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1、微电子学与固体电子学专业英语词汇Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom受主原子Accumulation 积累、堆积Accumulating contact积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源（放大）区Admittance 导纳All
2、owed band 允带Alloy-junction device合金结器件Aluminum (Aluminium ) 铝Aluminum - oxide铝氧化物Aluminum passivation 铝钝化Ambipolar双极的Ambient temperature 环境温度Amorphous无定形的，非晶体的Amplifier功放扩音器放大器Analogue (Analog) comparator 模拟比较器Angstrom 埃Anneal退火Anisotropic各向异性的Anode阳极Arsenic (AS)神Auger俄歇Auger process 俄歇过程Avalanche 雪
3、崩Avalanche breakdown 雪崩击穿Avalanche excitation 雪崩激发Background carrier本底载流子Background doping本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond球形键合Band能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width势垒宽度Base基极Base contact 基区接触Base stretching基区扩展效应Base transit time基区渡越时间Base trans
4、port efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor二元化合物半导体Bipolar双极性的Bipolar Junction Transistor ( BJT)双极晶体管Bloch布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered体心立方Body-centred cubic structure体立心结构Boltzma
5、nn 波尔兹曼Bond键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路自举射极跟随器Bootstrapped emitter followerBoron 硼Borosilicate glass 硼硅玻璃Boundary condition边界条件Bound electron束缚电子Breadboard模拟板、实验板Break down 击穿Break over 转折Brillouin布里渊Brillouin zone 布里渊区Built-in内建的Build-in electric field 内建电场Bulk体/体内B
6、ulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region隐埋扩散区Can外壳Capacitance 电容Capture cross section 俘获截面Capture carrier俘获载流子Carrier载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit进位输出Cascade 级联Case管壳Cathode 阴极Center中心Ceramic陶瓷（的）Ch
7、annel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening沟道缩短Channel width 沟道宽度Characteristic impedance特征阻抗Charge电荷、充电Charge-compensation effects电荷补偿效应Charge conservation 电荷守恒Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动 / 交换 / 共享
8、/转移 /存储Chemmical etching化学腐蚀法Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP)化学机械抛光Chip芯片Chip yield芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure密堆积结构Close-loop gain 闭环增益Collector集电极Collision 碰撞Compensat
9、ed OP-AMP 补偿运放Common-base/collector/emitter connection 共基极 /集电极 /发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain共模增益Common-mode input共模输入(CMRR)共模抑制比Common-mode rejection ratioCompatibility 兼容性Compensation 补偿Compensated impurities补偿杂质Compensated semiconductor补偿半导体Complementary Darli
10、ngton circuit互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function余误差函数Computer-aided design (CAD) /test (CAT) /manufacture(CAM) 计算机辅助设计/测试/制造Compound Semiconductor化合物半导体Conductance 电导Conduction band (edge) 导带(底)Conduction level/stat
11、e 导带态Conductor 导体Conductivity 电导率Configuration 组态Conlomb 库仑Conpled Configuration Devices 结构组态Constants物理常数Constant energy surface 等能面Constant-source diffusion 恒定源扩散Contact 接触 Contamination 治污Continuity equation 连续性方程 Contact hole 接触孔Contact potential 接触电势 Continuity condition连续性条件Contra doping 反掺杂 C
12、ontrolled 受控的Converter转换器 Conveyer 传输器Copper interconnection system铜互连系统Couping 耦合Covalent 共阶的 Crossover 跨交Critical 临界的 Crossunder 穿交Crucible 土甘期 Crystal defect/face/orientation/lattice晶体缺陷 /晶面/晶向/晶格Current density电流密度 Curvature 曲率Cut off 截止 Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense电流取样 Cu
13、rvature 弯曲Custom integrated circuit定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique切克劳斯基技术（Cz法直拉晶体J）Dangling bonds 悬挂键 Dark current 暗电流Dead time 空载时间 Debye length 德拜长度De.broglie 德布洛意 Decderate 减速Decibel (dB) 分贝 Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity le
14、vel深度杂质能级 Deep trap 深陷阱Defeat缺陷Degenerate semiconductor简并半导体 Degeneracy 简并度Degradation 退化 Degree Celsius (centigrade ) /Kelvin 摄氏/开氏温度Delay延迟 Density 密度Density of states 态密度 Depletion 耗尽Depletion approximation耗尽近似 Depletion contact 耗尽接触Depletion depth耗尽深度 Depletion effect耗尽效应Depletion layer 耗尽层 Depl
15、etion MOS 耗尽 MOSDepletion region 耗尽区 Deposited film淀积薄膜Deposition process 淀积工艺 Design rules 设计规贝 UDie芯片（复数 dice） Diode二极管Dielectric 介电的 Dielectric isolation介质隔离Difference-mode input差模输入 Differential amplifier差分放大器Differential capacitance微分电容 Diffused junction 扩散结Diffusion 扩散 Diffusion coefficient扩散系数Diffusion constant扩散常数 Diffusivity 扩散率Diffusion ca
