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1、印制电路中英对照 一、会宗合商辛窠1、印M路：printed circuit2、印裂路：printed wiring3、印裂板：printed board4、印裂板M路：printed circuit board (pcb)5、E印裂路板：printed wiring board(pwb)6、印元件：printed component7、印裂接黑占：printed contact8、印裂板装配：printed board assembly9、板：board10、 罩面印裂板：single-sided printed board(ssb)11、 嬖面印裂板：double-sided printe
2、d board(dsb)12、多屑印裂板：mulitlayer printed board(mlb)13、多屑印裂M路板：mulitlayer printed circuit board14、多屑印裂路板：mulitlayer prited wiring board15、剧性印裂板：rigid printed board16、剧性罩面印裂板：rigid single-sided printed borad 17、剧性嬖面印裂板：rigid double-sided printed borad18、剧性多屑印裂板：rigid multilayer printed board19、搦性多屑印裂板：
3、flexible multilayer printed board20、搦性印裂板：flexible printed board21、搦性罩面印裂板：flexible single-sided printed board22、搦性嬖面印裂板：flexible double-sided printed board23、搦性印裂雷路：flexible printed circuit (fpc)24、搦性印裂路：flexible printed wiring25、网，性印裂板：flex-rigid printed board, rigid-flex printed board26、剧性嬖面印裂板：f
4、lex-rigid double-sided printed board, rigid-flex double-sided printed27、剧性多屑印裂板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、膂平印裂板：flush printed board29、金屠芯印裂板：metal core printed board30、金屠基印裂板：metal base printed board31、多重怖印裂板：mulit-wiring printed board32、陶瓷印裂板： cerami
5、c substrate printed board33、辱雷月蓼印制板：electroconductive paste printed board34、模塑雷路板：molded circuit board35、模厘印裂板：stamped printed wiring board36、J嗔序屑厘多屑印裂板：sequentially-laminated mulitlayer37、散印裂板：discrete wiring board38、微%泉印裂板： micro wire board39、稹屑印裂板：buile-up printed board40、稹屑多屑印裂板：build-up mulitla
6、yer printed board (bum)41、稹屑搦印裂板：build-up flexible printed board42、表面屑合雷路板：surface laminar circuit (slc)43、埋入凸墟速印裂板：b2it printed board44、多屑膜基板：multi-layered film substrate(mfs)45、屑全内辱通多屑印裂板：alivh multilayer printed board46、戴晶片板：chip on board (cob)47、埋雷阻板：buried resistance board48、母板：mother board49、子
7、板：daughter board50、背板：backplane51、裸板：bare board 52、盘板夹心板：copper-invar-copper board53、勤憩搦性板：dynamic flex board54、静憩搦性板：static flex board55、可拼板：break-away planel56、M： cable57、搦性扁平M： flexible flat cable (ffc)58、薄膜厚司：membrane switch59、混合M路：hybrid circuit60、厚膜：thick film61、厚膜M路：thick film circuit62、薄膜：th
8、in film63、薄膜混合M路：thin film hybrid circuit64、互M： interconnection65、辱维 conductor trace line66、膂平辱： flush conductor67、傅输维 transmission line68、跨交：crossover69、板遑插豆瓦 edge-board contact70、增弓鱼板：stiffener 71、基底：substrate72、基板面：real estate73、辱面：conductor side74、元件面：component side75、焊接面：solder side76、E印甄 print
9、ing77、金罔格：grid78、13形：pattern79、辱雷3形：conductive pattern80、非辱雷3形：non-conductive pattern81、字元：legend82、榇言志：mark二、基材：1、基材：base material2、屑厘板：laminate3、覆金屠箔基材：metal-clad bade material4、覆飙箔屑厘板：copper-clad laminate (ccl)5、罩面覆飙箔屑厘板：single-sided copper-clad laminate6、嬖面覆飙箔屑厘板：double-sided copper-clad laminat
10、e7、褪合屑厘板：composite laminate8、薄屑厘板：thin laminate9、金屠芯覆飙箔屑厘板：metal core copper-clad laminate10、金屠基覆板：metal base copper-clad laminate11、搦性覆飙箔名倒名彖薄膜：flexible copper-clad dielectric film12、基醴材料：basis material13、予浸材料：prepreg14、粘各吉片：bonding sheet15、琪浸粘各吉片：preimpregnated bonding sheer16、璘氧玻璃基板：epoxy glass s
11、ubstrate17、力口成法用屑厘板：laminate for additive process18、予裂内屑覆箔板：mass lamination panel19、内屑芯板： core material20、催化板材：catalyzed board ,coated catalyzed laminate21、童月蓼催化屑厘板：adhesive-coated catalyzed laminate22、tM催屑厘板：adhesive-coated uncatalyzed laminate23、粘各吉屑：bonding layer24、粘各吉膜：film adhesive25、童月蓼粘膂幡倒彖薄膜
12、：adhesive coated dielectric film26、照支撑月蓼粘膂U膜：unsupported adhesive film27、覆盖屑：cover layer (cover lay)28、增弓鱼板材：stiffener material29、飙箔面：copper-clad surface30、去箔面：foil removal surface31、屑厘板面：unclad laminate surface32、基膜面：base film surface33、月蓼粘膂U面：adhesive faec34、原始光漂面：plate finish35、粗面：matt finish36、向
13、：length wise direction37、模向： cross wise direction38、剪切板：cut to size panel39、酚醛#氏覆飙箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、璘氧#氏覆飙箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、璘氧玻璃布基覆飙箔板：epoxide woven glass fabric copper-clad laminates 42、璘氧玻璃布#氏褪
14、合覆飙箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、璘氧玻璃布玻璃A1W合覆飙箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆飙箔板：ployester woven glass fabric copper-clad laminates45、聚酰斐胺玻璃布覆飙箔板：polyimide woven glass fabriccopper-clad laminates46、嬖焉来酰斐胺三嗪璘氧玻
15、璃布覆飙箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、璘氧合成g戡金隹布覆飙箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃g戡隹覆飙箔板：teflon/fiber glass copper-clad laminates49、超薄型屑厘板：ultra thin laminate50、陶瓷基覆飙箔板： ceramics base copper-clad laminates51、紫外阻搐型覆飙箔板：uv blocking copper-clad laminates三、基材的材料1、a K皆桓寸脂：a-stage resin2、b K皆桓寸脂：b-
