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1、 AXI AXI Image Verification Training Image Verification TrainingX-ray Image Interpretation OverviewX-ray Image Interpretation OverviewDuring this training course, you will learn to recognize various solder joint types.We will also describe the characteristics of each solder joint type.We will show y
2、ou how to understand X-ray images of solder joints.X-ray Image InterpretationX-ray Image InterpretationTwo-Leaded DevicesTwo-Leaded DevicesComponent BodyComponent BodyCapacitorResistorX-ray ImagesX-ray ImagesCapacitorsCapacitorsResistorsResistorsResistor Solder JointsResistor Solder JointsAcceptable
3、 resistor end filletsX-rayX-rayResistor - Insufficient SolderResistor - Insufficient SolderInsufficient solderAcceptable solder jointResistor - Open / Missing PartResistor - Open / Missing PartMissingResistor - OpenResistor - OpenOpen Resistor - TombstoneResistor - Misaligned PartResistor - Misalign
4、ed PartChip Capacitors - OpaqueChip Capacitors - OpaqueOpaque Capacitors Acceptable solder jointsX-ray X-ray ProfileProfileSide Side ViewViewCapacitor - OpenCapacitor - OpenNo solder connection is being made between the capacitor and the pad.Capacitor - InsufficientCapacitor - InsufficientChip Capac
5、itors - ClearChip Capacitors - ClearResistorResistorNote: solder joint has straight edge along partClear CapacitorClear CapacitorNote: solder joint roundedaround side of capacitorX-rayX-rayCapacitor - Damaged PartCapacitor - Damaged PartGood Joint - Clear capacitorOpaque cap that wascracked offCapac
6、itor - Damaged PartCapacitor - Damaged PartGood Joint - Clear capacitorOpaque cap that wascracked offCapacitor - Missing PartCapacitor - Missing PartMissing capacitorCapacitor - OpenCapacitor - OpenOpen capacitor - TombstonePolarized Capacitors (PCAP)Polarized Capacitors (PCAP)Tantalum SlugNotice: S
7、lug is closer to pin 2Pin 1Pin 2PCAP - Insufficient SolderPCAP - Insufficient SolderInsufficient solderLess than 50% of part is solderedPCAP PCAP Polarity PolarityComp: C1 (PCAP/C7343) Pin: 1 Comp: C1 (PCAP/C7343) Pin: 1 PolarityPolarityPart Pin 1 Indicator BoardPin 1 Indicator PCAP - OpenPCAP - Ope
8、nOpen solder joint Part is lifted to the right Gullwing Solder JointsGullwing Solder JointsThe defining characteristic of Gullwing joints is the heelThe defining characteristic of Gullwing joints is the heelThick heel = Acceptable jointHeel ToeX-rayX-rayGullwing - Gullwing - Lifted LeadLifted LeadLi
9、fted Lifted LeadLeadGullwingGullwingLifted LeadLifted LeadQuestionableQuestionable solder joints solder jointsOpenOpen solder joints solder jointsGullwing - MisalignmentGullwing - MisalignmentLeadLeadPadPadGullwing - Solder BridgeGullwing - Solder BridgeSolder BridgeGullwing - Insufficient SolderGul
10、lwing - Insufficient SolderRepairRepairInsufficient HeelInsufficient HeelGullwing - Insufficient SolderGullwing - Insufficient SolderRepairRepairGullwing - Insufficient SolderGullwing - Insufficient SolderUnusual Solder Joint TypesUnusual Solder Joint TypesOpenOpenResistor Network-Acceptable solder
11、jointsMissing resistor network all pins are openHeelUnusual Solder Joint TypesUnusual Solder Joint TypesInsufficientInsufficientConnector Solder JointsConnector Solder JointsNotice there is not a strong heel -the heel and toe are very similarNotice the shape of the lead -it does not allow for a larg
12、e heelComponent BodyComponent BodyLeadLeadConnector - Acceptable Solder JointsConnector - Acceptable Solder JointsVarying length Acceptable solder jointsNo defining heel, just side filletsAcceptable solder jointsConnector - Lifted LeadConnector - Lifted LeadLifted LeadsConnector - Solder BridgeConne
13、ctor - Solder BridgeSolder bridgeConnector - Missing partConnector - Missing partJlead Solder JointsJlead Solder JointsToe HeelToe HeelX-ray ProfileJLead - Insufficient SolderJLead - Insufficient SolderBall Grid Array (BGA)Ball Grid Array (BGA)Component BodyComponent BodyPadPadComponent DiameterComp
14、onent DiameterPad DiameterPad DiameterBall DiameterBall DiameterBGA BGA Solder Bridge Solder BridgeSolder BridgeBGA - Insufficient SolderBGA - Insufficient SolderInsufficient solderBGA BGA Foreign Material Foreign MaterialResistor under BGACapacitor under BGABGA - OpensBGA openBGA Opens (HIP)BGA - V
15、oidsBGA - VoidsNeeds RepairColumn Grid Array (CGA)Column Grid Array (CGA)Component BodyComponent BodyPadPadPad DiameterPad DiameterColumn DiameterColumn DiameterCGA CGA Bent Leads Bent LeadsBent Bent LeadsLeadsThrough Hole PartsThrough Hole PartsPin SlicePin SliceTop SliceTop SliceBarrel SliceBarrel
16、 SliceBottom SliceBottom SliceThrough Hole PartsThrough Hole PartsInsufficient BottomInsufficient BottomPINPINPADPADInsufficientInsufficientAcceptableAcceptableThrough Hole PartsThrough Hole PartsInsufficient BottomInsufficient BottomInsufficientInsufficientAcceptableAcceptableAcceptableAcceptablePressFitPressFit PressFit Missing PinMissing PinMissingPressFit Missing PinMissingHead and Pillow Analyser (BGA) Pad SliceAngle ImageStandard HIPPad area is visible in few Angle View imagesJoint shape o
