外文翻译---机电一体化技术发展.doc

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1、外文翻译资料1, electromechanical integration and the development of technology trends Since an electronic technology birth of electronic technology and mechanical technology integration began, only a semiconductor integrated circuit, particularly in a microprocessor representative of the large-scale integ

2、rated circuits for the future, mechatronics, a technical after significant progress, and has attracted widespread attention. (1) mechanical-electrical integration, the course of development 1. CNC machine tools come out, wrote mechatronics, the first page of history; 2. Microelectronic technology, m

3、echatronicsbring a great vitality; 3. PLC, Power Electronics for the development of mechatronics provide a firm foundation; 4. Laser technology, fuzzy technology, information technology and other new technologies to mechanical and electrical integration, a new and higher level. (B) mechanical-electr

4、ical integration, the development trend 1. Integration of optical and electrical machinery. General mechanical and electrical integration system by sensing systems, energy systems, information processing systems, machinery, and other components of the structure. Therefore, the introduction of optica

5、l technology, the realization of the inherent advantages of optical technology is effective Improved mechanical-electrical integration system sensing system, energy (power) systems and information processing system. optical and electrical machinery integration is the development of mechanical and el

6、ectrical products trend. 2. Systematic self-distribution - Flexible Future electromechanical integration products, and implementation of control systems are adequate redundancy and more flexible and can better deal with an emergency, is designed self-distribution system. Self-discipline in the distr

7、ibution system, the various subsystems are independent of each others work, the subsystem for system services, and has its own self-discipline, according to different environmental conditions react differently. Its characteristics are subsystem can generate its own information and additional informa

8、tion given in the overall premise, specific action can be changed. In this way, significantly increase the systems ability to adapt (flexible), not because of the failure of a subsystem of the whole system. 3. Holographic systematic - intelligent. Future integration of mechanical and electrical prod

9、ucts, holographic features more and more obvious, more and more high-level intelligence. This is mainly revenues in the fuzzy technology, information technology (especially software and chip technology) development. In addition, the hierarchical structure of the system, a simple change of top-down s

10、ituation is complex, there is much more two-way link redundancy. 4. Of a software of the - Biomimetic systematic. Future integration of electrical and mechanical devices on the dependence of great information, and often the structure is in a static instability, but in a dynamic (work) when is stable

11、. This is a bit like living biological: When control system (the brain) to stop work, then of Death, and when control system (brain) work, the biological vitality. Bionics research in the field of a number of organisms have been found good institutions can provide products for the electrical and mec

12、hanical integration of the new body, but how to live with these new body of Life has to be in-depth study. This field of study referred to as biological - Software or biological - System, and biological characteristics of the hardware (body) - Software (brain) one and indivisible. It seems, electrom

13、echanical integration of the products although there are more systematic development, but there is a long way to go. 5. MEMS of - miniaturization. At present, the semiconductor devices used in the manufacturing process of etching technology, in the lab has produced sub-micron mechanical components.

14、When will this result for the actual product, there is no need to distinguish between the mechanical part and controller. Will be completely mechanical and electronic integration, and the body, the Executive Body, sensors, such as CPU can be integrated with the size of a small, and the formation of

15、a self-regulatory components. This micro-mechanical integration of electromechanical important direction of development. Second, the typical electromechanical integration products Mechanical and electrical subsystems integration products (complete machine) and the foundation yuan, part two categorie

16、s. Typical mechanical-electrical integration system: CNC machine tools, robotics, automotive electronic products, intelligent instrumentation, electronic publishing printing systems, CAD / CAM systems. Typical electromechanical integration yuan, components are: power electronic devices and devices, programmable logic controller, fuzzy controller, micro-motors, sensors, ASIC, servo institutions. These typical electrom

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