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1、世界半导体生产机台安全设计验收标准 精品汇编资料GlobalSemiconductorSafetyServices,LLC SEMIS2-93AProductSafetyAssessmentFinalReport世界半导体生产机台安全设计验收标准AppliedMaterialsChemicalMechanicalPolishingSystemModel:MirraTrakCMP 工艺应用材料June19,1998Preparedfor:AppliedMaterials 3111CoronadoDrive SantaClara,CA95054Preparedby:GlobalSemiconduc
2、torSafetyServices,LLC1313GenevaDriveSunnyvale,CA94089GS3JobNo.980029GS3DocumentNo.980029F2Client-Confidential保密合约engineers.TheinformationwasalTheinformationusedtopreparethisreportwasbasedon interviewswithAppliedMaterials sobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.This
3、informationwasgatheredover theperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.Apreliminar yassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluat ionwerealsoused.Allobservationsandrecommendationsarebasedonc
4、onditionsanddescriptionsoftheChemicalMechanic alPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemi conductorSafetyServices.ThisreportssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemi calMechanicalPolishingSystem,Model:
5、MirraTrak,andtothecomprehensivenessofthetests,examinationsand/orsurveys made.ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices cemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices expresswrittenconsent.Theserviceperfor
6、medhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehigh levelofskillandcareexercisedbyGlobalSemiconductorSafetyServices staff.Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsand forthepurposeofdocumentati
7、ontoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationis providedbytheclient.TABLEOFCONTENTS目录SectionPageNo.Section2.0SCOPE（范围）Section3.0SYSTEMDESCRIPTION（系统描述）Section4.0ASSESSMENT&TESTINGMETHODOLOGIES（试验方法）Section5.0SAFETYASSESSMENT（安全评估）5.1 PURPOSE（目的）5.25 COPE（适用范围）5.35
8、 AFETYPHILOSOPHY（安全体系）5.36 ENERALGUIDELINES（指导方针）5.55 AFETY-RELATEDINTERLOCKS（安全互锁）5.56 HEMICALS（化学品）5.7IONIZINGRADIATION5.57 ON-IONIZINGRADIATION5.58 OISE（噪音）5.59 VENTILATIONANDEXHAUST（ 通风与排凤）5.60 ELECTRICAL5.12EMERGENCYSHUTDOWN（紧急停机）5.13HEATEDCHEMICALBATHS5.14HUMANFACTORSENGINEERING5.15ROBOTICAUTO
9、MATION5.16 HAZARDWARNING（危险警告）5.17 EARTHQUAKEPROTECTION（地震警告）5.18 DOCUMENTATION（ 文件）5.19 FIREPROTECTION（消防保护）5.20 ENVIRONMENTALGUIDELINES（环境方针）Section6.0RECOMMENDATIONS Section7.0-ILLUSTRATIONS ILLUSTRATION1-MirraTrakSystemLayoutATTACHMENTONE-SURFACELEAKAGECURRENTTEST（泄漏测试）ATTACHMENTTWO-GROUNDINGRES
10、ISTANCETEST（ 接地电阻测试）ATTACHMENTTHREE-VERIFICATIONOFEMO（紧急按钮确认）ATTACHMENTFOUR-SOUNDPRESSURELEVELSURVEY（声压测试）ATTACHMENTFIVE-ERGONOMICCHECKLIST（人体功力检查表）ATTACHMENTSIX-MANUALHANDLINGLIFTANALYSIS（手动操作分析）ATTACHMENTSEVEN- 摘 HAT- IF? ” HAZARDANALYSIS（危险分析）ATTACHMENTEIGHT-SEMIS10-1296RISKASSESSMENTGUIDELINEMET
11、HODOLOGYCONCLUSIONSectionl.OMANAGEMENTSUMMARYAfollow- upsafetyassessmentoftheAppliedMaterials ChemicalMechanicalPolishingSystem,Model:MirraTrak(hereafterreferredtoastheMirraTrak),wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthes ystemwasperformedonJune3,1998.Apreliminar
12、yevaluationofthesystemwasalsoperformedonSeptember25,1996throug hSeptember26,1996,andtheresultsofthisevaluationwerealsoutilizedinthisreport.Notethatthisreportcoversonlytheconce rnsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra, whichtogetherformt
13、heMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindiv idualSEMIS2-93Areportsfortheseunits.(GS 3ReportNo.970668TF,datedJanuary30,1998fortheFABSsystem;GS 3Repor tNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS 3ReportNo.980094F,fortheOnTrakSynergyIntegra .
14、)ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipmentandMaterialsInternationalSafet yGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines).GS3hasusedtheSEMIS10-1296GuidelineMethodologytoperformaRiskAssessmentofanyIssuesremainingaftertherevie woftheinformation
15、providedbyAppliedMaterials.NotethattheseveritywasrankedbyGS 3;theLikelihood(expectedrateofo ccurrence)wasprovidedbyAppliedMaterials.Itemswhichwererankedonlyasa摄ow” or措light “ riskassessmentcategorymaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10 -1296Guidelines.During
16、thesafetyassessmentofMirraTrak,GS 3identifiedseveralpositiveengineeringdesigns,aswellasseveralissuesthatwi llneedtobeaddressedinordertoachievefullcompliancewithSEMIS2-93AGuidelines.Thisdescriptionofbothpositiveengi neeringdesignandnon-conformanceissuesarecomprehensivelydescribedinSection5.0ofthisreport.ReferenceSection6.0 forasummaryoftheoutstandingitems.S
