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1、RoHS 豁免清单豁 免 项对应文件号签署/颁布日期1. Mercury in compact fluorescent lamps not exceeding 5 mg / lamp小型日光灯中的汞含量不得超过5毫克/灯2002/95/EC2003.01.27/2003.02.132a. Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10 mg一般用途的直管日光灯中的汞含量不得超过磷酸盐10 毫克 2b. Mercury in straight fluorescent
2、 lamps for general purposes not exceeding triphosphate 5 mg.一般用途的直管日光灯中的汞含量不得超过正常的三磷酸盐 5毫克2c. Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate 8 mg一般用途的直管日光灯中的汞含量不得超过长效的三磷酸盐 8毫克3. Mercury in straight fluorescent lamps for special purposes.特殊用途的直管日光灯中的汞含量4. Mercur
3、y in other lamps not specifically mentioned in this list本附录中未特别提及的其它照明灯中的汞含量5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes阴极射线管、电子部件和荧光管的玻璃内的铅含量6a. Lead as an alloying element in steel containing up to 0.35% lead by weight.铅作为钢的合金元素，其含量可达0.35%（重量计）6b. Lead as an a
4、lloying element in aluminum containing up to 0.4% lead by weight.铅作为铝的合金元素，其含量可达0.4%（重量计）6c. Lead as an alloying element in copper containing up to 4% lead by weight铅作为铜的合金元素，其元素含量可达4%（重量计）7a. Lead in high melting temperature type solders. (i.e. lead based solder alloys containing 85% by weight or m
5、ore lead)较高熔融温度型焊料中的铅（即：铅含量达85%或以上的铅基焊料合金）2005/747/EC2005.10.21/2005.10.257b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications.用于服务器、存储和存储列阵系统、以及电信用交换、发信、传输和网络管
6、理的网络基础设施设备的焊料中的铅7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices.)电子陶瓷产品中的铅（例如：高压电子装置）8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the mark
7、eting and use of certain dangerous substances and preparations 除了76/769/EEC关于限制某些有害物质和制品销售和使用指令的修改件91/338/EEC 指令中禁止用途外，电触头和镉镀层上的镉及其化合物9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators吸收式电冰箱中作为碳钢冷却系统防腐层用的六价铬2002/95/EC2003.01.27/2003.02.139 a. D
8、ecaBDE in polymeric applications 聚合物中用的十溴二苯醚 -据欧洲法院判决该条于2008.07.01删除，不被豁免2005/717/EC2005.10.13/2005.10.159 b. lead in lead-bronze bearing shells and bushes铅黄铜轴承壳和电刷中的铅10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for: Deca BDE, mercury in straig
9、ht fluorescent lamps for special purposes, lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption),
10、and light bulbs,欧盟委员会应根据在第7（2）条中提及的程序，评价以下方面的应用： 十溴二苯醚； 特殊用途的直管日光灯中的汞； 以下用途中所使用的焊料中的铅：服务器、存储器、用于交换和传输的网络基础设施、电信网络管理设备（旨在设定本指令豁免部分的特定截止时间）； 灯泡。2002/95/EC2003.01.27/2003.02.1311. Lead used in compliant pin connector systems自适应插脚系统中的铅2005/747/EC2005.10.21/2005.10.2512. Lead as a coating material for a
11、thermal conduction module c-ring作为热导模块C环镀层材料的铅13a. Lead in optical and filter glass光学滤光玻璃中的铅13b. Cadmium in optical and filter glass光学滤光玻璃中的镉14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more tha
12、n 80% and less than 85% by weight连接插脚与微处理器封装、含两个元素以上且铅含量大于80而小于85的焊料中的铅15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages集成电路倒装晶片封装的半导体连接片和托架之间实施电气连接用焊料中的铅16. Lead in linear incandescent lamps with silicat
13、e coated tubes. 管状白炽灯硅酸盐涂层灯管中的铅2006/310/EC2006.04.21/2006.04.2817. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications. 专业复印设备用的高强度放电(HID)灯中作为发光剂的卤化铅18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of dischar
14、ge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS (Sr,Ba)2MgSi2O7:Pb).当放电灯被用作含磷仿日晒灯(sun tanning
15、lamps)，比如BSP (BaSi2O5:Pb)，或重氮复印、平版印刷、捕虫器、以及含磷光化学和含磷食物加工过程的专业灯时，比如SMS (Sr,Ba)2MgSi2O7:Pb)，放电灯中的荧光粉触媒剂的铅(铅含量1或以下)19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).紧凑型节能灯(ESL)中作为主要汞合金的特定成分中PbBiSn-Hg和PbinSg-Hg中的铅以及作为辅助汞合金中PbSn-Hg中的铅2006/310/EC2006.04.21/2006.04.2820. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).液晶显示器(LCD)用连接荧光灯前后基片用玻璃中的氧化铅2006/310/EC2006.04.21/2006.04.2821. Lead
