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10、klzxcvbnmqwertyuiopasdfghjklzxcvbnmqwertyuiopasdfghjklzxcvbnmqwertyuiopasdfghjklzxcvbnmqwertyuiopasdfghjklzxcvbnmqwwertyuiopasdfghjklzxcvbnmqwertyuiopasdfghjklzxcvbnmqwertyuiopasdfghjklzxcvbnmqwertyuiopasdfghjklzxcvbnmPCB鑽孔常見之品質異常類別 3/21/2011Written By 蕭聖謙多(漏)孔paage22孔大(小小)paage44孔偏、位位移paage66孔壁粗糙糙p
11、agge111孔塞pagge155未透pagge188多(漏)孔u 多(漏)孔：鑽孔程式式之繪製製圖【PLOOT】上無孔，板上有有孔，稱之多多孔；反之，繪繪製圖上上有孔，板板上有孔孔，為漏漏孔。異常現象象異常狀況況異常之對對策多(漏)孔多(漏)孔操作因素操作因素素Spinndlee未開開啟漏孔孔之Sppinddle以以原軸、單單軸進行行補孔DL鑽長長偵測未未開開啟鑽長長偵測以以原軸、單單軸進行行補孔漏放鑽頭頭重置鑽頭頭於漏孔孔之Sppinddle以以原軸、單單軸進行行補孔作業中重重開機開啟繪製製圖,比比對板上上漏孔位位置進行行補孔跳刀orr跳孔開啟繪製製圖,比比對板上上漏孔位位置進行行補孔作業
12、程序作業程序序工件料號號與程式式不符確認機台台排程、確確認程式式與工單單相符機台設備加工條件加工條件件鑽孔程式式資料有有誤首趟鑽孔孔之資料料應進行行試鑽確確認，確確保鑽孔孔程式正正確性機台設備備DL故障障維修孔大(小小)u 孔大(小小)：板上孔徑徑與量針針不符，稱之，過過於鬆動動，為孔孔大；反反之，無無法進入入，則為為孔小。異常現象象異常狀況況異常之對對策操作因素孔大(小)加工條件孔大(小小)操作因素素鑽頭使用用錯誤將鑽頭依依鑽徑大大小進行行分類分分開放置置，避免免使用錯錯誤鑽頭頭。加工條件件鑽孔程式式資料有有誤確認繪製製圖(PLOOT)中之料料號與欲欲生產之之料號相相符。孔偏、位位移孔偏、位
13、移u 孔偏、位位移：孔朝線線路上不不同方向向偏，稱稱之孔偏偏；同一一方向偏偏，為位位移。異常原因因異常之狀狀況異常之對對策设计品质质鑽針剛性性低全面性之之孔位精精度不良良。變更芯厚厚,芯厚厚倒錐，使鑽針之之剛性增增加。容屑溝之之空間小小孔塞,孔孔位精度度變差.基板與與上蓋板板間若有有粉屑殘殘留將致使孔孔位更加加惡化。變更芯厚厚,芯厚厚倒錐,使容屑溝溝之空間間變大。溝長、刃刃長過長長溝長，刃刃長超過過所需之之長度，易發生彎彎曲量過大大致孔位位精度惡惡化。設定適當當之溝長長、刃長。鑽針形狀狀設計不不符需求求(鑽尖角,螺旋角角等)鑽針形狀狀並不適適用於基基板設定定*加工條條件*設備備上，致使精度度惡
14、化。鑽針形狀狀最適化化(依條件件選定適適合之形形狀)超硬材料料使用不符符需求磨耗量大大，致切切削性能能降低，使使精度變變差。使用著重重耐磨耗耗性能之之超硬材質質。制造品质质鑽尖面呈呈不平衡衡狀態(長短刃刃,高低差差,缺口口,單邊邊刀面大大或小等等)從基板的的第一片片疊板起起就發生生孔位精精度惡化化之現象象。加工前鑽鑽尖 形狀狀之確認認。再研磨之之研磨品質質問題同上。同上。鑽頭品質加工条件件chipploaad 太太大因粉屑排排出性差差鑽針崩崩角致使使孔位精精度惡化化。適當CHHIPLLOADD之選定。chipploaad 太太小因過度磨磨耗、致致使孔位位精度惡惡化。轉速太低低切削阻抗抗增大使使鑽針負負荷增加加，致精精度惡化化。適當轉速速之選定定。轉速太高高因摩擦熱熱增大而而發生切切屑溶著著於鑽针针、致精精度惡化化。孔限過多多因過度磨磨耗、致致使孔位位精度惡惡化設定適當當之孔數數。研磨次數數過多因刀刃外外周磨耗耗過度致致孔位精精度惡化化。重新檢討討再研磨磨次數。加工條件孔偏、位移基板条件件疊板數過過多隨著疊板板數增加加，鑽針針彎曲量量亦會增增加、致致使精度度惡化（最下面面之基板板精度最最差）選定適當當之疊板板數(能滿足足品質要要求之疊疊板數)
