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1、A- stage A阶段Abietic Acid 松脂酸Abrasion Resistance 耐磨性Abrasives 磨料,刷材ABS 树脂Absorption 吸收,吸入AC impedance 交流阻抗Accelerated(Aging) Test 加速试验,加速老化Acceleration 速化反应Accelerator 加速剂,速化剂Acceptability, Acceptance 允收性,允收Acceptable Quality Level(AQL) 允收质量水平 Access 存取,使用,接近,进入Access Hole 露出孔(穿露孔,露底孔)Accuracy 准确度Aci
2、d Copper Plating 酸性电镀铜Acid Dip浸酸Acid Number(Acid Value) 酸值Acoustic Microscope(AM) 感音成像显微镜Acrylic 压克力Actinic Light(or intensity ,or Radiation) 有效光Activation 活化Activator 活化剂Active Carbon 活性炭Active Parts(Components or Devices) 主动零件Acutance 解像锐利度Addition Agent 添加剂Additive Process 加成法Additives 添加剂Adhesio
3、n 附着力Adhesion Promotor 附着力促进剂Adhesive 胶类或接着剂Admittance 导纳Aerosol 喷雾剂,气溶胶,气悬体Agglomeration 凝絮Aging 老化Air Agitation空气搅伴Air Bearing空气轴承Air inclusion气泡夹杂Air Knife气刀,气廉Algorithm 算法Aliphatic Solvent 脂肪族溶剂Aluminium Nitride(AIN) 氮化铝Ambient Temp 环境温度Amorphous 无定形,非晶形Amp-Hour 安培小时Analog Circuit/Analog Signal
4、模拟电路/模拟讯号Anchoring Spurs 着力爪Angle of Attack 攻角Angle of Contact 接触角Anion 阳向游子(阴离子)Anisotropic 异向的,单向的Anisotropic Conductive Adhesive (ACA) 单向(垂直)导向胶Anisotropic Conductive Film (Adhesive)单向导电接着膜Anneal 韧化Annular Ring 孔环Anode 阳极Anode Sludge 阳极泥Anodizing 阳极化ANSI 美国标准协会Anti-foaming Agent 消泡剂Anti-pad 空圆,隔离
5、空垫Anti-pit Agent 抗凹剂Any Layer interstitial Via Hole(ALIVH) 阿力夫制程AOI 自动光学检验Apertures开口,钢版开口,光束出口AQL 质量允收水平Aramid 聚酰胺树脂Aramid Fiber 聚酰胺纤维Arc Resistance 耐电弧性Area Array Package 面积格列封装(组件)Array 格列,排列,数组,一排,一条,一套组合Artwork 底片As Received 到货,收货ASIC 特定用途的集成电路器Aspect Ratio 纵横比Assembly 装配,组装,构装Automatic Testing
6、 Equipment(ATE) 自动电测设备Attenuation 讯号衰减Autoclave 压力锅Auxiliary Anode(or Cathode) 辅助阳极(阴极)Availability 航空电子品Axial Lead 轴心引脚Azeotrope 共沸混合液B-stage B阶段Back Light(Back Lighting) 背光法Back Taper 反斜锥角Back-up 垫板Backpanels,Backplanes 背板,支撑板Bail Outqyi 勺出Balanced Transmission Lines 平衡式传输线Ball Grid Array 球脚数组(封装)
7、Bandability 可弯曲性,弯曲能力Bandwidth 频带宽度,频宽Banking Agent 护岸剂Bar Chart 直方圆Bar Code条形码Bare Board 空板,未装板(大陆业称光板)Bare Chip Assembly裸体芯片组装Barrel 孔壁,滚镀Barrier 障凝层Base Material 基材Baseband Area 基频区Basic Grid 基本方格Batch 批Baume 波美度Beam Lead 光芒式的平行密集引脚Bed-of-Nails Testing 针床测试Bellows Contact 弹片式接触Bend Test 弯曲试验Beta
8、Ray Backscatter 具他射线反弹散射Bevelling 切斜边Bias 斜张网布,斜织法Bi-level Stencil 双阶式钢版Binder 黏结剂Bipolar Electrodes 偶极性电极组Bits 头,针尖Black Oxide 黑氧化层Blanking 冲空断开Bleach 漂洗Bleeding 渗流Blind Via Hole 盲导孔Blister 局部性分层或起泡Block Diagram 电路系统整合图Blockout 封网Blotting 干印Blotting Paper 吸水纸,吸墨纸Blow Hole 吹孔Blue Plaque 蓝纹Blue Print
9、 蓝图Bluetooth 蓝牙/蓝芽(短期无线通讯之整合技术)Blur Edge(Circle) 模糊边带,模糊边圈Bomb Sight 弹标Bond Strength 结合强度,固着强度Bondability 结合性,固着性Bonding Layer 结合层,固着层Bonding Sheet(Ply,Layer) 接合片,接着层Bonding Wire 结合线Bow,Bowing 板弯Braid 编线Brazing 硬焊Break Point 出像点,显像点,露铜点Breakaway Panel 可断开板Breakdown Voltage 崩溃电压Break-out 破出Bridging 搭
10、桥,桥接Bright Dip 光泽浸溃处理Brightener 光泽剂Brown Oxide 棕氧化Brush Plating 刷镀Build-up 增厚,堆积,增层Build-up Multilayer(BUM) 增层法多层板Build-up Process 增层法制程Built-in 内建Bulge 鼓起,凸出Bulk Solution 主槽液,主体溶液Bump 突块,凸块Bumping 凸块封装技术Bumping Process 凸块制程Buoyancy 浮力Buried Capacitor (or Resistor) 埋入式(内建式)电容器(或电阻器)Buried Hole 埋通孔Bu
11、ried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Bus Bar 汇电杆Butter Coat 外表树脂层By-product 副产品,副产物C-stage C阶段Controlled Collapse Chip Connection(C4 Chip Joint)C4芯片焊接Cable 电缆CAD 计算机辅助设计Calendered Fabric 轧平式网布Camcorder 摄录像(像)机Cap Lamination 帽式压合法Capacitance 电容Capacitive Coupling 电容耦合Capillary Action 毛细作
12、用Capillary Direct Film(CDF) 毛细式直接版膜Capture Pad 微盲孔之外环,面环Carbide 碳化物Carbon Arc Lamp 碳弧灯Carbon lnk 碳胶,碳膜Carbon Treatment, Active 活性碳处理Card 卡板Card Cages, Card Racks 电路板构装箱Carlson Pin 卡式定位梢Carrier 载体Cartridge 滤芯Cascade Rinse 连续溢流式清洗Castallation 堡型集成电路器Catalyzed Board, Catalyzed Substrate (or Material)催化
13、板材Catalyzing 催化Cathode 阴极Cathode Rod Agitation 阴极杆搅拌Cation 阴向游子,阳离子Caul Plate 隔板Cavitation 空泡化,半真空状态Cavity Down/Cavity Up 方凹区朝下或朝上Cell Phone 行动电话Center-to-Center Spacing 中间间距Ceramics 陶瓷Cermet 陶金粉Certificate 证明书CFC 氟氯碳化物Chamfer 倒角Characteristic lmpedance 特性阻抗Chase 网框Check List 检查清单Chelate 螯合,螯合剂,Chel
14、atorChemical Milling 化学研磨Chemical Resistance 抗化性,耐化性Chemisorption 化学吸附Chip 晶粒,芯片,片状Chip Clearance 排屑间隙Chip Clogging 堵屑,塞屑Chip interconnection 芯片互连Chip On Board(COB) 晶板接装法Chip on Flex (COF) 芯片直接安装软板Chip On Glass (COG) 晶玻接装法(芯片对玻璃电路板的直接安装)Chip Scale Package 芯片级封装Chisel 錾刃Chlorinated Solvent 含氯溶剂,氯化溶剂C
15、holine Hydroxide 瞻碱Circuitization 成线Circumferential Separation 环状断孔Clad/Cladding 披覆Clean Room 无尘室,洁净室Cleanliness 清洁度Clearance 空环,余隙Clinched Lead Terminal 紧箝式引脚Clinched-wire Through Connection 通孔弯线连接法Clip Terminal 绕线端接Clock Frequency(Clock Speed Clock Rate) 频率速率Coat, Coating 皮膜,表层Coaxial Cable 同轴缆线Coefficient of The
