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1、品 質 管 理 系 統Quality Management System明泰電子科技（常熟）有限公司 2011/11/21PCB 清潔作業辦法 Clean work instructions of PCBApproved byChecked byDepartmentPrepared by張金華陳下平SMT課豐道坤Revision HistoryDateRev.DescriptionEditor2011/05/10AINITIAL RELEASE.豐道坤2011/07/27B修改內容5.7.5陳下平2011/11/21C修改內容5.5，5.7.5.原5.2.3，5.7.5刪除，增加5.4.320
2、12/02/29 D大幅度修改吳學精This document contains confidential proprietary information and is the property of ALPHA Networks Inc. The contents of this document may not be disclosed to unauthorized persons without the written consent of ALPHA Networks Inc. CS103-0106-C 6 / 6明泰電子科技（常熟）有限公司PCB 清潔作業辦法 Clean work
3、 instructions of PCB 2011/11/211.0 目的 Purpose 為了盡可能的避免洗板造成的品质问题，規範PCB印刷不良處理方式及清潔方法。For as far as possible avoids the quality question which washes the board to create, standard PCB prints the bad processing mode and the clean method.2.0 範圍 Scope錫膏印刷、點膠、貼片偏移，亂件不良之P CB。The printing, glue and SMD migra
4、tion, disorderly a adverse P CB3.0 權責單位Responsible DepartmentSMT課SMT section4.0 定義 Definition無 Noting5.0 作業內容 Content5.1工程師P/R或T/R時在PCB上加一層試板膜調試印刷效果，待調試正常後再撕掉試板膜正常印刷，避免調試不良造成洗板。 Engineers P/R or T/R in PCB when adding a layer test plate printing effect, wait for membrane debugging normal tear off ag
5、ain after test plate printing, avoid debugging membrane normally caused by poor wash boards 5.2印刷不良之PCB處理方式 Printing adverse of PCB processing method. 5.2.1印刷空焊、錫少、漏印由產線工程師或產線領班組長負責採用重印的方法處理，避免洗板。Printing empty welding, tin, less by its engineer is responsible for the production line adopts a reprin
6、t of approach, avoid washing board.5.2.2印刷短路、錫尖由操作員對其進行修正，使用針筆去除印刷短路部份。Printing short-circuits, the tin point carries on the revision after it。 5.2.3 印刷偏移不超過PAD三分之一者直接流至後段待觀察。The printing displacement of no more than one half PAD flow directly to treat the observation to the observe 5.2.5 點膠拉絲、孔塞、點膠
7、偏移由操作員對其進行修正。 Dispensing wiredrawing, hole plug, dispensing offset by an operator to its amended. 5.2.6 點膠量不足及漏點膠由操作員用手動方式進行補點膠。 Dispensing quantity deficiency and with by an operator which glue dispensing for manually. 5.2.7 以上所有動作進行後都需在PCB 板邊位置貼上黃色圓形標籤，標籤上注明處理位置， 提醒T/R段人員注意確認，沒有板邊的PCB板貼在v-cut或roat
8、ing位置。 All of the following actions must be in PCB after treatment with red bad label, position to remind T/U section researchers note. 5.3 印刷不良必須要清洗之類型 Printing bad must clean the types 5.3.1 整體印刷偏移超過PAD三分之一者需進行全面清洗。 Overall the printing displacement more than one half PAD thorough cleaning players
9、 must. 5.3.2 印刷空焊、錫少、漏印採用重印後之嚴重偏移(偏移超過Pad 1/3)需進行全部清洗。 Printing empty welding, tin less by the serious after its reprint shifts (offset over Pad with half) need to undertake all the cleaning.5.3.3 清洗之PCB需在板邊位置或v-cut,roating位置貼上紅色圓形清洗Label，以示目檢重點檢查，檢查OK品由總檢人員將清洗Label撕除後流至下制程。The PCB with cleaning to
10、clean Label, in order to show visual inspection key check, check OK product by the inspection personnel will clean Label tore except5.4 清洗PCB使用工具 Cleaning PCB tools 橡膠鏟刀、聚合物手套、PC-25、氣槍、鋼網擦拭紙、毛刷、放大鏡 Mask, polymer gloves, PC-25, air gun, dustlessness cleaning paper, brush, hand glass 5.5清洗作業步驟 Cleanin
11、g steps 5.5.1 將印刷、點膠不良之PCB，平放於清洗臺面上(如圖一)。 Will printing, dispensing adverse PCB, lie in cleaning mesa (figure 1). 5.5.2 使用橡膠鏟刀將PCB上的錫膏尽可能的铲除干净(如圖二)。 Spray scattered to apply in the block of cleaning solvent(figure 2). (圖一) (圖二)5.5.3使用擦拭紙清潔PCB表面殘錫、殘膠後, 再倒入PC25溶劑至PCB開設的孔壁內，以小刷來回的輕刷，並用擦拭紙將殘留的溶劑及錫膏紅膠擦掉(
12、圖三、圖四) 。 Using wipe paper clean surface residual tin, PCB after incomplete glue, garnish solvent to open hole wall of PCB, within the light with a brush, brush and back and forth wipe paper will remain the solvent and erase the solder paste red rubber (figure 3, figure 4).(圖三) (圖四)5.5.4再以空氣槍將PCB上貫穿孔
13、(Through hole)位置可能殘留之錫膏紅膠吹出(圖五) 。Will use the air gun will pass through PCB (Through hole) on the perforation to remain the tin cosmetics rubber to blow out (Figure five).5.5.5將PCB翻面清洗，重覆步驟圖二至圖四將PCB開孔皆清洗乾淨。The PCB turn surface cleaning, repeat steps figure 2 to figure 4, will open holes are clean PC
14、B.5.5.6清洗後，再以擦拭紙擦拭PCB表面及使用空氣槍清潔一次。然後用10倍的放大鏡檢查Fine Pitch元件，via hole，金手指。并貼上红色圆形標簽(貼標簽位置为板边位置，没有板边选取v-cut或roating位置) After the clean, uses the wipe paper to clean the PCB surface and using air gun clean again. Then using the 10 times of magnifying glasses inspect Fine Pitch components, via hole, gold finger. And labeled white triangle label, (Pastes the label position take not to affect printing
