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1、 欢迎阅读本文档，希望本文档能对您有所帮助! 感谢阅读本文档，希望本文档能对您有所帮助!IPC标准中英名称对照IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册 IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求 IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 IPC-6010 Series IPC-6010 Qualification and P
2、erformance Series IPC-6010印制电路板质量标准和性能规范系列手册 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） IPC-6016 Qualification & Performance Specification for Hig
3、h Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1) IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-6015 Qualification & Perfor
4、mance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 IPC-A-600F Acceptability of Printed Boards 印制板验收条件 IPC-QE-605APrinted Board Quality Evaluation Handbook 印制板质量评价 IPC-QE-605A-KIT Hard Copy and CD 印制板质量评价书和光盘(CD) IPC-HM-860 Specificati
5、on for Multilayer Hybrid Circuits 多层混合电路规范 IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鉴定与性能 IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范 IPC-TR-481 Results of
6、Multilayer Tests Program Round Robin 多层印制板联合试验计划结果 IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价 IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验 IPC-4552
7、 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范 IPC-DR-572 Drilling Guidelines for Printed Boards 印制板钻孔导则 IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias 印制板通孔机加工方案的改进和优选手册 IPC-NC-349 Computer Numerical Control Form
8、atting for Drillers and Routers 钻床和铣床用计算机数字控制格式 IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines 施加阻焊前及施加后清洗导则 IPC-HDI-1 High Density Interconnect Microvia Technology Compendium 高密度(HDI)互连微通孔技术纲要 IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials
9、高密度互连(HDI)及微导通孔材料规范 IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例 IPC-DD-1
10、35 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验 IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1 高密度印制板微通孔评价指标手册, 第一期第一版 IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2 高密度印制板微通孔评
11、价指标手册, 第一期第二版 IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3 高密度印制板微通孔评价指标手册, 第一期第三版 IT-98123 Microvia Manufacturing Technology Cost Analysis Report 微通孔制作技术成本核算报告 IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design 控制阻抗电路板与高速逻辑设计 IPC-2252 Design Guide for RF/Micro
12、wave Circuit Boards 射频/微波电路板设计指南 IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范 IPC-6018A Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试 IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques 采用高速技术电子封装设计导则
13、 IPC-M-102 Flexible Circuits Compendium 挠性电路纲要 IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry 挠性印制线路用挠性绝缘基底材料 IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜 IPC-4204 Fle
14、xible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 挠性金属箔去电应用于柔性电路组装 IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 挠性印制板的鉴定与性能规范（包括修改单1） IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA单双面挠性印制板性能手册 IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits 单面和双面挠性电路组装导则 IPC-FC-234 Composite Metallic Materials Specification for
