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1、微电子专业术语Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance 导纳Allowed ba
2、nd 允带Alloy junction device 合金结器件Aluminum(Aluminium) 铝Aluminum oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的，非晶体的Amplifier 功放、扩音器、放大器Analogue comparator 模拟比较器Analog comparator 模拟比较器Angstrom 埃Anneal退火Anisotropic 各向异性的Anode阳极Arsenic 砷AS 砷Auger 俄歇Auger process 俄歇过
3、程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation 雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit t
4、ime 基区渡越时间Base transport efficiency 基区输运系数Base width modulation 基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor(BJT) 双极晶体管BJT 双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body centered 体心立方Body ce
5、ntred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built in
6、 内建的Build in electric field 内建电场Bulk体/体内Bulk absorption 体吸收Bulkgeneration 体产生Bulk recombination 体复合Burn in老化Burn out烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Can 外壳Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry in bit 进位输入Carry out bit 进位输出Cascade
7、 级联Case 管壳Cathode 阴极Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge neutrality condition 电中性条件Charge drive 电
8、荷驱动Charge exchange 电荷交换Charge sharing 电荷共享Charge transfer 电荷转移Charge storage 电荷存储Chemmical etching 化学腐蚀法Chemically Polish 化学抛光Chemmically Mechanically Polish (CMP) 化学机械抛光CMP 化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率Clock generator 时钟发生器Clock flip fl
9、op 时钟触发器Close packed structure 密堆积结构Close loop gain 闭环增益Collector 集电极Collision 碰撞Compensated OP AMP 补偿运放Common base connection 共基极连接Common collector connection 共集电极连接Common emitter connection 共发射极连接Common gate connection 共栅连接Common drain connection 共漏连接Common source connection 共源连接Common mode gain 共
10、模增益Common mode input 共模输入Common mode rejection ratio(CMRR) 共模抑制比CMRR 共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路EffectComplementary Metal Oxide Semiconductor FieldTransistor(CMOS) 互补金属氧化物半导体场效应晶体管CMOS 互补金属氧化物
11、半导体场效应晶体管Complementary error function 余误差函数Computer aided design (CAD) 计算机辅助设计CAD 计算机辅助设计Computer aided test(CAT) 计算机辅助测试CAT 计算机辅助测试Computer aided manufacture(CAM) 计算机辅助制造CAM 计算机辅助制造Compound Semiconductor 化合物半导体ConductanceConduction bandConduction bandConduction levelConduction state电导导带edge 导带底导带态导
12、带态Conductor 导体Conductivity 电导率Configuration 组态Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面Constant source diffusion 恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂Contro
13、lled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible 坩埚Crystal defect 晶体缺陷Crystal face 晶面Crystal orientation 晶向Crystal lattice 晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift 电流漂移Current dirve 电流驱动Current sh
14、aring 电流共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB) 分贝dB 分贝Decode 译码Deep acceptor level深受主能级Deep d
15、onor level 深施主能级Deep impurity level深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius 摄氏温度Degree centigrade 摄氏温度Degree Kelvin 开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth耗尽深度Depletio
