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1、电子行业专业词汇术语GRR Gauge Repeatability Reproducibility 量测的再现性与再生性 FPI First Piece In spectio n首件检查Sampling without replacement 不放回扌由样SQA: Source(Supplier) Quality Audit供货商品质审核1. QC : quality con trol质量管理2. IQC : in comi ng quality con trol 进料质量管理3. OQC : output quality con trol出货质量管理4. PQC : process qual
2、ity control 制程质量管理也称IPQC : in process quality con trol .5. AQL : acceptable quality level允收标准6. CQA: customer quality assura nee客户品质保证7. MA : major defeat主要缺点8. MI : minor defeat次要缺点9. CR :critical defeat关键缺点10. SMT : surface mounting technology 表面粘贴技术11. SMD :surface mou nting device 表面粘贴程序SMC : su
3、rface mounting component 表面粘贴组件12. ECN : en gi neeri ng cha nge notice工程变更通知13. DCN : desig n cha nge notice设计变更通知14. PCB :printed circuit board 印刷电路板15. PCBA : printed circuit board assembly 装配印刷电路板16. BOM : bill of material材料清单17. BIOS : basically in put and output system 基本输入输出系统18. MIL-STD-105E
4、:美国陆军标准，也称单次抽样计划.19. ISO : in ternatio nal sta ndard orga ni zatio n 国际标准化组织23. No n-wetti ng :空焊20. DRAM:内存条 21. Polarity :电性 22. Icicles :锡尖24. Short circuit :短路27 . Excess comp onent :多件29 . Excessive solder :锡多31. Solder ball :锡球33 . Sideward :侧立35. Gold fin ger:金手指25. Missing component : 缺件 26.
5、 Wrong component :错件28. I nsufficie nt solder :锡少30. Solder residue:锡渣32. Tombst one :墓碑 34. Comp onent damage :零件破损36. SOP : standard operation process 标准操作流程37. SIP : sta ndard in spection process 标准检验流程38 .The good and not good segregation :良品和不良品区分39. OBW : on board writer 熸录 BIOS41. Histogram :
6、直方图45 . Sub-contractors :分包商40 . Simple ran dom sampli ng :简单随机抽样42 . Standard deviation :标准差43. CIP : Con ti nu ous improveme nt program持续改善计戈 U44. SPC : Statistical process control 制程统制46. SQE: Supplier quality engin eeri ng48. Loader :治具50. Debug :调试52. Inven tory report for :库存表47. Sampling samp
7、le :抽样计划49. QTS: Quality tracki ng system 质量追查系统51. Spare parts:备用品53. Manpower/Tact estimation 工时预算54. Calibration :校验56. Corrugated pad :波纹垫58. Outer box :外包装箱60. Sum of square :平方和62. Conductive bag :保护袋64. Base unit :基体66. Probe :探针68. Golden card :样本卡70. Frame :屏面72 .Wrist wrap :静电手环74. Related
8、 departme nt :相关部门76.plug hole 孔塞ponent damage or broken 零件破损8O.flux residue 松香未拭82. mixed parts 机种混装84. oxidize零件氧化86. IC reverse IC 反向88. Forman 组长90. B.P.非擦除状态92. QP :Quality policy 质量政策94. Trend:推移图96. UCL: Upper con trol limit 管制上限98. CL: Center line 中心线100. PPM: Parts per millio n 不良率102.Resis
9、tor:电阻104. Resistor array :排阻106. DIODE:二极管108. Crystal:震荡器110.Bead:电感 inductanee112.ADM: Admi nistratio n Departme nt 行政单位114. CSD :Customer Service Department 客户服务部116 .IE: In dustrialEngin eeri ng 工业工程118. ME: Mechanical Engineering 机构工程119. MIS :Ma nageme nt In formation System 信息部121. PCC: Proj
10、ect Coordination/Control 专案协调控制55. S/N :serial number 序号57.Takeout tray:内包装盒59. Vericode :检验码61. Range :全距63. Preve ntive maintenance :预防性维护65. Fixture :制具67. Host probe :主探针69. Diagnostics program : 诊断程序71. L in t-free gloves :静电手套73. Target value :目标值75. lifted solder 浮焊77. Wrong direction 极性反79.U
11、nmelted solder 熔锡不良81.wrong label or upside down label 贝占反83. poor solder mask 绿漆不良85.stand off height 浮高87.supervisor 课长89. Wl=work in structio n 作业指导91. I nternal notificatio n:内部联络单93. QT: Quality target 品质目标95.Paret柏拉图97.L CL:Lower con trol limit管制下限99.R.T. Rolled throughout yield 直通率 101.DPU: D
12、efects per unit 单位不良率 103.Capacitor:电容105. Capacitor array:排容107.SOT:三极管109.Fuse保险丝111.Co nn ector:联结器113. CE: Component Engineering 零件工程 115. ID: In dustrial Desig n 工业设计117. IR: In dustrial Relatio nship 工业关系120. MM: Material Management 资材123. PE: Product Engineering 产品工程122. PD: Production Depart
13、ment 生产部124. PM: Product Manager 产品经理 125. PMC: Production Material Control 生产物料管理126. PSC: Project Support & Control 产品协调127. Magnesium Alloy:镁合金128. Metal Shearing:裁剪129. CEM:Co ntract Electro nics Manu facturi ng电子制造服务企业EMS: Electr onics Manu facturi ng Services130. ERP: Enterprise Resource Plann
14、ing 企业资源规划SCM+CRM+ERP+EAI=Network direct TM links procurement, production. Logistics and sales采购，生产，后勤管理及市场营销的融合EAI: En terprise applicati on In tegration企业应用系统整合CRM: Customer Relatio nship Pla nning 客户服务规划SCM : Supply chain management 供应链管理132.Access Time:光盘搜寻时间企业对消费者的电子商务企业间的电子商务135. Intranet:企业内部
15、通讯网路131. OJT: On job trai ning 在职培训133. B2CEC:Bus in ess to con sumer electr onic commerceB2BEC:Busi ness to bus in ess electro nic Commerce134. CCL:Copper Clad Lami nate 铜箔基板136. ISP: In ternet Service Provider 网络服务提供者ICP: In ternet Co nte nt Provider 网络内容提供者137. GSM: Global System for Mobile Com mun icatio n泛欧数字式行动电话系统GPS:全球卫星定位系统138. Home Page:网络首页139.Video Clip:影像文件140. HTML:超文标记语言141.Domainname:网域名称142. IP:网络网域通讯协议地址143.Notebook:笔记型计算机144. VR: Virtual Reality 虚
