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1、Exempted Items of RoHS DirectiveRoHS指令豁免项目The Commission of the European Communities have issued eight commission decision about the exemptions. They are 2002/95/EC、2005/717/EC、2005/747/EC、2006/310/EC、2006/690/EC、2006/691/EC、2006/692/EC and 2008/385/EC.There are 32 exemption items altogether.欧盟委员会针对
2、豁免材料陆续发布了8次决议，分别是：2002/95/EC、2005/717/EC、2005/747/EC、2006/310/EC、2006/690/EC、2006/691/EC、2006/692/EC和2008/385/EC，这些决议中的豁免共计32项：Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.小型荧光灯中的汞，汞含量不超过5mg/灯。Mercury in straight fluorescent lamps for general purposes not exceeding:普通用途直荧光灯中的汞，汞含
3、量不超过：Halophosphate 10 mg;盐磷酸盐 10mg.Triphosphate with normal lifetime 5 mg;普通寿命的三磷酸盐5mgTriphosphate with long lifetime 8 mg.长寿命的三磷酸盐8mgMercury in straight fluorescent lamps for special purposes.特殊用途直荧光灯中的汞Mercury in other lamps not specifically mentioned in this Annex.本附录未明确提出的其它灯具中的汞Lead in glass of
4、 cathode ray tubes, electronic components and fluorescent tubes.阴极射线管，电子组件以及荧光管的玻璃中的铅Lead as an alloying element in:铅作为合金元素在：Steel containing up to 0.35 % lead by weight;钢里，铅的重量含量不超过0.35 %Aluminium containing up to 0.4 % lead by weight;铝里，铅的重量含量不超过0.4%Copper alloy containing up to 4 % lead by weight
5、.铜合金里，铅的重量含量不超过4% Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead).用于高温融化焊料中的铅（即：锡铅焊料合金中铅含量超过85%）Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as we
6、ll as network management for telecommunication.用于服务器，存储器和存储系统中的铅，用于交换，信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅。Lead in electronic ceramic parts (e.g. piezoelectronic devices).电子陶瓷产品中的铅（如：高压电子装置）Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 9
7、1/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.根据修改关于限制特定危险物质和与制品销售和使用的第76/769/EEC号指令的91/338/EEC号指令禁止以外的电气Adherent point和镉电镀。Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in abso
8、rption refrigerators.在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。Lead in lead-bronze bearing shells and bushes.用于铅铜合金轴承和衬套中的铅。Lead used in compliant pin connector systems.顺应针连接器系统中的铅。Lead as a coating material for the thermal conduction module c-ring.用于热传导模块C-环的被覆材料中的铅。Lead and cadmium in optical and filter glass.用于光学及
9、滤波器玻璃中的铅和镉。Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之间）。Lead in solders to complete a viable electrical connecti
10、on between semiconductor die and carrier within integrated circuit Flip Chip packages.集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。Lead in linear incandescent lamps with silicate coated tubes.用于带有硅酸盐灯管的线型白炽灯中的铅。Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprogra
11、phy applications.用在专业复印领域高强度放电灯(HID)做激发介质中的卤素铅。Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography
12、, insect traps, photochemical and curing processes containing phosphors such as SMS (Sr,Ba)2MgSi2O7:Pb).放电管的荧光粉中作为催化剂的铅（铅的重量小于等于1%）可以豁免，当放电管用于含有磷元素（如BSP (BaSi2O5:Pb)）的日晒灯时，以及用于重氮印刷、平板印刷、捕虫、光化学、固化工艺等等专业领域的灯具时。Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg
13、as auxiliary amalgam in very compact Energy Saving Lamps (ESL).小型节能灯中作为主要汞合金的特定的PbBiSn-Hg 和PbInSn-Hg中的铅，以及作为辅助汞合金的PbSn-Hg中的铅。Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).LCD的平板荧光灯前后基板键合时所用玻璃中的铅。Lead and cadmium in pri
14、nting inks for the application of enamels on borosilicate glass.用在硅硼玻璃表面瓷釉上的印刷油墨中的铅和镉；Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.在光纤通讯系统中的稀土铁石榴石法拉第旋转器中的杂质铅；Lead in finishes of fine pitch components other than connectors with a pitch
15、of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames.小螺距零部件表面处理中的铅（螺距不超过0.65mm且带镍铁边框的连接器，以及螺距不超过0.65mm且带铜边框的连接器不在豁免之内）Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the addr
