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1、 . 防静电环氧地坪施工Anti-static Epoxy Self-leveling system抗静电环氧自流平地面The proposal ：3mm Anti-static Epoxy Self-leveling system方案: 3mm抗静电环氧自流平地面Sikafloor 239EDF Antistatic epoxy self-leveling system抗静电环氧自流平系统Approx. 3 mm coating thickness涂装厚度约 3 mmSikafloor 239EDF is a seamless, self-smoothing, flooring system
2、 based on advancedsolvent-free epoxy system and selected graded fillers. The cured floor exhibitsexcellent electrostatically dissipative behavior.The smooth, impervious surface canbe easily maintained in a hygienic condition.Sikafloor 239EDF是一种无接缝、自流平环氧系统，它以一种先进的无溶剂环氧树脂为基料，并采用专门级配的填充料。该地面具有优异的防静电性能，
3、其表面形成光滑的无渗透的地面，易于保持卫生状态。Performance性能: Electrostatically dissipative (Resistance to ground 106RG109 Ohm) 防静电性能(106RG109欧姆) High level of aesthetics and easy to clean高度美观，易清洗Comfort and care舒适，安全Smooth and seamless光滑，无缝Structure Profile系统结构图:防静电面层Anti-static Top-coat导电层Conductive Layer找平层 Level ayer底
4、漆Primer混凝土ConcreteSystem Description系统介绍：Step步骤Product & Consumption产品和用量Application Method施工方法Surface Preparation:基层处理Cleaning, grinding and shot blasting清理，研磨和喷砂处理Primer:底漆Sikafloor 161+石英砂 0.3-0.4 kg/m2Trowel,roller刮板，滚筒Epoxy Leveling mortar环氧找平层Sikafloor 161 0.9 kg/ m2+适量石英砂 0.9kg/m2Trowel刮板Cond
5、uctive Copper Tape导电铜带Adhibit粘贴Conductive Layer导电层Sikafloor 220W0.1 kg/m2Roller滚筒Top-coat面层Sikafloor 239EDF1.8 kg/m2+SikaDur 505 0.6 kg/m2Trowel刮板Material Description材料说明:Sikafloor 161 is a 2 component epoxy resin based, solvent free primer. Sikafloor 161 是一种双组分环氧树脂基无溶剂型底油Sikafloor 220W is a two par
6、t water dispersed, epoxy resin with high electrostatic conductivity是一种双组分水性环氧树脂，具有较高的导电性能。Sikafloor239EDF is a two part, self-smoothing, coloured epoxy resin coating.Decorative and protective dissipative self-smoothing system for concrete orcement screeds with normal up to medium heavy wear.Sikafloo
7、r239EDF是双组份的彩色的环氧树脂，作为一种在混凝土表面和水泥地面导静电，装饰和保护的涂层 Sikadur 505Q is adried fine quartz aggregate, 0.1 -0.3 mm for filling self-leveling floors and as filler in Sikafloor 156/263/264 as leveling mortar or scrape layer.Sikadur 505Q是一种干燥细颗粒骨料，0.1 - 0.3 mm ，用于填充自流平地面与用作Sikafloor161/263/264自流平砂浆或刮磨层的腻子层。Thin
8、ner DS or Thinner C is a solvent for cleaning purpose.Thinner DS or Thinner C 是用于清洁的溶剂Application Method 施工工艺Inspection Substrate Quality 基面质量检查The concrete substrate must be sound and of sufficient compressive strength (minimum 25 N/mm2) with a minimum pull off strength of 1.5 N/mm2.混凝土基面必须密实和有足够的抗
9、压强度（最小25 N/mm2），最小抗拉强度为1.5 N/mm2。Substrate needs to be dry, moisture content 4%. Test method: Sika-Tramex meter or CM - measurement. A waterproofinglayer must be installed under the concrete base，or vapor going up will result in epoxy layer bubbling and delamination. 2 mm Sikafloor 81 EpoCem system
10、need to be applied as a moisture barrier.基层须干燥，含水率4%，测试方法：Sika-Tramex仪或CM测量法。混凝土基层下须设置防水层，否则存在水汽上升导致环氧层起泡、脱落风险。建议施工2mm Sikalfoor 81 EpoCem系统作为防潮层。The substrate must be clean and free of all contaminants such as dirt, oil, grease, coatings and surface treatments, etc.基面必须清洁、无任何污染物，如：灰尘、油、油脂、涂层和表面处理等。
11、Measure Application Conditions 施工条件测量Substrate Temperature: +10min. / +30 max.基面温度：最低+10/最高+30AmbientTemperature +10 min. / +30 max.环境温度：最低+10/最高+30Relative Air Humidity: 80% R.H. max.相对空气湿度：最高80%相对湿度Dew Point: The substrate and uncured floor must be at least 3 above dew point toreduce the risk of c
12、ondensation or blooming on the floor finish.露点：基面和未固化的地面温度必须至少高于露点3，以防水汽凝结形成斑点。Substrate Preparation基面处理re-clean the floor surface, degrease agent will be used where necessary.清洁地表，必要时使用清洁剂；Carry out surface preparation by using shot blasting machine (dust free self enclosed steel shot blasting unit
13、) and hand tools to remove surface laitance and to provide sound and textured surface.使用自动无尘喷砂设备和手动工具进行表面预处理，去除混凝土表面翻沫与松散结构，并提供涂装所需的必要的粗糙度；Remove all remaining dust and debris by dry brushing and vacuum cleaning.扫除残留的钢丸与灰尘，并真空吸尘；Repair all floor defects such as honey combs, scratches, working joints
14、 and so on by using SikaDurand Sikaflex range of materials. .使用SikaDur与Sikaflex等系列产品对地面缺陷如蜂窝麻面、划痕、施工缝等进行修补；Mixing of material材料混合:In general, all products must be mechanically mixed using an electrical power stirrerwith 300 400 rpm, prior to mixing stir part A mechanically. When all of part B hasbee
15、n added to part A, continuously mix for 2 minutes until a uniform mix has beenachieved. Depending on the product ad in the filler or C component and mix foranother 2 minutes until a uniform mix has been achieved.通常，在机械搅拌A组分之前，所有产品必须用电动搅拌器以300 400转速/分机械搅拌。把所有B组分加入A组分之后，持续混合2 分钟直到混合均匀。根据产品加入填料或C组分，继续搅拌两分钟直到混合均匀。To ensure thorough mixing, pour mater
