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1、Monolithically integrated MEMS technologyIn the past 20 years, CMOS technology has become a major integrated circuit manufacturing technology, manufacturing costs decline at the same time, yield and production has also been greatly improved, COMS technology will continue to increase integration and
2、reduce development of a special size. Today, CMOS integrated process not only be used in the design of integrated circuits, but also to be used in many micro-sensors and micro-actuator, so it can be integrated circuits and micro-sensor integrated with a powerful, intelligent sensors. With micro-sens
3、or constantly expanding the scope of application of the sensor increasingly high demands of the future microsensor the main requirements are: miniaturization and integration of low-power and low-cost high-precision and long life; - and intelligent. Micromachined silicon integrated circuits and the i
4、ntegration of integration, to meet the above-mentioned requirements. At present, the majority of products integrated sensor using hybrid integrated, monolithic integration of a very small percentage. And the realization of single-chip integration is the key to achieving intelligent sensors, in parti
5、cular monolithic integrated MEMS sensor technology is todays system-on-chip can achieve one of the key technologies. Clearly, monolithic integration of the various technical difficulties analysis of MEMS and have already given the various monolithic integration of MEMS technology is essential.1. Mon
6、olithic integration of MEMS technology advantages and the challenges facing。MEMS and CMOS achieve working together, the separate manufacturing CMOS MEMS sensors and integrated circuits, and then cut from their chips, fixed in a common substrate, and, bonded connection, thereby bringing the two integ
7、ration, This is the so-called mixed (hybrid) method. This method does not produce MEMS manufacturing process for CMOS circuits pollution At the same time, both the production process Noninterference. However, due to signal bonding point and fuses, resulting in high-frequency applications, decline in
8、 the quality of signal transmission, and to develop two production lines to increase the cost of the product. In order to address some performance issues, and lower manufacturing costs, and proposed to do in the part of MEMS and CMOS circuits with a substrate, which is produced compatible with CMOS
9、technology or monolithic integrated MEMS technology called CMOS-MEMS technology. This method relative hybrid method generally have the following advantages: First, the performance can be greatly improved, because parasitic capacitance and crosstalk phenomenon can be significantly reduced; second, hy
10、brid method requires sophisticated technology to reduce packaging Sensor Interface affected, and monolithic integration requires packaging technology is relatively simple and therefore, lower cost sensors; third, monolithic integrated sensor array sensor technology is the need to overcome the array
11、sensor and external decoding circuit an effective interconnect bottleneck; Fourth, the development of monolithic integrated mixed development of MEMS products than MEMS products for a short time, and to develop low cost.Monolithic integration of MEMS technology under some of MEMS devices and CMOS ci
12、rcuit can be divided into different order processing before CMOS (pre-CMOS), mixed CMOS (intermediate-CMOS), and after the CMOS (post-CMOS) integrated approach.Post-CMOS approach is in the processing of silicon CMOS circuits End, through some additional MEMS micro-processing technology to achieve mo
13、nolithic integrated MEMS system, at present, monolithic integration of MEMS technology in this way mainly based. Post-CMOS approach is the main issue on MEMS processing temperature CMOS circuit performance in front of an impact on more serious is that the technology behind high-temperature MEMS proc
14、essing temperature and metal CMOS process ahead of incompatibility. In the present study as the most polysilicon layer structure of the MEMS example, the densification of phosphorus glass annealing temperature is 950 due to a structural polysilicon layer of stress annealing temperature reached 1050
15、, which will enable CMOS devices junction depth migration occurred. In particular 800 shallow junction devices junction depth migration will affect device performance. On the other hand, the conventional aluminum metallization process, when the temperature reaches 400-450 , the reliability of CMOS c
16、ircuits will be severely affected. From the above we can see that: how to overcome behind high-temperature MEMS processing temperature on the micro-structure of the front end processing has been the impact of CMOS circuits integrated MEMS single-chip solution is key to the system. At present, the international community is essential to resolve this issue through three ways: First is the interconnection of refractory metals instead of aluminum metal interconnect, for example, the
