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1、RSP-6100S系列液态感光阻焊油墨RSP-6100S Liquid Photoimageable Solder Mask 一、 产品介绍Introduction of product 感光型RSP-6100S/HD-20绿油是一种两液型之碱溶性液态感光阻焊油墨，适应网印、帘涂；用于高精密度及多层印刷电路板防焊制作。具附着力强、密着性高、耐高温不变色、能做沉镍金或沉锡、沉银、喷纯锡、塞孔、绿油桥等工艺。此系列油墨属欧洲环保认证油墨。RSP-6100S /HD -20 is liquid photoimageable solder mask . It is two-component and
2、alkali soluble with good screen printing and curtain coating adaptability ; Its usually used in manufacturing High-precision and multi-layer printed circuit board . The post cured film provides excellent adhesion and adherence , resistance to heat and discoloration , available for processes of immer
3、sion Ni-Au , immersion tin or silver ; Lead Free HAL , hole plugging , green ink bridging , etc .This kind of serial ink has received UL certification .二、产品型号Type of product 型 号Type of ink 颜 色Color型 号Type of ink颜 色ColorRSP-6100S G-5特浅绿Extra light greenRSP-6100S Y-H浅 黄Light yellowRSP-6100S G-6浅 绿Ligh
4、t greenRSP-6100S Y-B中 黄Medium yellowRSP-6100S G-7中 绿Medium greenRSP-6100S Y-HR深 黄Deep yellowRSP-6100S G-8中 绿Medium greenRSP-6100S BL蓝 色BlueRSP-6100S G-9深 绿Deep greenRSP-6100S W白 色WhiteRSP-6100S G-10最深绿Extra deep greenRSP-6100S P紫 色PurpleRSP-6100S G-Y哑 绿Green and mattRSP-6100S BK黑 色BlackRSP-6100S R红
5、色RedRSP-6100S BK-Y哑 黑Black and matt 备注：详情请参考本公司色板卡。 Notes : please refer to color board in our company for details .二、 油墨特性Properties of ink1、特性 Properties项 目Items规格值Specification备 注Notes主剂BaseRSP-6100SRSP-6100S粘稠状Viscous硬化剂HardenerHD-20A/B/CHD-20A /B/C粘稠状Viscous混合比例Mixing ratio主剂：硬化剂 = 750：250Base/
6、hardener =750:250重量比Weight ratio混合粘度Viscosity after mixing17040PS17040psVT-04粘度计（25）VT -04 viscometer (25)不挥发成份Solid content75-78wt%75-78wt%主剂和硬化剂混合后Measured after mixing预烘范围Pre-baking limit75/60分钟75/60min最大极限Maximum boundary适当曝光能量Exposure energy300-500mj/cm2300-500mj /cm2油墨表面所接受的能量Energy accepted b
7、y surface of ink混合后保存期Pot life after mixing24小时24 hours25以下阴暗处保存Store below 25 in dark保存期限Shelf life制造后6个月6 months since the date of manufacture25以下阴暗处保存Store below 25 in dark2、预烤范围Pre-baking limit7530分钟30min40分钟40min50分钟50min60分钟60min显影Development 显影条件：1%Na2CO3,30,50-60秒，2.0kg/cm2,“”表示OK Requiremen
8、t for development : 1%Na2CO3 ，30，50-60sec，2.0kg/cm2, “” means ok. 3、设置试验（经7525分钟预烤后）Put to test (After 7525min pre-baking )时间Time12h24h36h48h显影Development 静置环境：25，60%RH, “”表示OKEnvironment for holding : 25 , 60%RH , “”means ok. 4、感光性Photosensitivity项目Items油墨厚度Thickness of ink曝光能量Exposure energy显影时间De
9、velopment time曝光格数Exposure grid number21階曝光试验21 steps exposure test15-25m300mj/cm2400mj/cm2500mj/cm250-60sec9-1010-1111-12四、硬化后之特性Properties after post cured项 目Items试验方法Test method结 果Results附着性AdhesionJISD0202 8.12 百格试验Laceration experiment , JISD0202 8.12100/100铅笔硬度Pencil hardnessJIS K5400 6.14 刮痕以
10、不露铜为准Standard of Cu not exposed by scratching JISK 5400 6.146H以上6H耐热性Resistance to molten solder焊锡炉试验，松香系列助焊剂 288、10秒3次28810sec3times , solder furnace test , rosin soldering flux OK耐酸性Acid resistance25，10 wt% H2SO4 浸泡30分钟 胶带剥离试验25, saturated for 30min in 10wt% H2SO4 ,peeling adhesive strip testOK耐碱性
11、Alkali resistance 25，10 wt% NaOH 浸泡30分钟 胶带剥离试验25,saturated for 30min in 10wt% NaOH ,peeling adhesive strip testOK耐化性Chemical resistance88/20min Paragon 之NIMUDEN SX（沉镍）88/20min Paragon 之ELGB 5H（沉金）88/20min Lea Ronal之Ranamax SMT(ENIG)OK绝缘性Insulation resistanceIPC梳型（B面板）25，65%RH，500V/MINIPC comb-type (
12、B side board) 25,65%RH ,500V /MIN5.01012可焊性SolderabilityIPC-SM-840BOK耐燃性Resistance to flameUL 94V-0OK 此资料为本公司试验结果，不作为保证之用。The values above are based on experiments in our lab , not for commitment . 适宜条件，需参照技术资料，待贵司实施确认后，再予以确定。Proper conditions must refer to technological data , it needs to be carrie
13、d out for any company in order to get useful data . 五、流程及参数Procedure and Parameter1、 开油Mixing and preparation将主剂、硬化剂按照3：1之比例充分混合后，搅拌1-2分钟、震荡10-15min，使油墨粘度稳定后再进行使用。Completely stir for 1-2min with 10-15min concussion after mixing base and hardener according to the ratio 3 to 1 , in order to get homogeneous mixture , it can be put to use as the viscosity of ink stable .2、 基板前处理Pre-treatment of board机械磨刷和酸处理，让基板干净干燥（水膜15秒以上，磨痕在10-15mm）。Mechanical polish-brush and acid treatment make board cle
