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1、无铅焊膏印刷模板开口设计推荐规范 宽厚比=开口的宽度(W)/模板的厚度(T)1。6 面积比=开口面积(LXW)/孔壁的面积2*（L+W)T0.711 一般印焊膏模板开口尺寸及厚度 元件类型PITCH焊盘宽度焊盘长度开口宽度开口长度模板厚度宽度比面积比PLCC1。27mm0。65mm2.0mm0。60mm1。95mm0.150.25mm2.3-3。80.881。48(50mil）(25。6mil)（78.7mil）(23。6mil）（76.8mil)（5.919.84mil)QFP0。635mm0。635mm0.635mm0。635mm0.635mm0。635mm1.7-2。00.71-2.0(
2、25mil)（13。8mil)（59.1mil）（11。8mil）(57.1mil）（5.917.5mil)QFP0。50mm0。2540.33mm1.25mm0.22-0。25mm1。2mm0。1250.15mm1.72.00。69-0.83（20mil）(10-13mil）(49。2mil）(910mil)(47。2mil）（4.92-5。91mil）QFP0.40mm0.25mm1。25mm0。2mm1。2mm0.10-0。125mm1.6-2.00。68-0。86(15。7mil)(9.84mil)（49。2mil）(7。87mil）（47.2mil）（3.944.92mil）QFP0
3、。30mm0。20mm1.00mm0.15mm0.95mm0.0750。125mm1.502.00.65-0。86(11.8mil)（7。87mil）(39。4mil）(5。91mil）（37.4mil)（2。953.94mil)04020.50mm0.65mm0.45mm0。6mm0.125-0.15mm0.841。00(19。7mil)(25。6mil）(17。7mil）（23。6mil）(4.925.91mil）02010.25mm0。40mm0。23mm0。35mm0。0750.125mm0.66-0。89（9。84mil）（15。7mil)(9。06mil）(13.8mil)（2。9
4、5-3.94mil）BGA1.27mm0。80mm0.75mm0.150.20mm0.931。25(50mil)（31.5mil)(29.5mil)(5。91-7。87mil）U BGA1。00mm0。38mm0.35mm0.35mm0.115-0。135mm0.67-0。78(39。4mil)（15。0mm）(13.8mil)（13。8mil）（4。53-5.31mil）U BGA0。50mm0.30mm0.28mm0。28mm0。075-0。125mm0.69-0.92(19。7mil）（11。8mm)(11.0mil)（11.0mil)（2。953。94mil)Flip Chip0.25
5、mm0.12mm0.12mm0.12mm0。12mm0.080。10mm1。0（10mil)(5mil）（5mil)（5mil）（5mil)（34mil)Flip Chip0.20mm0.10mm0。10mm0.10mm0。10mm0。05-0。10mm1。0(8mil)（4mil）(4mil）(4mil)(4mil）（2-4mil）FlipChip0.15mm0。08mm0.08mm0。08mm0。08mm0.025-0。08mm1。02 Chip件开口修改方案3 IC开口修改方案4制造方法：一般采用激光切割加电化学抛光（Laser + Electroplish ）工艺.如果开口宽厚比和面积比接近门限值，建议采用电铸(Electroform)工艺制造。
