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1、*A*Abietic Acid松脂酸.Abrasion Resistance 耐磨性.Abrasives 磨料,刷材.ABS树脂.Absorption 吸收(入).Ac Impedance 交流阻抗.Accelerated Test(Aging)加速老化(试验).Acceleration速化反应.Accelerator 加速剂，速化剂.Acceptability,Acceptance 允收性，允收.Access Hole 露出孔，穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic
2、压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光.Activation 活化.Activator 活化齐1J .Active Carbon 活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent 添加剂.Additive Process 力口成法.Adhesion附着力.Adhesion Promotor 附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂，气熔胶，气悬体.Aging老化.Air Inclusion
3、气泡夹杂.Air Knife 风刀.Algorithm 算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN) 氮化铝.Ambient Tamp环境温度.Amorphous无定形，非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal 模拟电路 / 模拟讯号.Anchoring Spurs 着力爪.Angle of Contack 接触角.Angle of Attack 攻角.Anion阴离子.Anisotropic 异向性，单向的.Anneal韧化(退火).Annular Ring 孔环.Anode阳极.Anode
4、 Sludge 阳极泥.Anodizing 阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡齐U .Anti-pit Agent抗凹齐1J .AOI自动光学检验.Apertures 开口，钢版开口 .AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准Aramid Fiber 聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork 底片.ASIC特定用途绩体电路器.Aspect Ratio 纵横比.Assembly组装装配.A-stage A 阶段.ATE自动电测设备.Attenuation讯号衰减.Auto
5、clave 压力锅.Axial-lead 轴心引脚.Azeotrope共沸混合液.*B*Back Light (Back Lighting) 背光法.Back Taper反锥斜角.Backpanels, Backplanes 支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability 弯曲性.Banking Agent 护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁，滚镀.Base Material 基材.Basic Grid基本方格.Batch 批.Bau
6、me波美度(凡液体比重比水重则Be=145-(145 + Sp.Gr)凡液体比重比水轻则Be=140 -(Sp.Gr-130)*Sp.Gr为比重即同体绩物质对 纯水1g/cm的 比值).Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter 贝他射线反弹散射.Bevelling 切斜边.Bias斜张纲布，斜纤法.Bi-Level Stencil双阶式钢板.Binder粘结剂.Bits 头(Drill Bits).Black Oxide黑氧化层.Blanking 冲空断开.Bleac
7、k 漂洗.Bleeding 溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram 电路系统块图.Blockout 封纲.Blotting 干印.Blotting Paper 吸水纸.Blow Hole 吹孔.Blue Plaque 蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈).Bomb Sight 弹标.Bond Strength 结合强度.Bondability 结合性.Bonding Layer 结合层接着层 .Bonding Sheet(Layer) 接合片.Bonding Wire 结合线.Bow, Bowing
8、 板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条).在425 C870 c下进行熔接的方式).Break Point 显像点.Break-away Panel可断开板.Breakdown Voltage 崩溃电压.Break-out 破出.Bridging 搭桥.Bright Dip 光泽浸渍处理.Brightener 光泽剂.Brown Oxide 棕氧化.Brush Plating 刷镀.B-stageB 阶段.Build Up Process增层法制程.Build-up 堆积.Bulge鼓起.Bump突块.Bumping Process 凸块制程.Buoyancy 浮力.
9、Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning 烧焦.*C*Burr毛头.Bus Bar汇电杆.Butter Coat外表树脂层C4 Chip JointC4芯片焊接.Cable电缆.CAD十算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination 帽式压合法.Capacitance 电容.Capacitive Coupling 电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp 碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card
10、Cages/Card Racks电路板构装箱.Carlson Pin 卡氏定位稍.Carrier 载体.Cartridge 滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate 催化板 材.Catalyzing催化.Cathode 阴极.Cation阴向离子，阳离子.Caul Plate 隔板.Cavitation 空泡化 半真空.Center-to-Center Spacing中心间距.Ceramics 陶瓷.Cermet陶金粉.Certificate 证明书.CFC氟氢碳化物.Chamfer 倒角.Characteristi
11、c Impedance 特性阻抗.Chase纲框.Check List检查?t单.Chelate 螯合.Chemical Milling化学研磨.Chemical Resistance 抗化性.Chemisorption 化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board 芯片粘着板.Chip On Glass 晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent 含氯溶剂，氯化溶剂Circumferential Separation 环状断孔.Clad心ladding披覆.Clean Room 无尘室.Cl
12、eanliness 清洁度.Clearance余地，余环.Clinched Lead Terminal 紧箝式引脚.Clinched-wireThroughConnection 通孔弯线连接法.Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing 共绕.Cold Flow 冷流.Cold Solder Joint 冷焊点.Collimated Light平行光.Colloid 胶体.Columnar Structure 柱状组织.Comb Pat
13、tern 梳型电路.Complex Ion 错离子.Component Hole 零件孔.Component Orientation零件方向.Component Side 组件面.Composites,(CEM-1,CEM-3)复合板材.Condensation Soldering 凝热焊接，液化放热焊 接.Conditioning整孔.Conductance 导电.Conductive Salt 导电盐.Conductivity 导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity 吻合性，服贴性.Connector 连接器.Co
14、ntact Angle 接触角.Contact Area 接触区.Contact Resistance 接触电阻.Continuity 连通性.Contract Service 协力厂,分包厂.Controlled Depth Drilling定深钻孔.Conversion Coating 转化皮膜.Coplanarity 共面性.Copolymer 共聚物.Copper Foil 铜皮.Copper Mirror Test 铜镜试验.Copper Paste 铜膏.Copper-Invar-Copper (CIC)综合夹心板.Core Material 内层板材，核材.Corner Crack通孔断角.Corner Mark板角标记.Counterboring方型扩孔.Countersinking锥型扩孔.Coupling Agent偶合剂.Coupon, Test Coupon 板边试样 .Coverlay/Covercoat 表护层.Crack裂痕.Crazing 白斑.Crease 皱折.Creep潜变.Crossection Area 截面积.Crosshatch Testing 十字割痕试验.Crosshatching十字交叉区.Crosslinking, Crosslinkage
