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1、1板面凹痕dent2内层白斑I/L white spot3线路缺口circuit nick4蚀刻不净undering etching5绿油剥离S/M peel off6显影不净under developing7基 材 白 点laminate measling8铜面氧化copper oxide9绿油上焊盘s/m on pad10白字上焊盘c/m on pad11阻焊不良poor S/M12线路擦花track scratch13锡上线sn on circuit14聚锡sn mass15锡灰sn gray16焊盘露铜cu exposed on pad17锡上金手指sn on G/F18金手指凹痕G/
2、F dent19金手指擦花G/F scratch20金手指粗糙G/F roughness21v-cut不良poor V-cut22倒边不良poor milling23针床压伤ET dent24拖锡不良poor touch up25补金不良poor repairing Au26补油不良poor repairing s/m27针孔pinhole28胶渍paster stain29k孔内毛刺burrs in hole30锡珠入孔solder in hole31露铜expose Cu32露镍expose Ni33绿油起泡solder mask blister34绿油起皱solder mask winb
3、les35金手指氧化G/F oxiding36金颜色不良Au discoloration37金面凸起Au surface blister38绿油入孔solder mask in hole39爆板board angle damafe40翘板warp41漏印字符skip42金粗Au too big43金簿Au too thin44金手指缺口G/F voids/nick on G/F45金手指发黑G/F too black46字符印反inverse C/M47金手指针孔G/F pinholes48标志不清symbol unclear49标志错symbol wrong50绿油鬼影ghost in S/
4、M51手指印finger print52补线不良poor line repairing53锡高exessive solder54孔小hole undersize55字符错wrong C/M56字符印偏C/M misalignment57字符入孔C/M in hole58字符 重影C/M doubloe image59漏镀金手指missing plating G/F60金手指发白G/F gray61焊盘脱落pad break off/pad peel off62焊盘露铜pad expose cu63断绿油桥missing S/M bridge64塞孔block hole65水迹water pri
5、nt66锡珠solder ball67砂孔pitting68油薄69聚油excess solder mask70锡粗Sn too thick71线路上锡Sn overlap scratch72绿 油 下 杂 物contamination under S/M73焊盘损坏land damage74焊盘翘起lifted land75偏位misregistration76漏钻孔missing hole77焊盘缺口nick on pad78线路缺口nick on track1开路open circuit2短路short circuit线路狗牙circuit wist3线路缺口circuit nick4线
6、路凹痕circuit dent5渗镀plating Bloody6焊盘缺口pad nick7内层白斑I/L white spot8黑化不良poor B.O9爆板measling10粉红圈pinking ring11层压起泡press blister12错位misregistation13偏位shift14孔内无铜no Cu on Pth15孔内毛刺hole burrs16NPTH有铜Cu on NPTH17铜面露基材exposed laminate18铜面凹痕dent on Cu surface19胶渍gum residue20夹膜D/F nip21蚀刻不尽under etching22线幼l
7、ine too thin23孔大hole oversize24孔小hole undersize25偏孔hole misregistration26铜面瘤粒Cu nodule27显影不尽under developing28铜面刮伤scratch on Cu surface29塞孔hole plugged30修理不良poor repairing31铜薄copper too thin32内层擦花I/L scratch33内层偏位I/L misregistation34内层杂物I/L inclusions35掉膜film off36干膜碎D/F meaking37退锡不尽poor Sn strippi
8、ng38间隙小space too marrow39板薄board too thin40板厚board too thickness41针孔pinhole42崩孔breakout43侧蚀undrcut44镀层粗糙plating layer roughness45亚色dull colour46焊 盘 翘 起lifted land47漏 钻 孔missing hole48露 布 纹weave exposure49钻 偏 孔hole misregistratiion50孔 损 害hole damage51基 材 分 层delamination52蚀 刻 过 度over etching53多 孔hole
9、too much54残 铜remain Cu55孔 内 露 基 材laminate exposure in hole56焊 盘 脱 落pad break off57焊 盘 凹 痕pad dent58焊 盘 凸 起pad bulge59焊 盘 损 坏pad damaged60焊 盘 缺 口pad nick61焊 盘 露 铜pad exposeCuPCB及PCBA常用英语汇总(4)1 内层开路 Inner open 2 内层断路 Inner short 3 外层开路 Outer open 4 外层断路 Outer short 5 内层蚀刻过度 Inner over ecthing 6 外层蚀刻过度
10、 Outer over ecthing 7 内层树脂气泡 Resin void 8 内层杂物 Foreign material 9 内层图形移位 Inner pattern mis-registration 10 层与层移位 Layer to layer mis-registration 11 打孔不良 Improper targeting 12 内层蚀刻不净 Inner under etching 13 露布纹 Weave texture/exposure 14 檫花（氧化膜面） Scratch(Oxide surface) 15 板损坏 Damaged board 16 分层（物料） De
11、lamination (Raw material) 17 内层不配套 Excessive inner core 18 板过厚 Over thickness 19 白点（压板） Measling (Pressing) 20 白点（喷锡） Measling (HSAL) 21 板曲 Warpage 22 板焦黄 Burnt 23 起皱 Wrinkle 24 起泡（压板） Blistering (Pressing) 25 镀层起泡 Blistering (Cu plating) 26 喷锡起泡 Blistering (HSAL) 27 板面凹痕 DENT (Pressing profilling G/F) 28 白斑 Crazing 29 胶渣 Gum residue 30 孔未穿 Incomplete drilling 31 披锋 Burr 32 多孔 Extra hole 33 偏孔 Hole shift 34 孔径大 Hole oversize 35 孔径小 Hole undersize 36 少孔 Missing Hole 37 塞孔 Block hole 38 崩孔 Hole breakout 39 孔粗糙(镀铜） Hole roughness（Cu plating
