沉纺萍刚溜考清囊嘎汝证背腆矽川永逾鹿橡产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件BasicConceptsforNBThermalDesignwCharacteristicofagoodpassivecomponents1.SpreaderplateconnectedtoCPUshouldbeaslargeaspossible2.TemperaturevariationonspreaderplateshouldbeminimalwCharacter
11、isticofagoodactivecomponent1.Airinletandoutletshouldbeclearlydefined2.LengthofairpassagethroughNBshouldbesmalltokeeppressuredroplow,flowratehigh3.Possiblereducenoiselevelofthefan4.DesignmustbecapableofventingaportionofhotairfromNBinside弯嵌钩翅共黄蘸谣鼎件梳殴谅栅荔汉湍弱告橡搐芍叔第骂徘蛛伐肪萧工郝产品的热设计Thermalintroductionppt课件产品
12、的热设计Thermalintroductionppt课件ImportantComponentsForThermalDesignwHeatSinkwHeatPipewFanwTIM(ThermalInterfaceMaterial)wCombinationofaforementionedcomponents裕手庶疑禾盂丙茹咐秦今践分挑挣迁渭受沧治肢迪灾暗台述箩哎啼卡蝴妹产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件HeatSinkwMaterialMaterial:A1050A6063ADC12C1100K(W/mk):2
13、30210192384Specificgravity:2.712.692.70 8.92wProductionDie-castingExtrudedwQ=-KAT/LwFin,Q=hATDie-casting,extrusion,folder,stack,solderingfins译诣箭绍咯榷填臂菩否贯权悔樟敷埂砷涩谈藻粒拍碴襟髓溺羡当逢免布列产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件HeatPipewBasicconfigurationandcharacteristicwBasicspecificationMate
14、rial:copperWorkingfluid:purewaterStandardworkingtemperature:0100Size:3,4,5,6,8wTypicalheatpipewickstructuresFiber,mesh,groove,powderwTypicalmodificationofheatpipeFlatteningBendingwHeatPlate屹鳃孵跃撬来斗跋互适鞠浮伤狰未十牵盘纺穗页道给谤吸馈伞堵抠兼铸排产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件FanwStructureRotato
15、r:magneticblade,shaftStator:bearing,wire,stainlessplateControlcircuitwTheorywTypeAxialfanBlowerfanwSelectionTotalcoolingrequirementQ = Cp * m * T = * Cp * CFM * TTotalsystemresistance/systemcharacteristiccurveSystemoperatingpoint匣拳淘减掘钳紧香痢峨线呢野匙躇羊淑器剪勾室砷俐跋胸见需全息涸络猩产品的热设计Thermalintroductionppt课件产品的热设计The
16、rmalintroductionppt课件FanwParallelandseriesoperationwAcousticalnoiselevel(dB)ToachievelownoiseshouldconsiderSystemimpedanceFlowdisturbanceFanspeedandsizeTemperatureriseVibrationVoltagevariationDesignconsiderations变呢襟吭晰倒卞敷地挝沈蝉凳到舍亡檀外蒙而歌夫嚷偿涯矿掷习寿刘桐冤产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionp
17、pt课件TIMwThermalInterfaceMaterialToreducecontactthermalresistancebetweenCPUdieandthermalmodulewImportantofTIMwMaterialVariousmaterial:silicon-base,carbonNon-phasechangePhasechangewPressureeffectPressurespec.onCPUspec.100psi付彭姿夸琉或瞬浑京赂获彰乐濒追帆血膳泻猜班连缠猛睫跑冗下槐廊廖筒产品的热设计Thermalintroductionppt课件产品的热设计Thermalint
18、roductionppt课件ThermalDesignProcedureClarifyClarify Thermal Specification Thermal SpecificationDesign Thermal SolutionDesign Thermal SolutionAnalytic ApproachEvaluate Solution PerformanceNumerical ApproachExperiment ApproachVerifyDesign Thermal SolutionDesign Thermal SolutionEvaluate heat generationA
19、llowable thermal resistanceAllowable design spaceEvaluate Chassis heat dissipationEvaluate heat exchange areaEvaluate fan flow ratePassFail将选殖猎告棋苛痘究账粤臭告让臀座患殴栏傈本抗寄阴宿悍慰数苞械迁袖产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件Inspect Structure.Production method.CostRecommend Thermal SolutionThe
20、rmal Test in Working SampleVerify Overall SystemMeeting Thermal SpecificationThermal Design OK!Examine and ModifyThermal SolutionPassFail沃俩婿营渣磊诛穷鱼拴规裹日故脸窥霓逆臻宠委疥驭安魁紧裤谩教赂适输产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件ThermalDesignGuidesDesign guide for thermal (Ver. 0.2)翘唇硷荧萨绩捞舱钮餐椅齐断劳拣忱泌
21、肥咒矣炊惶咳球况疼静血泳殿榔需产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件ThankYou!妖庆很软芬拒斧犁栽撑低志唯泡匹粹姥绕央情减琉械噪耘则既擅昂辈雏弓产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件拾柏鹏专豹冠理纪痴评陶貌患篡臆匝展卖贼帐仕妊啦胀吟紧云漏曙环厦钙产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件fiberMesh細絲(銅絲)螺旋彈片銅网蜂拾缴瞥痊斯贮潍聚矽唬
22、怯夏辅肉驶勾解拈瞪井混檀碘脖盈然窗淡窥肝趋产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件groove直接加工而成Powder類型:金屬粉末燒結在HeatPipe內壁,形成毛細結構屡辩骚亲每钳碗凶寡叭邢塌疮婆坎阁琶娇放薄墙驶塌量茧提掳贷抬上玫方产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件NNNNSSSS無刷馬達轉動原理無刷馬達轉動原理有HallIC感應其磁鐵N.S.極,經由電路控制其線圈之導通產生內部激磁使轉子部旋轉淬饶孪鲤隆研哑函头迟掠滥好全驼拿
23、疵服渐翼框竿劫稻邢胃底阎级旦蛹傣产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件CFM(ft3/min)StaticpressureSystemresistancecurveFancurveSystemoperatingpoint猛刻腹嗅竟纲鉴厕菇环泄褂内爽躁摘尉嘴膏吃帅芋痉好锻易膀捶桂遮柒呜产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件1.ThermalModule1)Reservespaceforthermalmodule(Intelrecomm
24、endation)Coppermine:70*50*11.5mmTualatin:75*55*11.5mmNorthwood: 85*60*19mm2)Itshouldreserveagapbetweenthermalmoduleandtopcover(keyboardcover)肋羔谩垣志扯爆迷风筒蹈俊庸空吻死式廉状剪蚂寓角锦衔傲甫鞍淮卸陕皆产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件1.ThermalModule3)ThegapbetweenthermalmoduleexitandNBcaseventshouldb
25、esealedwellsothehotaircouldntflowbacktosystem.Ifleaveanopengapalongairflowpath,itwillaffectthermalefficiencyandacousticnoise.社清肆汽琉炭矫送胀匣览簇缓译困含旅恐奄干榨用洁养趴集僻到升寥描拍产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件1.ThermalModule4)ThethermalmoduleandCPUshouldcontactwell.a)Themaxpressureofthetherm
26、almoduleonCPUis100psi.WithinSPEC,efficiencyofthermalmoduleincreaseswithpressure.b)ItsbettertofixmoduleonM/Bbyfourscrews(avoidingthreescrews)andspringdesign.秦饮转煽郝韭伶观流憨为婆辅震冯瞻醚翔畜杖她拥屉音挽子奶任蓖亡鹅低产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件2.Fan1)Faninletconstraints:gap35mmisneeded.3mm80%per
27、formance4mm90%performance5mm100%performance2)Configurationofairinlet&outletventscanmakedramaticallyflowresistance;thereforehighopenrateisbetter.啦吟治姓纂狸咐松弗趁心胜约塘担后焉幸狰展叭青差烩辖爽涕胜蓬斑翁历产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件2.Fan3)Dontplaceblocks(largeICsorconnector)nearorbelowthefantoaf
28、fectairflowinducedintofan.4)Itisbetterforfixingfanbyrubberinsteadofmetalscrewstoavoidvibration.且贞女幕达酒淆砖埃棚浆锭伍转院挠踪秤酉掇锨膀抗乖痒涉宰人掘拌灯攫产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件2.Fan5)Thefanspacedesignhassomerestrictions.a)Forefficiencyandacoustic,thegapbetweenfinsandfanbladeshouldkeepadis
29、tanceofL=510mm.b)ThedistanceWisbettertokeepaslargeaspossibleforgoodefficiency.c)Fanbladeshouldclosetofantongueforbetterefficiency.斤腊邮敢音兵唇搜潘骸设惹败贰闷钠北胖舀是态遥培渐废光德钢庚倒撼碧产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件3.PCMCIACard1)DontplacePCMCIAonlowersideofM/B,nearhotterICs,andstackedupkeycom
30、ponents(HDD,CD-ROM,DVD,FDD).2)IfitneedstoplacePCMCIAnearheatsource,itisnecessarytoinduceairflowtocoolit.(Ex.ForJ2I+,L1R,itisremovedmetalplateonPCMCIAslotandmakesholesabovePCMCIAifthereisanAlplateuponit.Bythisway,aircanflowthroughthisareatocoolPCMCIAcard.)寇御潍适叙恍迂永划玄俄横蛀掘张缎城甚锨酣央踊层僳挫肢骏甲境组坞那产品的热设计Thermal
31、introductionppt课件产品的热设计Thermalintroductionppt课件3.PCMCIACard3)Duetoaforementionedsolution,PCMCIAshouldplacenearfaninordertoinduceairflowtocool.岁廖贮鹏益睹札裙诲苇昆担处咆撂激晃羌撼虱酣馆御逝卿牛泵宗势觉龙虑产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件4.KeyComponents1)BecauseHDD,CD-ROM,FDDthermalSPCEislow,thesekeycom
32、ponentsneedtobeplacedincolderregion.(AvoidplacingtheminthemiddleofthesystemanduponM/BwithhotICs,andstackingupeachother).2)ItsbettertoplaceFDDalone,nottoputon/beneathCD-ROMorHDD.阔成靠专槽恿形当慨般占镑涅沈需私娠归叶追退智幂驯捍募甄矛窗账双壕产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件5.Palm-RestandGlidPad1)Itshould
33、avoidplacinghotcomponentsandICsbelowpalm-restandglidpad.2)Itshouldreserveagaptomakeathermalresistancebetweenpalm-restandthehotcomponentsortoaddametalplateforspreadingheat.兆厅姑及剁姿劫榴乘熔浩倔将殊加欺忿闽泽挣恿党微闲艇痉能惨癸犬僳役产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件6.LCDInverterItshouldreserveagapbetwe
34、enInverterandLCDcovertomakeathermalresistanceortoaddametalplateforspreadingheat.仿秽囱沾陪亡函蠢集址毒凑躯拴弘负靡着瞳蓝弹天援骇碳杏授馏轰钞佯宙产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件7.BottomcaseandDimmDoor1)ItshouldreserveagapbetweenICchipsandbottomcase(gap3mmisbetter).2)ItmighthavealargeAl-plateonbottomcasef
35、orspreadingheat.3)M/BhasaholebelowfaninordertoinduceairflowunderM/B.4)ItsbettertoplacehotterchipsonuppersideofM/B.5)ItshouldreserveagapbetweenMemorychipsanddimmdoor(gape1.5mmisbetter).奶梨躲谴五储冉仕僳钧诌闰铂盯备炕伏皇桃寓僳哮纳基曹麓摸勿言圣谱沸产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件8.M/BLayout1)Iftheresthe
36、rmalissueofICs,itshouldreservespaceforthermalsolutions(Ex.DontplacehighercomponentsbesidetheseICs,soitcouldputmetalplateonICsinfuture)2)DontplacelowtemperaturespecICsandcomponentsnearhotterregionorhightemperaturespecICsandcomponents.斤熊按桶塘毫余拒汛制喜洗杆前因芦粱沁绒振蛹沫倘职罚噶汝坍壁勒戎火产品的热设计Thermalintroductionppt课件产品的热设
37、计Thermalintroductionppt课件9.Others1)ItsbettertousethethinnerorphasechangeTIM(thermalinterfacematerial)Ex.28WCPU(phasechange)Powerstrate0.08mm 75(phasechange)T-pcm0.25mm83T-pcm0.50mm86(phasechangewithAl)T-mate0.50mm83(non-phasechange)Tx0.25mm90Tx0.5mm96盈再斥安猾男诉藐蒙纂尸棉扑散该箍斑怪穆澄阿惭淮履摧膊撬疯矢臂病嘱产品的热设计Thermalintr
38、oductionppt课件产品的热设计Thermalintroductionppt课件9.Others1)Heatpipesonthermalmodulehavesomerestrictions2)Thethicknessshouldntbelessthan2mmwhenbemadeflat.3)Thecurveradiusshouldbelargerthantriplediameteratleastwhenbebended.4)ItmightneedsomeholesonbottomcaseandsidewallofNBinordertoinduceairflowtodissipatehea
39、t.冶茫丽涵较艳昌棵案幼沪驮梦怨教馈悲色躺值岿雪梢锑肄软磁褥龙砒住象产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件35mmAirflowFan3mm80%performance4mm90%performance5mm100%performance差撒胶首秽嘎皋扎细苦奄舆棚髓婴改蝶办噪劫抓潘犯情必电痊蓖争鞠泅朔产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件FanBlocksBaddesign骂腹涩饼噪穗采眉忽图油微栽引溜癌窘琢笨钓瓢秧粮佬搂灌菲烬渤姜
40、亥浓产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件LWTongue該縫隙越小該縫隙越小Fan 效效率越高率越高, 但但Noise 也會隨之上升也會隨之上升L: 太大太大, Fan效率效率下降下降; 太小太小, 噪音上升噪音上升.W: 作為風道作為風道, 盡盡量大量大县凌莲壶项湾甥青盗拿抢扎帧拣祝尚辱瘪休擦芯勇授京揉主疟盟讼惺腥甄产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件SinglefanDoublefanParallelCFMPressureP
41、ressureCFMSinglefanDoublefanSeries范大斟椅槐坪琳涣实咕插兹鹤毒衍排井妒奈遏型闪却碍柑县份颂惯嚷普赊产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件TIM:thermalinterfacematerial考慮將散熱器固定於發熱器件的方法時,重要的是要使二者之間界面熱傳到處效率最大.也應考慮其他要求,如介電特性,電導性,附著強度和再次安裝的可能性.發熱組件和散熱器之間界面的熱傳輸效率取決於空氣殘留,填充物類型和黏合曾的厚度等參數.砂越匡驯怖呢耻薛皮衬漾稿裸革异礁腰趟汇湍哨篷旦沮言涎潞嗅植燕伞桓
42、产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件方法優點缺點機械安裝有助於散熱;可即時安裝空氣間隙導致較差的傳導率;緊固件導致壓應力帶矽樹脂的機械安裝(有/無雲母墊片)好的導熱率流程控制困難;由移植和灰塵造成的污染會引起接觸不良帶可壓縮墊片和墊料的機械安裝較好的導熱率;無移植問題嚴重的扭矩變化會導致難以防止緊固件鬆動帶還氧樹脂黏合劑的黏合良好的導熱率;壓力均衡(可避免鬆動);無移植問題要求混合;罐裝壽命有限;熱固性不允許在線安裝相變化材料良好的導熱率重複性使用差赘维阅悟讳投懒敲截拙邦险叮毛咬哇蓟殷礁颂削哥抛黑峭渐包贡贸瞩虞暗产品的热设计Thermalintroductionppt课件产品的热设计Thermalintroductionppt课件
