《成型电镀操作指引》由会员分享，可在线阅读，更多相关《成型电镀操作指引（37页珍藏版）》请在金锄头文库上搜索。
1、文件名称TITLE: rn PlatiPatte ng Process WorkInstruction 成形电镀工序操作指引 文件状态DOC. S TATUS文件编号Doc.No.: MEI016版本-修订ISS. -REV.页号PAGE 1 OF 36QAI107-1/12-1 Kalex Multi-Layer Circuit Board (Zhongshan) Ltd.A Subsidiary of V iasystems Group Inc. 皆利士多层线路版(中山)有限公司 惠亚集团附属公司 1.0 Purpose 目的This instruction is to establish
2、 a standard working instruction for pattern plating process.本规范的目的是为成形电镀工序建立一个标准操作指引 . 2.0 Scope 范围This instruction is applicable to pattern plating 1# line (M140), 2# line(M212), 3# line (M105)，4# line (M916).本规范适用于成形电镀1拉(M140)、2拉(M212)、3拉(M105)及4拉 (M916).3.0 Applicable documents适用文件3.1 Manufacturi
3、ng instruction, LOT card 制作指示 MI 、LOT 卡.3.2 Process check list 流程检查表 .3.3 Pattern plating current indication线路电镀电流指示 .3.4 Process temporary change notice 流程运作暂改通知 .4.0 Responsible责任4.1 Prod dept is responsible for daily operation and keep the productionparameters and conditions normal, chemical repl
4、enish and replace.生产部负责执行日常操作及保持工作参数条件正常、 药品添加及更换4.2 ME is responsible for providing technical support in process improvement and trouble shooting 流程工程师负责对流程问题提供技术支援 .4.3 SE is responsible for maintaining production equipments. 维修工程师负责生产设备的维修服务及保养 .4.4 Chem. Lab is responsible for analyzing daily ma
5、terial and chemical.化验室负责日常物料分析及药水分析 .4.5 EIE is responsible for dealing with waste water 由废水部负责处理所排放出去的废水 .30-1 文件名称 TITLE: Pattern Plating Process Work Instruction 成形电镀工序操作指引 文件状态DOC. S TATUS文件编号 Doc.No.: MEI016 版本-修订ISS. -REV.页号PAGE 2 OF 36 QAI107-1/12-1 Kalex Multi-Layer Circuit Board (Zhongshan
6、) Ltd.A Subsidiary of V iasystems Group Inc. 皆利士多层线路版(中山)有限公司 惠亚集团附属公司 5.0 Pattern plating flow chart 图形电镀流程5.1 1# line production process 1#LINE 生产流程：Loadi ng/U nl oadi ng Degreas ing Double waterrinsing(Firstly water rinsing not open air blow) Micro-etching Water rinsing Pre-dipPlating Cu Water ri
7、nsing Pre-dip Plating Sn Double waterrinsing Loading/Unloading Stripping Sn Water rinsing Loading/Unloading上/ 下板除油双水洗 ( 第一道水洗不开打气 ) 微蚀水洗预浸 镀Cu水洗t预浸t镀Sn双水洗t上/下板t退镀t水洗t上/下 板.5.2 2# line production process2#LINE 生产流程：Loading/Unloading t Degreasing t Double water rinsing(Firstly waterrinsing not open ai
8、r blow) t Micro-etching t Water rinsing t Pre-diptPlating Cu t Water rinsing tPre-dip t Plating Sn t Double waterrinsing tLoading/Unloading t Stripping Sn t Water rinsingtLoading/Unloading上/下板t除油t双水洗(第一道水洗不开打气)t微蚀T水洗T预浸t镀Cur水洗t预浸t镀SnT双水洗t上/下板t退镀t水洗t上/下 板.5.3 3# line production process3#LINE 生产流程Load
9、ing/Unloading t Degreasing t Double water rinsing(Firstly waterrinsing not open air blow) t Micro-etching t Water rinsing t Pre-dip tPlating Cu t Water rinsing t Pre-dip t Plating Sn t Double water rinsingt Loading/Unloading tStripping Sn tWater rinsingtLoading/Unloading上/下板T除油T双水洗(第一道水洗不开打气)T微蚀T水洗T
10、预浸 t镀Cur水洗T预浸T 镀SnT双水洗T上/下板T退镀T水洗T上/ 下板.5.4 4# line production process4#LINE 生产流程：Loading/Unloading T Degreasing T Double water rinsing(Firstly waterrinsing not open air blow)T Micro-etching T Double waterrinsing TPre-dip TPlating Cu T Double water rinsingT Pre-dip TPlating Sn TDouble water rinsing宀
11、Loading/Unloading 宀Stripping Sn 宀Double waterrinsing Loadi ng/U nl oadi ng上/下板除油双水洗（第一道水洗不开打气）微蚀双水洗预 浸镀Cl双水洗预浸镀 Sn双水洗上/下板双退镀双水 洗上/下板.30-1 文件名称TITLE:Pattern Plating Process WorkInstruction 成形电镀工序操作指引 文件状态DOC. S TATUS文件编号Doc.No.: MEI016版本-修订ISS. -REV.页 号PAGE 3 OF 36QAI107-1/12-1 Kalex Multi-Layer Circ
12、uit Board （Zhongshan） Ltd.A Subsidiary of V iasystems Group Inc. 皆利士多层线路版（中山）有限公司 惠亚集团附属公司6.0 1# line operate indication and parameters control（Brighter Vendor:Rohm&Hass）1# LINE 操作指示与参数控制（光剂 Vendor:Rohm&Hass）6.1 Production makeup method 生产开缸方法：Tank 缸号 Volume 体积 Item 项目 Optimal value 控制适量值 Makeup met
13、hod 开缸方法 DegreaseTank 除油缸 800LH2SO4SE-250T5.00 V/V25%V/V35 CAdd 200L SE-250 into the tank with some water when makeup, restart the line after the temperature cool down to 35C . 开缸时按 SE-250:200L, 加到一定量的水中 , 待 温度冷却至35 C时方能开拉.NPS 缸 800LNPSH2SO4Cu2+ 50g/l 2%V/V 3g/lAdd 44kg NPS,16 L H 2SO, 10kg CuSO 4 5
14、H2O into tank which with some water and mix uniformity, if temperature is too high, cool down to room temperature by cooling pipe, leave 1/5 liquid to keep Cu2+ concentration whenreplace tank开缸时加入 44kg NPS,16 L H 2SO, 10kg CuSO 4 5H2O 于一定体积水中且将物料混和均匀 , 若温度过高 , 可用 冷水管将其冷却至室温 , 换缸时留 1/5 母液 , 以维持 Cu2+
15、浓度.H2SO 缸 800L AR H 2SO 10%V/VAdd 80 L AR. H 2SO4 slowly into tank which with some water and mix at the same time, if temperature is too high, cool down to room temperature by cooling pipe, then restart line. 开缸时缓慢加入 80 L AR. H 2SO4 于一 定体积水中边加酸 , 边搅拌 , 若温度过高 , 则用冷水管将 其冷却至室温后方可开拉 .Pre-dip预浸 800L AR H 2SO4 10%V/V开缸Add 80 L AR. H 2SO4 slowly into tank which with some water and mix, if temperature is too high, cool down to room temperature by cooling pipe, then restart line.时缓慢加入 80 L AR. .H 2SO4 于盛有一定体积的水的
