摘 要 I论文题目：论文题目： 微合金化微合金化 CuNiSi 系合金时效及热变形行为研究系合金时效及热变形行为研究 专专 业：业： 材料学材料学 研研 究究 生：生： 李银华李银华 指导教师：指导教师： 刘刘 平平 教授教授 摘 要摘 要 CuNiSi 合金以其优良的综合性能，在大规模集成电路用引线框架中有着广泛的应用前景 本文针对 CuNiSi 合金材料，研究了时效温度、时效时间以及时效前冷变形对添加微量合金元素的 CuNiSi 合金的组织和性能的影响结果表明：冷变形和时效相结合能显著提高合金的综合性能如 CuNiSi 合金 450℃时效 0.5h 显微硬度和导电率分别为：172HV 和 28%IACS；而时效前经过 60%变形 450℃时效0.5h 显微硬度和导电率分别达到了 229HV 和 32%IACS添加微量元素 P、Ag对 CuNiSi 基合金性能的影响结果表明：微量 P 能有效提高 CuNiSi 合金的显微硬度，稍微提高合金的导电率；微量 Ag 能提高合金的硬度，但作用没有 P 明显，而且 Ag 能提高 CuNiSi 合金的导电率。
另外，对二级时效进行的研究表明 ， 二 级 时 效 可 以 明 显 提 高 合 金 的 综 合 性 能 如CuNiSi合 金40%+450+40%+420℃℃后的抗拉强度达到了 724MPa，导电率达到 50%IACS，抗软化温度达到 455℃，均满足该类材料的性能要求 利用透射电镜研究了 CuNiSi 系合金在不同条件下时效时的组织转变规律，研究发现：CuNiSi 系合金都有一个共同的析出相 Ni2Si 相；CuNiSiAg 合金中除Ni2Si 相外，没有发现其它的析出物；而在 CuNiSiP 合金中发现有 Ni3P 化合物形成 在 Gleeble-1500D 热模拟试验机上，采用高温等温压缩试验，得到了真应力-真应变曲线讨论了变形温度、变形速率对 CuNiSiP 和 CuNiSiAg 合金高温压缩变形的影响规律结果表明：应变速率和变形温度的变化对合金的再结晶影响较大，变形温度越高，合金越容易发生动态再结晶；应变速率越小，合金也越容易发生动态再结晶，所对应的峰值应力也越低，且变形温度和变形速率对合金显微组织影响较大；并且利用 Arrhenius 双曲正弦函数求得 CuNiSiP 合金和CuNiSiAg 合金的热变形激活能 Q 分别为 485.6kJ/mol 和 312.3kJ/mol，并建立了两种合金的流变应力方程和动态再结晶的晶粒尺寸模型。
摘要 II关关 键键 词：词：CuNiSi 合金，显微硬度，导电率，抗拉强度，热压缩，动态再结晶 论文类型：论文类型：应用基础研究 摘要 IIISubject: Study on aging and thermal deformation behavior of CuNiSi series alloys Specialty: Materialogy Name: Li Yinhua Supervisor: Liu Ping ABSTRACT With the high competitive performance and widely application prospect, CuNiSi alloys being excellent candidates for lead frame materials used in large-scale integrated circuit. In this paper, the effects of cold deformation, aging temperature, and aging time on the structure and properties of CuNiSi alloy with trace alloy elements were studied. The results showed that the integration performance can be improved by combination cold deformation and aging. For example, the microhardness and electrical conductivity of CuNiSi alloy were 172HV and 28%IACS respectively when it was aged at 500 for 0.5h. And the microhardness and electrical conductivity of CuNiSi ℃alloy achieved 229HV and 32%IACS respectively when it was aged at 500 for 0.5h℃ after deforming for 60%. Besides, the effects of microelement P, Ag on the properties of CuNiSi alloy were also researched. The results showed that P can enhance the microhardness of CuNiSi effectively, but the electrical conductivity increase slightly, and Ag can increase the microhardness of CuNiSi, but the effect of Ag doesn’t as clear as P, moreover Ag can improve the electrical conductivity of CuNiSi. Besides, two stages aging was researched, the research indicated two stages aging can enhance the integration performance of alloy obviously. For instance, The CuNiSi allloy’s tensile strength, electrical conductivity and soften temperature have respectively achieved 724MPa、50%IACS and 455 after 40%+450+40%+420.℃℃℃ The transformation of CuNiSi series alloys aged in different range time was investigated used transmission electron microscope (TEM). It can be found that there was a common phase precipitated Ni2Si in CuNiSi series alloys, and there wasn’t other phase besides Ni2Si in CuNiSiAg alloy, but it had Ni3P phase except Ni2Si phase for CuNiSiP alloy. The flow stress behavior of CuNiSiP and CuNiSiAg alloy during thermal compression deformation was studied by isothermal compression test at Gleeble-摘要 IV1500D thermal-mechanical simulator. The results showed that the dynamic recrystallization was controlled by strain rate and deforming temperature. The higher the temperature, the quicker dynamic recrystallization, and the less strain rate, the quicker dynamic recrystallization, too. The microstructure was strongly depended on the deformation temperature and deformation velocity. The thermal deformation activation energy of CuNiSiP and CuNiSiAg alloys (QCuNiSiP=485.6KJmol-1, QCuNiSiAg=312.3KJmol-1) was counted by Arrhenius hyperbolic sine function, flow stress equation and dynamic recrystallization grain size model of CuNiSiP and CuNiSiAg alloys were established. KEY WORDS: CuNiSi alloy, microhardness, electrical conductivity, tensile strength, thermal compression, dynamic recrystallization Dissertation Type: Application Fundamental Research 第 1 章 绪论 1第第1章章 绪论绪论 1.1 前言前言 铜是与人类关系非常密切的有色金属，被广泛的应用于电气、轻工、机械制造、建筑工业、国防工业等领域，在我国有色金属材料的消费中仅次于铝。
铜在电气、电子工业中应用最广，用量最大，占总消费量的一半以上，用于各种电缆和导线、电机和变压器的绕阻、开关以及印刷线路板等在机械和运输车辆制造中，用于制造工业阀门和配件、仪表、滑动轴承、模具、热交换器和泵等在化学工业中广泛应用于制造真空器、蒸馏锅、酿造锅等在国防工业中用以制造子弹、炮弹、枪炮零件等，每生产 100 万发子弹，需用铜 13~14 吨在建筑工业中，用做各种管道、管道配件、装饰器件等 铜合金的应用也非常广泛，它是历史上应用最早和最主要的合金之一在经济飞速发展的今天，铜合金以其优良的性能占据着重要的地位 近年来，随着电子工业的发展，特别是微电子工业的发展，人们对材料的要求也越来越高为了保护集成电路或混合电路的正常工作，需要对它进行封装，并在封装时，把电路中大量的接头从密封体内引出来这些引线要求有一定的强度，构成该集成封装电路的支承骨架，称为引线框架实际生产中，为了高速大批量生产，引线框架通常在一条金属带上按特定的排列方式连续冲压而成框架材料占集成电路总成本的 1/3~l/4，而且用量很大；因此，必须要有低的成本铜合金价格低廉，有高的。