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1、gxj基板产品介绍及制程简介shkStillwatersrundeep.流静水深流静水深,人静心深人静心深Wherethereislife,thereishope。有生命必有希望。有生命必有希望二.產品介紹單、雙面板1.FR-4 FR-4-86 FR-4-UV NP-140 NP-150 NP-170 NPG 2.CEM-3 CEM-3-86 CEM-3-92 CEM-3-95 3.CEM-1 CEM-1-87 CEM-1-97 4.FR-5 NP-180內層板 1.FR-4-TL 2.NP-140TL 3.NP-150TL 4.NP-170TL 5.NP-180TL 6.NPG-TLPREP
2、REG 1.7628 2.2116 3.1080 4.2112 5.2113 6.1506 7.106BT/EPOXY NP-200 Tg 200NP-LD Tg 180 LOW D.K(UL)FR-5 NP-180 Tg 180RCC NP-RCC Tg 180 (UL)FR-4 NP-170 Tg 170FR-4 NP-150 Tg 150FR-4 NPG Tg 150 Halogen freeFR-4 NP-140 Tg 140 CEM-3-86 CEM-3-92 CEM-3-95 CEM-1-87 CEM-1-97三.基板規格結構ThicknessThicknessmmmilconst
3、ructionmmmilConstruction0.1410802 plies0.52076283 plies#0.11421161 ply0.532176283 plies0.13521161 ply0.712876284 plies0.15615061 ply*0.773176284 plies#0.16621122 plies*0.83176284 plies0.18715061 ply*0.93676285 plies0.2821162 plies*1.03976285 plies#0.21876281 ply*1.24776286 plies0.251021162 plies+108
4、0 1 ply*1.55976288 plies0.261021162 plies*1.66276288 plies0.31221163 plies*2.078762810 plies0.351476282 plies*2.495762813 plies0.381576282 plies*3.2125762818 plies0.451876282 plies+1080 1 ply基板厚度管制厚度 Class管制spec.(mil)RB製品管制spec.公制標示(mm)英制標示(mil)實際厚度(mil)組成0.1144211610.50.40.13sp55211610.70.50.156615
5、0610.70.60.18sp77762711.00.70.2188762811.00.80.261010211621.01.00.301212211631.01.00.351414762821.51.00.381515762821.51.50.461818766721.51.50.502121762831.51.50.773131762843.01.51.03939762853.03.01.14343762863.03.01.24747762873.03.01.55959762883.03.01.66262762883.03.0四.基材規格別基材別R.C%壓合前厚度壓合後厚度布組織布基重mm
6、milmmmilCount/inG/m27628430.2158.50.1800.017.10.444322087628HR500.27010.60.2000.018.00.444322081506480.1907.50.1450.015.70.448421642116500.1385.40.1050.014.10.460581072116HR58-0.1270.015.00.46058107211355-0.0900.0083.50.3605678211260-0.0750.0083.00.34040721080620.0873.40.0650.0082.50.36048481080HR68
7、-60484810668-0.0450.0081.80.3565626*壓合前厚度係取全幅寬基材(1250mm)量測10點之平均值。*玻纖布來源均由Nan Ya玻纖布廠製造。基材管制標準:UL商品名NP140B種類R.F%R.C%一般管制水準(%)RB製品管制水準(%)7628HR(762802855031.57628MR2554731.576282054331.515062554831.521162555031.523132555531.521133055631.521123556031.510803556231.51064056831.51.G.T均管制13020(170熱板)2.V.C%
8、均管制0.75Liquid epoxy 溴化合成 TBBA 配料 熟成 玻纖布 玻纖蓆 棉紙 含浸銅箔離型膜 組合 疊片a.Tedler、b.BOPP緩衝材 熱壓a.牛皮紙、b.緩衝墊 拆卸 裁剪 檢查、包裝 配別類別: 1.FR-4 2.CEM-3(Natural&Black兩種) 3.CEM-1 4.客戶基材及薄基板 5.UV不透光FR-4含浸機乾燥爐:1.垂直式含浸玻纖布2.水平式含浸玻纖蓆棉紙分梱、檢查、包裝客戶基材外售檢查、包裝雙面板 冷卻1.裁邊-full size2.Panel cutting-panel size3.Edge beveling-panel size五.製造工程流
9、程圖銅箔基板製造工程及控制要點簡介製造段合成配料含浸組合熱壓製造工程基本樹脂四溴雙酚反應成溴化樹脂LER+TBBA+LER1.在溴化樹脂內添加硬化劑、促進劑及溶劑,CEM-1、CEM-3另添加FILLER,攪拌均勻2.熟成:使VARNISH之反應性達穩定狀態1.玻纖布含浸VARNISH再經OVEN使樹脂與玻纖布COUPLING AGENT反應,樹脂SEMI-CURE及溶劑趕出成PREPREG2.PREPREG裁成片狀PLY UP,準備LAY UP3.捲裝成客戶基材按規定將疊合之基板單面或雙面覆蓋銅箔夾於熱壓板之間1.使SEMI-CURE之樹脂完全CURE2.樹脂與銅箔之處理面完全貼合3.將樹脂
10、內之氣體完全趕出控制要點1.EEW (EPOXY) EQUIVALENT WEIGHT)2.固形份3.HY-CL1.膠化時間2.固形份3.比重1.膠化時間2.樹脂含量3.樹脂流量4.揮發份5.樹脂動黏度無塵室清潔度1.CURE TIME 60min以上2.壓力一、尺寸與外觀1.厚度2.長寬3.直角度4.雜質5.銅箔外觀PIT&DENT、刮傷、PCB製程去不掉的有害物.。6.銅箔厚度二、機械特性1.尺寸安定性4.銅箔的接著強度2.沖孔性5.板彎、板翹3.彎曲強度三、化學特性1.抗化學藥品性2.銅箔經PCB製程後的接著強度五.銅箔基板的品質要求(IPC-4101)四、電氣特性1.體積阻抗4.消耗因素2.表面阻抗5.潰電電壓3.介電常數6.比較漏電指數五、物理特性1.焊錫耐熱性5.耐燃性2.焊錫性6.吸水率3.TG7.微孔洞4.膨脹係數六.製程品管流程圖七.成品品質管制基板PrepregTestingPhysicalPropertiesVisualTestreportOutofSpec.RejectShippingG.T.R.C.%R.F.%V.C.%(2)基基材材
