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1、PCB Jargon （pcb专业术语）Absorption 吸收、吸入Accelerated Test（ Aging ） 加速试验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（ AQL） 允收品质水准Accuracy 准确度ACF： Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为 ActivatorActive parts （ Devices ） 主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加
2、成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国标准协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArra
3、y 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light （ Back Lighting ） 背光法Back-UP 垫板Backpanels/ Backplanes 背板、支持板，厚度较厚，Ball Grid Array （ BGA） 球脚车列（封装）Barrel 孔壁B
4、ase Material 基材Batch 批(同时间发料某一数量的板子)Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化( Brown Oxide )Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole吹孔，PTH孔壁有破洞(void)所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指
5、PPBonding Wire 结合线，IC之晶片与PCB弓I线Bow板弯Break-away Panel 可断开板或者说Break Away TabBreak Point 出像点、影像点Break-Out 破出(钻孔破出开成断环情形)Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump突块Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: C
6、omputer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC氟氯碳化物 Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Chara
7、cteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室 (Class 100)Cleanliness 清洁度Clearance 余隙、余环COB( Chip on Board ) 晶片在板上直接组装COC( Certificate of Compliance) 出货合格书COF( Chip on Flexible PCB )COG( Chip glass )Coefficient of Thermal Expansion 热膨胀系数(CTE)Cold Solder Joint 冷焊点C
8、omponent Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性试验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑(基板外观上的缺点)Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density (C.D. )电流密度( 1 ASD=9.1 ASF)Curtain Co
9、ating 液涂法DDatum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡异物、杂质DFM: Design for Manufacturing/Dirty foreign MaterialsDie 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP( Dual Inline Pack
10、age ) 双排脚封装体Direct Plating 直接电镀DI Water 纯水 (De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM(Defect Parts Per Million)Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummyf贸镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰 Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek
11、 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉 RivetFFAAR( First Article Approval Report )Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦
12、通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具(Rig and Fixture)Flame Resistant 耐燃性(分 HB VO V1及V2等四级)Flux 助焊剂Foil Burr 铜箔毛边Foot Pint ( Land Pattern ) 脚垫Foreign Material 外来物、异物FR4/F
13、lame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用标准板Grid 标准格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边(在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象)Hardener 硬化剂Hardn
14、ess 硬度Heat Dissipation 散热Hertz (Hz) 赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测 High Potential TestHit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength孔壁强度Hole Void 破洞Hot Air Levelling 喷锡 HASL/HALTHE(High Tempe
15、rature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测， ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection 互连Intermatalli
