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1、理想狀況(Target Condition) 拒收狀況(Reject Condition)SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度 (組件X方向)SMD Assembly workmanship criteria-Chip component alignment( X Axis)1. 晶片狀零件恰能座落在焊 墊的中央且未發生偏出， 所有各金屬封頭都能完全 與焊墊接觸。1.Component is centered on both sides of the land . All the solder terminations shall completely touch pad.
2、1.零件橫向超出焊墊以外，但 尚未大於其零件寬度的50%。(X1/2W)1.The component shifted off the pad and shift length shall less 1/2 chip width1.零件已橫向超出焊墊，大 於零件寬度的50%(MI)。(X1/2W)1.The component shifted off the pad and shift length over 1/2 chip with允收狀況(Accept Condition) X1/2W X1/2W330X1/2W X1/2W註:此標準適用於三面或五面 之晶片狀零件This standar
3、d only be used for 3 or 5 face terminations chip component ww3303302021/7/231理想狀況(Target Condition) 拒收狀況(Reject Condition)1.晶片狀零件恰能座落在焊墊 的中央且未發生偏出，所有 各金屬封頭都能完全與焊墊 接觸。1.Component is centered on both sides of the land . All the solder terminations shall completely touch pad. 1.零件縱向偏移，但焊墊尚保 有其零件寬度的25%以
4、上。(Y1 1/4W)2.零件縱向偏移，但零件端電 極仍蓋住焊墊為其零件寬度 的25%以上。(Y2 1/4W)Component is shifted towards longest part of the chip , but the termiuad end of chip still on the land1.The Pad length not be cover by chip (Y1) shall over 1/4 chip width (W)2.1/4 width of the land for solder fillet to form.1.零件縱向偏移，但焊墊未 保有其零件寬度
5、的25%(MI) 。(Y11/4W)2.零件縱向偏移，但零件端 電極蓋住焊墊小於其零件 寬度的25%。(Y21/4W) 3.Whichever is rejected .允收狀況(Accept Condition)W W 330 330Y2 1/4W330Y1 1/4WY2 1/4WY1 1/4WSMT零件組裝工藝標準-晶片狀(Chip)零件之對準度 (組件Y方向)SMD Assembly workmanship criteria-Chip component alignment( Y Axis)2021/7/232理想狀況(Target Condition) 拒收狀況(Reject Cond
6、ition)SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度SMD Assembly workmanship criteria-Cylinder component alignment 1.組件的接觸點在焊墊中心1.The point of contact is centered on the lands1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以下。 (X 1/3D)2.零件縱向偏移，但金屬封頭仍在焊墊上。(Y10 mil),(Y20 mil)1.The length of component shifted off the pad(X) shall less th
7、e 1/3 Diameter of component2.Shifted toward the longest part of the component , the solder terminations still on the land 1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以上 (MI)。(X1/3D)2.零件縱向偏移，但金屬封頭未 在焊墊上。 (Y10 mil),(Y20 mil)3.Whichever is rejected .允收狀況(Accept Condition) X1/3D1/3D X1/3D1/3D Y20mil Y10 0mil X1/3D1/3D X
8、1/3D1/3D Y20 0 mil Y10 0 mil註：為明瞭起見,焊點上的錫已省去。Note:In order to clarify the figure , the solder joint be eliminatedD2021/7/233理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度 SMD Assembly workmanship criteria-Gull-Wing footprint alignment1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the
9、 leads footprint is centered on the lands1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W )2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil (0.13mm)。(S5mil)1.The length of the lead footprint shifted off the land(X)shall less 1/2 width of lead2.The clearance(S)between lead shifted off and land shall over 5 mil允收狀況(Accept Cond
10、ition)W S XX1/2W S S5mil5mil X1/2W S S5mil5mil 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/2W (MI)。(X1/2W )2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil (0.13mm)(MI)。(S5mil)3.Whichever is rejected .2021/7/234理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度SMD Assembly workmanship criteria-Gull-Wing to
11、e alingnment1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過焊墊側端外緣。1.The lead had shifted and footprint not over the end of land1.各接腳側端外緣，已 超過焊墊側端外緣(MI)。1.The lead had shifted and footprint had over the end of land(MI)允收狀況(Accept Condition) W W
12、 已超過焊墊側端外緣已超過焊墊側端外緣2021/7/235理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度 SMD Assembly workmanship criteria-Gull-Wing heel alingnment1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands1.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，最少保有一個接腳厚度(XT)。1.The lead had shifte
13、d the length from lead heel to end of land (X) shall be over the thickness of land (T)1.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳 厚度(XT)(MI)。允收狀況(Accept Condition)T X X T X TT T XT2021/7/236理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMD solder joint workmanship criteria-Minimum sol
14、der of Gull Wing footprint1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible1.引線腳的底邊與板子焊墊間的 銲錫帶至少涵蓋引線腳長的 2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h 大於零件腳1/2厚度。 (h1/2T) 。3.腳跟(Heel)沾錫角需90
15、度。1.Width of solder fillet between lead and land(X) shall over 2/3 lead footprint(L)2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel3.Wetting angle 90on heel1.引線腳的底邊與板子焊墊間的 銲錫帶不足涵蓋引線腳長的 2/3L。2.腳跟(Heel)焊錫帶涵蓋高 度 h小於零件腳1/2厚度。 (h=2/3LLX2/3Lh1/2TTh1/2TT2021/7/237理想狀況(Target Co
16、ndition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprint 1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible1.
17、引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍 凸的焊錫帶。3.引線腳的輪廓可見。1.Good solder flow up and concave fillet between land and lead2.Concave solder fillet between side face of lead and land3.The shape (profile) of lead (footprint) be clearly visible1.焊錫帶延伸過引線腳的 頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whichever is rejected .
18、1.solder flow cover the end (TIP) of lead2.The shape (profile) of lead not be visible clearly3.Whichever is rejected拒收狀況(Reject Condition)允收狀況(Accept Condition) 2021/7/238理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量SMD solder joint workmanship criteria-Minimum solder o
19、f Gull Wing Heel1.腳跟的焊錫帶延伸到引線上彎 曲處底部(B)與下彎曲處頂部(C)間的中心點。註：引線上彎頂部：引線上彎底部：引線下彎頂部：引線下彎底部1.Solder flow up to the center between B,C point on the heel of lead1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solder flow up to B point on the heel1.腳跟的焊錫帶延伸到引線上 彎曲處的底部(B)，延伸過 高，且沾錫角超過90度，才 拒收(MI)。1.Solder flow up over(cross) B poi
20、nt and the wetting angle over 90 degree允收狀況(Accept Condition) 沾錫角超過沾錫角超過90度度 ABDC2021/7/239理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-J型接腳零件之焊點最小量SMD solder joint workmanship criteria-Minimum solder of J type lead1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder
21、concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩 側的50%以上(h1/2T)。1.Solder concave fillet on the 3 face of lead2.Height of solder flow-up on the lead angle
22、(h) shall over 1/2 angle height(T)1.焊錫帶存在於引線的三側以 下(MI)。2.焊錫帶涵蓋引線彎曲處兩側 的50%以下(h1/2T)(MI)。3.Whichever is rejected .1.Solder concave fillet is less 3 face2.Height of solder flow-up on the lead angle(h) under 1/2 angle height(T)3.Whichever is rejected允收狀況(Accept Condition) h1/2TAT B h 1/2T2021/7/2310理想狀
23、況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準- J型腳零件對準度SMD Assembly workmanship criteria-J type lead alignment 1.各接腳都能座落在焊墊的中 央，未發生偏滑。1.All the leads footprint is centered on the lands允收狀況(Accept Condition)S W S5mil5mil X1/2W S1/2W 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/2W (MI)。(X1/2W )2.偏移接腳之邊緣與
24、焊墊外緣之垂直距離5mil (0.13mm)以下(MI)。(S5mil)3.Whichever is rejected .1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W )2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil (0.13mm)以上。(S5mil)The lead had shifted off the land1.The length of lead shifted off the land (X) shall less 1/2 width of lead (W)2.The clearance distance between shif
25、ted lead and land edge shall over 5 mil2021/7/2311理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點SMD solder joint workmanship criteria-Maximum solder of J type lead1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處 兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lea
26、d2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact1.凹面焊錫帶延伸到引線彎 曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solder flow up to top of lead angle and not touch the body2.Shape(profile)of lead angle can be visible clearly1.焊錫帶接觸到組件
27、本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(MI)。4.Whichever is rejected .1.Solder had touched the body2.Shape (profile) of lead angle can not be visible clearly3.Excess solder on the side of solder land允收狀況(Accept Condition)AB 2021/7/2312理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三
28、面或五面焊點)SMD solder joint workmanship criteria-Minimum solder fillet of chip component( 3 or 5 face terminations)1.焊錫帶延伸到晶片端電極高度的25%以上。 (h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X1/4H)1.1/4 component height be fillet by solder at least2.Solder flow spread on the land shall 1/4 width of component height
29、at least , (Count from tip of component)1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。(X1/4T)3.Whichever is rejected .允收狀況(Accept Condition) T h1/4 T X1/4 T h1/4 T X10mil。(D,L10mil)(MI)且 10mil 不易被剝除者不易被剝除者L 10mil 不易被剝除者不易被剝除者L 10mil2021/7/2315理想狀況(Target Condition)拒收狀況(Reject
30、 Condition)允收狀況(Accept Condition) X0X0 X0 YYTTYTX1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.The footprint of every lead be centered on the land1.各接腳已發生偏滑，引線 腳的側面仍保留在焊墊 上(X0),2.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(YT)。Footprint had shifted1.Side face still on the land (X0)2.The space from end of land to heel shall over th
31、e thickness of lead 1.各接腳己發生偏滑，引線腳 的側面已超出焊墊(X0)。2.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，小於一個 接腳厚度(YLmax判定拒收(MI) 。5.Whichever is rejected .1.Protrusion lead can not be visible2.Protrusion lead out of spec (include Lmin or Lmax)3.Lead bend / missing / no-through4.Special spec of protrusion lead out of spec (Lmax)5.Whic
32、hever is rejected2021/7/2319理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-臥式電子零組件(R,C,L)浮件與傾斜(1)DIP component Assembly workmanship criteria-Tilt & floating of horizontal electronic component ( R , C , L )1.零件平貼於機板表面。2.浮高判定量測應以PCB零件面與零件基座之最低點為量測依據。1.Component is perpendicular and base is pa
33、rallel to board surface2.The floating height is measured from face of PCB substrate to the lowest point of component允收狀況(Accept Condition) +1.量測零件基座與PCB零件面之最大距離須2.0mm。(Lh2.0mm)2.零件腳未折腳與短路。3.臥式COIL之Lh2mm .Wh2mm)不受第1點之限制1.The height of the component body above the land “Lh”is 2.0mm maximum2.No leads b
34、e shorted or bended of component3.Coil floating be specified to 2mm maximum傾斜傾斜/ /浮高浮高Lh2.0 mm傾斜傾斜Wh2.0 mm傾斜傾斜/ /浮高浮高Lh2.0 2.0 mm傾斜傾斜Wh2.0 2.0 mm1.量測零件基座與PCB零件面之最大距離2.0mm(MI)。(Lh2.0mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.臥式COIL之Lh或Wh2mm判定距收(MI) 。4.Whichever is rejected 2021/7/2320理想狀況(Target Condition)拒收狀況(R
35、eject Condition)DIP零件組裝工藝標準-臥式電子零組件(Wire)浮件與傾斜(2)DIP component Assembly workmanship criteria-Tilt & floating of horizontal electronic component ( Wire )1.單獨跳線平貼於機板表面。2.固定用跳線不得浮高,跳線需 平貼零件。1.Jumper wire lay flat and touch the board2.Jumper wire used for fixing component shall touch the component body1
36、.單獨跳線Lh,Wh1.0mm。2.被固定零件浮高1.0mm 。(Y1.0mm)3.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm 。(X1.0mm)4.固定用跳線浮高Z0.8mm (被固定零件平貼於PCB時)1.The height of jumper wire above the land is 1.0mm Maximum2.Jumper wire used for fixing component is 0.8mm maximum3.The shift length of reflection of jumper wire used for fixing component on
37、 the board is 1.0mm maximum measuring from the edge of PTH4.The height of jumper wire above the component is 0.8mm maximum since component lay flat允收狀況(Accept Condition)Lh1.0 1.0 mmWh1.0 1.0 mmX1.0mm1.單獨跳線Lh,Wh1.0mm(MI)。2.被固定零件浮高1.0mm(MI) 。(Y1.0mm)3.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm (MI)。(X1.0mm)4.固定用跳線浮高
38、Z0.8mm(被固定零件平貼於PCB時)(MI) 5. Whichever is rejected Lh1.0 1.0 mmWh1.0 1.0 mmX1.0mmY1.0mmY1.0mmZ0.8mmZ0.8mmZZ2021/7/2321理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)浮件DIP component Assembly workmanship criteria-Floating of vertical electronic component ( C , F , L , Buzz
39、er )1.零件平貼於機板表面。2.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。1.Component is perpendicular and base is parallel to board surface2.The floating height is measured from face of PCB substrate to the lowest point of component1.浮高2.0mm。(Lh2.0mm)2.錫面可見零件腳出孔。3.無短路。1.The height of component above the land (Lh)is 2.0
40、mm maximum2.Lead protrusion on the solder side can be identified3.No solder bridge1.浮高2.0mm(MI)。 (Lh2.0mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whichever is rejected .允收狀況(Accept Condition) 1000F 6.3F-1016 + 1000F 6.3F-1016 +Lh 2.0mmLh2.0mm 1000F 6.3F-1016 +Lh 2.0mmLh2.0mm2021/7/2322 理想狀況(Target Cond
41、ition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)傾斜DIP component Assembly workmanship criteria-Tilt of verticle electronic component ( C , F , L , Buzzer )1.零件平貼於機板表面。2.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。1.Component is perpendicular and base is parallel to board surface2.The floating hei
42、ght is measured from face of PCB substrate to the lowest point of component1.量測零件基座與PCB零件面之最大距離2.0mm。(Wh2.0mm)2.傾斜不得觸及其他零件或造成組裝性之干涉。1.The maximum height of component above the land is 2.0mm maximum2.No touch neighboring component or No. interfering with neighbor component assembly允收狀況(Accept Conditi
43、on) 1000F 6.3F-1016 + 1000F 6.3F-1016 +Wh2.0mm 1000F 6.3F-1016 +Wh2.0mm1.量測零件基座與PCB零件面之最大距離2.0mm(MI)。(Wh2.0mm)2.傾斜已觸及其他零件或造成組裝性之干涉(MA)。4.零件傾斜與相鄰零件之本體垂直空間干涉(MI)。5.Whichever is rejected .2021/7/2323理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-機構零件(Slot,Socket,DIMM,Heatsink)浮件DIP component A
44、ssembly workmanship criteria-Floating of constructive component ( slot , socket , Dim , Heats sink )1.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。2.機構零件基座平貼PCB零件面 ，無浮高傾斜。(a,b,c,d四點平貼於PCB）。1.The floating height is measure from face of PCB substrate to the lowest point of component2.The base of constructive co
45、mponent shall touch the face of PCB substrate (a,b,c,d point touch PCB)1.短軸a,b兩點平貼PCB或垂直 上浮,但c,d兩點浮高0.8mm 。(Lh 0.8mm)2.錫面可見零件腳出孔3.無短路。1.The height of component short axis side above the land is 0.8mm maximum2.Lead protrusion can be identified on solder side3.No solder bridge允收狀況(Accept Condition)CAR
46、DCARDLh0.8mmCARDLh0.8mmabcd1.短軸a,b兩點平貼PCB或垂直 上浮,但c,d兩點浮高0.8mm (MI)。(Lh 0.8mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whichever is rejected .abcdabcd2021/7/2324理想狀況(Target Condition)拒收狀況(REJECT CONDITION)DIP零件組裝工藝標準-機構零件(Slot,Socket,DIMM,Heatsink)傾斜DIP component Assembly workmanship criteria-Tilt of con
47、structive component ( slot , socket , Dim , Heat sink )1.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。2.機構零件基座平貼PCB零件面 ，無浮高傾斜現象。(a,b,c,d四點平貼於PCB) 。1.The floating height is measure from face of PCB substrate to the lowest point of component2.The base of constructive component shall touch the face of PCB substr
48、ate (a,b,c,d point touch PCB)1.長軸a,c兩點平貼PCB或垂直 上浮，但b,d兩點傾斜高度 0.5mm。(Wh0.5mm)2.若a,b,c三點平貼PCB容許d點浮高/傾斜0.8mm。(Wh0.8mm)3.錫面可見零件腳出。1.The height of component long axis side above the land is 0.5mm maximum2.If 3 point of 4 corner touch the PCB . The height of the other point above the land is 0.8mm maximum
49、3.Lead protrusion can be identified on solder side允收狀況(Accept Condition)CARDWh0.5mmCARDWh0.5mmCARDabcdabcdabcd1.長軸a,c兩點平貼PCB或垂直 上浮，但b,d兩點傾斜高度 0.5mm(MI)。(Wh0.5mm)2.若a,b,c三點平貼PCB但d點浮高/傾斜0.8mm(MA)。(Wh0.8mm)3.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。 4.Whichever is rejected .2021/7/2325理想狀況(Target Condition)拒收狀況(Reject
50、Condition)DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)浮件DIP component Assembly workmanship criteria-Floating of constructive component ( Jumper Pins , Box header )1.零件平貼於PCB零件面。2.無傾斜浮件現象。3.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。1.Component is perpendicular and base is parallel to board surface2.The floating
51、 height is measured from face of PCB substrate to the lowest point of component1.浮高1.0。(Lh1.0mm)2.錫面可見零件腳出孔且無短路。1.The height of component above the land is 0.8mm maximum2.No solder bridge and lead protrusion can be identified on solder side允收狀況(Accept Condition) Lh1.01.0mm Lh1.0mm1.浮高1.0mm(MI)。(Lh1.
52、0mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。 3.短路(MA)。4.Whichever is rejected . 2021/7/2326理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)傾斜DIP component Assembly workmanship criteria-Tilt of constructive component ( Jumper Pins , Box header )1.零件平貼 PCB 零件面。2.無傾斜浮件現象。3.浮高與傾斜之判
53、定量測應以 PCB零件面與零件基座之最低 點為量測依據。1.Component is perpendicular and base is parallel to board surface2.The floating height is measured from face of PCB substrate to the lowest point of component1.量測零件基座與PCB零件面之最大距離1.0mm。 (Wh1.0mm)2.傾斜不得觸及其他零件或造成組裝性之干涉。3.排針頂端最大傾斜不得超過PCB板邊邊緣。1.The maximum height (Wh) of comp
54、onent above the land is 1.0mm maximum2.No touch neighboring components assembly3.The projection of tilted header on the board is not over the edge of PCB允收狀況(Accept Condition)Wh1.01.0mmWh1.0mm1.量測零件基座與PCB零件面之最大距離1.0mm(MI)。 ( Wh1.0mm )2.傾斜觸及其他零件或造成組 裝性之干涉(MA)。3.排針頂端最大傾斜不得超過PCB板邊邊緣(MI)。4.零件傾斜與相鄰零件之本體垂
55、直空間干涉(MI)。5.Whichever is rejected 1000F 6.3F- 1000F 6.3F- 1000F 6.3F- 2021/7/2327理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-機構零件(CPU Socket)浮件與傾斜DIP component Assembly workmanship criteria-Tilt and floating of constructive component ( CPU Socket )允收狀況(Accept Condition)浮高浮高 Lh1.浮高與傾斜之判定量
56、測應以 PCB零件面與零件基座之最低 點為量測依據。2.CPU Socket平貼於PCB零件面 。浮高浮高 Lh浮高浮高 Lh浮高浮高 Lh傾斜傾斜Wh0.80.8mm浮件浮件Lh0.80.8mm浮高浮高 Lh浮高浮高 Lh傾斜傾斜Wh0.8mm浮件浮件Lh0.8mm1.量測零件基座與PCB零件面之最大距離0.8mm。( Lh,Wh0.8mm)2.錫面可見零件腳出孔。3.無短路。1.量測零件基座與PCB零件面之最大距離0.8mm(MI)。( Lh,Wh0.8mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whichever is rejected .2021/7
57、/2328理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-機構零件(USB,D-SUB,PS/2,K/B Jack)浮件與傾斜DIP component Assembly workmanship criteria-Tilt and floating of constructive component ( USB , D-sub , PS/2 , K/B Jack )1.USB,D-SUB,PS/2,K/B Jack, Printer Port,COM Port平貼於PCB零件面。允收狀況(Accept Condition)浮高浮高
58、 Lh0.5mm傾斜傾斜Wh0.5mm浮高浮高 Lh0.5mm傾斜傾斜Wh0.5mm1.量測零件基座與PCB零件面之最大距離0.5mm。( Lh,Wh0.5mm)2.錫面可見零件腳出孔。3.無短路。1.量測零件基座與PCB零件面之最大距離0.5mm(MI)。( Lh,Wh0.5mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whichever is rejected .2021/7/2329理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-機構零件(Power Connector)浮件與傾斜DIP c
59、omponent Assembly workmanship criteria-Tilt and floating of constructive component ( Power Connector )1.Power Connector 平貼於PCB 零件面。允收狀況(Accept Condition)1.量測零件基座與PCB零件面之最大距離0.8mm。( Lh,Wh0.8mm)2.錫面可見零件腳出孔。1.量測零件基座與PCB零件面之最大距離0.8mm(MI)。( Lh,Wh0.8mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。 3.短路(MA)。4.Whichever is re
60、jected .浮高浮高 Lh0.8mm傾斜傾斜Wh0.8mm浮高浮高 Lh0.8mm傾斜傾斜Wh0.8mm2021/7/2330理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)組裝外觀(1)DIP component Assembly workmanship criteria-Workmanship (1) of constructive component(Jumper Pin,Box header)1.PIN排列直立2.無PIN歪與變形不良。1.PIN(撞)歪程度1PI
61、N的厚 度。(XD D) )2.PIN高低誤差0.5mm。1.PIN(撞)歪程度1PIN的厚度 (MI)。(XD)2.PIN高低誤差0.5mm(MI)。3.其配件裝不入或功能失效(MA) 。4.Whichever is rejected .允收狀況(Accept Condition)PIN高低誤差高低誤差0.5mmPIN歪程度歪程度PIN高低誤差高低誤差0.5mmDX DX D2021/7/2331拒收狀況(Reject Condition)DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)組裝外觀(2)DIP component Assembly workman
62、ship criteria-Workmanship(2) of constructive component(Jumper Pins,Box header)1.PIN排列直立無扭轉、扭曲不 良現象。2.PIN表面光亮電鍍良好、無毛 邊扭曲不良現象。1.由目視可見PIN有明顯扭轉、扭曲不良現象 (MA) 。1.連接區域PIN有毛邊、表層電 鍍不良現象(MA)。2.PIN變形、上端成蕈狀不良現 象(MA)。3.Whichever is rejected .允收狀況(Accept Condition)拒收狀況(Reject Condition)PIN扭轉扭轉. .扭曲不良現象扭曲不良現象PIN有毛邊
63、、表層電鍍不良現象有毛邊、表層電鍍不良現象PIN變形、上端變形、上端成蕈狀不良現象成蕈狀不良現象2021/7/2332拒收狀況(Reject Condition)DIP零件組裝工藝標準- 機構零件(BIOS & Socket)組裝外觀(3）DIP component Assembly workmanship criteria-Workmanship (3) of constructive component ( BIOS & Socket )1.零件組裝極性正確。2.BIOS與Socket完全平貼。1.BIOS與Socket組裝後浮高產生間隙 Lh0.8mm。1.零件組裝極性錯誤(MA)。2.
64、BIOS與Socket組裝後浮高產生間隙 Lh0.8mm (MI)。3.Whichever is rejected .Lh 0.8 mmLh 0.8 mm允收狀況(Accept Condition)理想狀況(Target Condition)2021/7/2333拒收狀況(Reject Condition)DIP零件組裝工藝標準- 組裝零件腳折腳、未入孔(1)DIP component Assembly workmanship criteria-Lead bend and no-inside the hole (1) of assembly1.零件組裝正確位置與極性。2.應有之零件腳出焊錫面，
65、無零 件腳之折腳、未入孔、未出孔 、缺零件腳等缺點。1.零件腳折腳(跪腳）影響功能(MA) 。1.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。 允收狀況(Accept Condition)拒收狀況(Reject Condition)2021/7/2334拒收狀況(Reject Condition)DIP零件組裝工藝標準- 零件腳折腳、未入孔、未出孔(2)DIP component Assembly workmanship criteria-Lead bend no-inside no-through (2) of the hole1.應有之零件腳出焊錫面，無零 件腳之折腳、未入孔、未出孔
66、、缺零件腳等缺點。2.零件腳長度符合標準。1.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。 1.零件腳未出焊錫面、零件腳未 出孔不影響功能 (MI)。允收狀況(Accept Condition)拒收狀況(Reject Condition)2021/7/2335L拒收狀況(Reject Condition)DIP零件組裝工藝標準-板彎、板翹、板扭(平面度)DIP component Assembly workmanship criteria-board wrapage中心線D1.板彎,板翹,板扭計算方式： W=(D*100)/L W=彎(翹)度或扭度(%) D=半成品板材變形之最大距離 L=
67、半成品板材之長邊2.零件組裝後產生之板彎,板翹,板扭程度趨近於0%。1.零件組裝後產生之板彎,板翹,板扭程度 W0.75%。允收狀況(Accept Condition)1.零件組裝後產生之板彎,板翹,板扭程度 W0.75%(MA)。W=(D*100)/L 0.75%W=(D*100)/L 0.75%理想狀況(Target Condition)W=(D*100)/L 0%D2021/7/2336DD0.05 mm ( 2 mil )理想狀況(Target Condition)拒收狀況(Reject Condition)DIP零件組裝工藝標準-零件腳與線路間距DIP component Assem
68、bly workmanship criteria-the space between lead to trace1.零件如需彎腳方向應與所在位 置PCB線路平行。1.需彎腳零件腳之尾端和相鄰 PCB線路間距 D 2 mil ( 0.05mm )。允收狀況(Accept Condition)1.需彎腳零件腳之尾端和相鄰 PCB線路間距 DD 2 mil ( 0.05mm )(MI)。2.需彎腳零件腳之尾端與相鄰 其它導體短路(MA)。3.Whichever is rejected .D9090度度 1.未上零件之空貫穿孔因空焊 不良現象，於同一機板未超 過5孔(5孔)，或這5孔位置 不連續排列。
69、 2.同一機板焊錫面錫凹陷低於 PCB水平面點數5點。2021/7/2344DIP焊錫性工藝標準-DIP插件孔焊錫性檢驗圖示DIP soldering workmanship -Figure of PTH solder fillet evaluation基板(PCB)基板(PCB) Lmin目視零件腳出錫面目視零件腳出錫面 Lmax 2.5mm 焊錫面焊錫面(Solder Side) 焊錫面吃錫良好焊錫面吃錫良好-允收允收(Accept)焊錫面吃錫、沾錫焊錫面吃錫、沾錫角角 5點點與沾錫角與沾錫角9090度度-拒收。拒收。需剪腳零件腳長度需剪腳零件腳長度 L L 計算計算: :需從需從PCBP
70、CB沾錫平面為衡量基準，沾錫平面為衡量基準，LminLmin長度下限標準，為目視零件腳出長度下限標準，為目視零件腳出錫面，錫面，LmaxLmax零件腳最長之長度零件腳最長之長度 2.5mm-2.5mm-允收。允收。2021/7/2345拒收狀況(Reject Condition)DIP焊錫性工藝標準-焊錫性問題(錫橋、短路、錫裂)DIP soldering workmanship -soldering issue ( Bridge , short , crack )錫短路、錫橋 :1.兩導體或兩零件腳有錫短路、 錫橋(MA)。錫裂:1.因不適當之外力或不銳利之修 整工具，造成零件腳與焊錫面 產
71、生裂紋，其長度超過零件腳 外徑1/2圈,不影響功能(MI)。拒收狀況(Reject Condition)拒收狀況(Reject Condition)錫短路、錫橋 :1.兩導體或兩零件腳有錫短路、 錫橋(MA)。 2021/7/2346拒收狀況(Reject Condition)DIP焊錫性工藝標準-焊錫性問題(空焊、錫珠、錫渣、錫尖)DIP soldering workmanship -soldering issue ( missing solder , solder ball , solder dross , solder peak )1.錫珠與錫渣可被剝除者或不易被剝奪者,直徑D或長度L
72、10 10 mil且1/2W)(MI)。3.Whichever is rejected . 拒收狀況(Reject Condition)拒收狀況(Reject Condition)空焊:焊錫面零件腳與PCB焊錫不良超過焊點之50%以上(超過孔環之半圈)(MA)。DL1/2WLPin寬度寬度=W2021/7/2347理想狀況(Target Condition)金手指工藝標準-沾錫、沾漆、沾膠、刮傷翹起Gold finger workmanship拒收狀況(Reject Condition)允收狀況(Accept Condition)沾錫長度16 mil單面金手指沾錫點數3點1.金手指表面無任何沾
73、錫、沾漆、沾膠現象。2.金手指無任何刮傷現象 。1.同一機板單面之金手指沾錫點 數3點，或其中一點長度16 mil(MA)。2.金手指翹起(MA)。3.金手指刮傷可見鎳層或底材(MA)。4.金手指沾漆、沾膠或其它有影響信賴度之污染物(MA)。5.Whichever is rejected。1.同一機板單面之金手指沾錫點數3點,一根金手指只能允許1點,且每點長度10mil.2.金手指無任何翹起。3.金手指輕微刮傷未見鎳層或底材。4.A區=錫點直徑須,0.25mm,同一PAD不可超過一點,同一面不得超過3點含A區及B區.單面金手指沾錫點數3點且沾錫長度10milL1/3L1/3L1/3LB區A區接觸區非接觸區2021/7/2348个人观点供参考，欢迎讨论
