《Solder checking standard——焊接检查标准》由会员分享，可在线阅读，更多相关《Solder checking standard——焊接检查标准（20页珍藏版）》请在金锄头文库上搜索。
1、Solder checking standard 焊接检查标准 名称:Solder checking standard 焊接检查标准 文件编号 审查 核准 制定部门 适用部门CL:版本:1 Purpose/目的(1) For solder instruction standard/作为焊接作业遵循的标准(2) According as creating SOP/作为标准操作规程制定依据(3) For QC checking/作为QC 检查依据2 Reference Documents /参考文件IPC-A-610D3 Scope/范围This document is valid withinf
2、or PCBA Soldering /适用于 PCBA焊接检查.4 Description/内容NO序号item/项目Picture/图示( PASS)Picture/图示(NG) 1Minimum End Joint Width最小末端焊点宽度(PASS) (NG)End joint width is equal to or greater than lead width末端焊点宽度等于或大于引脚宽度.Minimum end joint width is less than 50% lead width(W)最小末端焊点宽度小于引脚宽度的50% 2Minimum Side Joint Len
3、gth最小侧面焊点长度(PASS) (NG)Evidence of wetted fillet along full length of lead引脚全长焊点润湿The minimum side joint length(D) is less than three lead widths( W) or (D) is less than 75%(L)最小焊点长度D 小于3 倍引脚宽度W 或75%引脚长度Width to height ratio does not exceed two to one(2:1) ratio 宽度对高度的比例不超过二比一(2:1).Complete wetting a
4、t land or end cap metallization焊盘和元器件可焊端表面完全润湿. Width to height ratio exceeds two to one(2:1) ratio; Incomplete wetting at land or end cap metallization; Less than 100% overlap of the componet termination and the land元件宽度与高度之比大于2:1；元件焊接端与焊盘未完全润湿；元件端头与焊盘重叠小于100%；3Toe overhang violates引脚超焊盘 (PASS) (NG
5、)Evidence of wetted fillet along full length of lead引脚全长焊点正常润湿 Toe overhang violates minimum electrical clearance元件脚趾部违反最小电气间隙（0.13mm)4Rectangular or square End长方体元件偏移 (片式元件侧面偏移) (PASS) (NG)No side overhang无侧面偏移Side overhang is greater than 25% component termination width or 25% land with, whichever
6、 is less.侧面偏移大于元件可焊端宽度的25%或焊盘宽度的25% 5Mounting Upside Down翻面 (PASS) (NG)Element of chip component with exposed deposited electrical element is mounted away from the board.有暴露存积电气材质的片式元件将材质面朝离印制板面贴装. Element of chip component with exposed deposited electrical element is mounded toward board片式元件的外露电极朝向
7、印刷板面安装 6End Overlap空焊 (PASS) (NG)Evidence of overlap contact between the component termination and the land is required元件可焊端与焊盘间的重叠部分清楚可见 Insufficient end overlap末端没有重叠(空焊) 7Tombstoning立碑 (PASS) (NG)Chip components flating on a terminal end片式元件末端平放在焊盘上. Chip components standing on a terminal end 片式元
8、件末端翘起(立碑). 8End Joint Width is less片式元件水平少锡(PASS) (NG)End joint width is equal to component termination width or width of land 末端焊点宽度等于元件可焊端宽度或焊盘宽度End joint width is less than 75% of component termination片式元件焊锡涵盖于焊垫及零件端点处之宽度,水平方向小于元件宽度的75%. 9Mininum Fillet Height片式元件垂直少锡(最小焊点高度)(PASS) (NG)Minimum fi
9、llet height is solder thickness plus 25% termination height or 0.5mm0.02 in最小焊点高度为焊锡厚度加可焊端高度的25%或0.5毫米0.02 英寸Minimum fillet height(F)is less than solder thickness (G) plus 25%(H),or solder thickness(G)plus 0.5mm,whichever is less最小焊缝高度(F)小于焊锡厚度(G)加可焊端高度(H)的25%或0.5mm 10End Overhand末端偏移(PASS) (NG)NO s
10、ide overhang无侧面偏移Termination overhangs land可焊端偏移超出焊盘 11End Joint Width(Chip Components)末端焊点宽度 (片式元件)(PASS) (NG)End joint width is equal to component termination width or width of land末端焊点 等于元件可焊端宽度或焊盘宽度End joint width is less than 50% component diameter ,or land width末端焊点 小于元件直径或焊盘宽度的50% 12Maxinum F
11、illet Height最大焊点高度 (PASS) (NG)Maximum fillet height is the solder thickness plus component termination height最大焊点高度为焊锡厚度加元件可焊高度Solder fillet extends onto the top of the component body最大焊接高度(E)可超出焊盘或爬伸到元件金属镀层端帽可焊端的顶部,但不可接触元件体. 13Minimum Fillet Height最小焊点高度(PASS) (NG)Minimum fillet height (F) is solde
12、r thickness(G) plus 25% termination height(H). or 0.5mm0.02 in最小焊点高度(F) 为焊锡厚度(G)加可焊端高度(H)的25%或0.5毫米0.02英寸Minimum fillet height(F) is less than solder thickness(G) plus 25%(H), or solder thickness(G) plus 0.5mm, whichever is less最小焊点高度(F)小于焊锡厚度(G)加可焊端高度(H)的25%或焊锡高度(G)加0.5毫米 14 Nonwetting焊点拒焊(无润湿焊点)SMD(贴片元件) (PASS) (NG)Solder has to wetted to the land or termination where solder is required需要焊接的引脚或焊盘已润湿Solder has not wetted to the land or termination where solder is required 需要焊接的引脚或焊盘不润湿 (75%以上) 15Excess Solder焊锡过量(PASS) (NG)No excess solder on the printed
