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1、FAT-PCBBusinessGroup工程設計流程單EngineeringDesignprocesscard單位department：Page：1/3使用廠區applicationplant：料號客戶料號交期年月數量P/NCustomerP/Ndeliverydata日amount樣品直接量產第一次量產改正量產重點料號QTP(8HRS)samplemassproductiondirectlyfirstmassproductionmassproductionaftermodifyimportantP/N開始达成流程別時間時間簽名注意事項attentionitemProcessSignStart
2、ingFinishtimetime資料接受acceptdocument資料室Documentroom原稿originalGerber1.解壓縮Releasecompress2.印D-CodePrintD-Code3.DesignInput4.EditWheel5.D-Code核對CheckD-codeCAM資料E-mailDISKA/WDRAWING樣品板其余FileSampleother數量amountFILENAME:層別內層外層防焊文字錫膏化金機構圖鑽孔其余TOTALInnerOuterSoldersilkscreFramewlayerPasteENIGdrillotherlayerla
3、yermaskenorkmap數量quantity原稿線寬間距VIAPADSIZE能否有重覆孔能否有近孔LinewidthDuplicateholeCloseholeLinespacingOriginal最盲孔埋孔貫孔盲孔:盲孔:docume主要最小空接主要小BlindBurieThroughblindholeBuriedholentnormalMin.opennormalmin.holedholeholeCompSold埋孔:埋孔:L2BuriedholeBuriedholeL3貫孔:貫孔:L4ThroughholeThroughholeL5Via檔點SC:L6ViablockL7原稿中能否
4、有小於10mil的pad須L8化金處理?WhetheranypadoforiginalGerbersmallerthan10milneedtoimmersiongold?L9異常項目說明:AbnormalitemexplainL10L11L12外層outerlayer防焊soldermaskMinBGApadsize:MinBGApadsize:MinBGApitch:MinBGApitch:MinSMDpadsize:MinSMDpadsize:MinSMDpitch:MinSMDpitch:客戶有VCC與GND層時.剖析drillocheck能否有同時導通的孔.NOYES,有請op提出確認
5、checkthesamedrillwhetherboththroughVCCandGND?noyesifyes,opneedtoconfirmOP工程Opengineering1.資料審查Filereview2.問題澄清Questionclarify3.原稿底片檢查Orginalartworkcheck4.D-Code核對D-codecheck5.填寫RuncardMakeRunCardOPECNNewGerberDummyBoard更動發料尺寸materialsize排版array補償值compensationvalue鑽孔drill項目內層innerlayer外層outerlayer防焊s
6、oldermask文字silkscreenChanged成型rout生產流程process基材CCL疊構Stack-upitems塞孔plugvia表面處理surfacetreatment其余other說明版本變更:NOYESREV.explaiScript重RunnationScriptrunagainScript不重Run,手動移板邊Tooling(靶孔,CCD,夾具孔,半自動Tooling,防焊曝光點,文字靶標,.)Norerunningscript,displaceboardsidetooling(Targethole,CCD,toolinghole,semi-matictooling
7、,soldermaskexposurespot,lengendtarget)Script不重Run板邊Tooling不變Norerunningscript,nochangeofboardsidetooling.CAM改正內容改正达成後见告OP確認後才畫片Modificationcompletedandopcomfirmed,thendrawartworkCAMmodifyNOYES,OP:1.EditPCB能否有GERBER資料的成型框2.EditPanelRoutingframeofGERBERdata3.出帶NO,有FABYES,CAM需量尺寸給R/T(NOYES)CAMYES,CAMme
8、asuresizeandsendtoR/T舊版(上版本)底片能否回收:NOYESWhetherRecycleOldartwork能否有附件:NOYES,張底片Workingpnl改正層別:Appendix:NOYES_piece*workingpnl能否為龍鳳排版:NOYES,Artworkworkingpnlmodifylayers*客戶能否供给IPC-D-356或Mentor的Netlist的格式:NOYES工作底片檢查Artworkworkingpnlcheck底片房artworkroomWhethercustomerappliedIPC-D-356ortheMentorformatfo
9、rnetlist(折斷邊/板內)文字框需移位(表單編號)注意事Displace(Breakoffboarder/insideboard)lengendframe項(折斷邊/板內)料號改正attentionModifyP/Nat(breakoffboarder/insideboard)i tems(文字/塞孔)改正,送底片時請通知線上改正網板modify(lengend/plugedhole),telllinetomodifynetboardwhilesendingartwork試鑽板檢查開始达成時簽名1.能否要試鑽:是(NEWFILE改補償值Firstboardcheck時間間Needtofi
10、rstdillyesmodifycompensationvalue試鑽人員StartingCompletingsignature改發料其余)timetimeMaterialChangeother否(版本同版,或其余)No(thesamefileto_,orother_)2能否有PTH之SLOT孔需於壓合後撈出:是否SLOTholeofPTHholeneedtoroutafterlaminationyesno壓合後撈邊程式編寫1.壓合後裁邊尺寸:“X“(一次壓合)firstlaminationSizeofroutingafterlaminationMakeroutingprogram“X“(二次壓合)secondlaminationforboardsideafter“X“(三次壓合)thirdlaminationlaminationRouting人員2.能否有板內之PTH孔需在鑽孔後時撈出:是否PTHholeinboardneedtoroutingafterdrillingRoutingby程式:program.PS.PSP3.能否於壓合撈邊時撈出4顆電測孔是,靶孔程式為T_否Routing4E/TholeswhilelaminationroutingYES,targetprogram_NO成品RUOTING1.成型尺寸依:GERBER(成型框)FAB(機構圖
