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1、 RoHS 指令豁免清单由于在电子电气行业中，部分禁用的材料现在还没有找到适用的替代品，因此它们在一定范围内可以获得豁免。但 RoHS 同时规定，根据科技的发展，欧盟每 4 年会对豁免物质进行评估，视情况进行调整。2010 年 2 月 26 日，欧盟在官方公报上公布委员会决定 2010/122/EU，鉴于对 LED 中的镉进行替代，在技术上还不成熟，决定对其进行豁免。至此，RoHS 指令附录（即豁免清单 )条款，增加至第 39 条。(依据 2002/95/EC 及2005/717/EC、 2005/747/EC、 2006/310/EC、 2006/690/EC、 2006/691/EC、 2
2、006/692/EC、 2008/385/EC、 2009/443/EC、 2010/122/EU 8 次修改）豁免项 对应文件号签署/颁布日期1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.小型日光灯中的汞含量不得超过 5 毫克/灯。2a. Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10 mg.一般用途的直管日光灯中的汞含量不得超过盐磷酸盐 10 毫克。2b. Mercury
3、 in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg.一般用途的直管日光灯中的汞含量不得超过正常的三磷酸盐 5 毫克2c. Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg.一般用途的直管日光灯中的汞含量不得超过长效的三磷酸盐 8 毫克。3. Mercury in stra
4、ight f1uorescent lamps for special purposes 特殊用途的直管日光灯中的汞含量。4. Mercury in other lamps not specifically mentioned in this Annex. 本附录中未特别提及的其它照明灯中的汞含量。5. Lead in glass of cathode ray tubes, electronic components andfluorescent tubes. 阴极射线管、电子元件和发光管的玻璃内的铅含量.6a. Lead as an alloying element in steel cont
5、aining up to 0.35% lead by weight.铅作为钢的合金元素，其含量可达 0.35%（重量计） 。6b. Lead as an alloying element in aluminium containing up to 0.4% lead by weight.铅作为铝的合金元素，其含量可达 0.4%（重量计） 。6c. Lead as an alloying element in copper containing up to 4% lead by weight.铅作为铜的合金元素，其含量可达 4%（重量计） 。2002/95/EC2003.01.27/2003.0
6、2.137a. Lead in high melting temperature type solders (i.e.lead-based alloys containing 85 % by weight or more lead).高温融化型焊料中的铅（如：铅含量85%的铅基合金中的铅） 。2005/747/EC2005.10.21/2005.10.257b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signa
7、lling, transmission as well as network management for telecommunications用于服务器、存储和存储列阵系统以及电信用交换、发信、传输和网络管理的网络基础设施设备的焊料中的铅。7c.Lead in electronic ceramic parts (e.g. piezoelectronic devices).电子陶瓷部件中的铅（例如：高压电子装置） 。8. Cadmium and its compounds in electrical contacts and cadmium plating except for applica
8、tions banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.除了 76/769/EEC关于限制某些有害物质和物品销售和使用指令的修改文件 91/338/EEC 指令中禁止用途外，电触头和镉镀层上的镉及其化合物2005/747/EC2005.10.21/2005.10.259.Hexavalent chromium as
9、an anti-corrosion of the carbon steel cooling system in absorption refrigerators. 吸收式电冰箱中作为碳钢冷却系统防腐层的六价铬。2002/95/EC2003.01.27/2003.02.139a. DecaBDE in polymeric applications. 聚合物中使用的十溴二苯醚据欧洲法院判决该条于 2008.07.01删除，不被豁免。9b. Lead in lead-bronze bearing shells and bushes. 铅-铜轴承外壳与轴衬中的铅2005/717/EC2005.10.1
10、3/2005.10.1510. Within the procedure referred to in Article 7(2),the Commission shall evaluate the applications for: Deca BDE,mercury in straight fluorescent lamps for special purposes,lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, sig
11、nalling, transmission as well as network management for Telecommunications（with a view ot setting a specific time limit for exemption ）,andlight bulbs欧盟委员会应根据第 7（2）条中提及的程序，评价以下方面的应用：十溴二苯醚，特殊用途的直管日光灯中的汞，以下用途中所使用的焊料中的铅：服务器、存储器、用于交换和传输的网络基础设施、电信网络管理设备（旨在设定本指令豁免部分的特定截止时间） ，灯泡。2002/95/EC2003.01.27/2003.0
12、2.1311. Lead used in compliant pin connector systems.自适应插脚连接器系统中的铅12.Lead as a coating material for the thermal conduction module c-ring. 热导模组 C 环镀层中所用的铅。2005/747/EC13a. Lead in optical and filter glass.光学滤光玻璃中的铅。13b. Cadmium in optical and filter glass.光学滤光玻璃中的镉。14.Lead in solders consisting of mor
13、e than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight. 微处理器针脚及封装连接所使用的含两种以上组分且铅含量在 80%和 85%之间的焊料中的铅。15. Lead in solders to complete a viable electrical connection between semiconductor die and carri
14、er within integrated circuit Flip Chip packages. 集成电路倒装晶片封装的半导体连接片和托架之间实施电气连接所用焊料中的铅。2005.10.21/2005.10.252005/747/EC2005.10.21/2005.10.2516.Lead in linear incandescent lamps with silicate coated tubes. 管状白炽灯硅酸盐涂层灯管中的铅。17.Lead halide as radiant agent in High Intensity Discharge(HID) lamps used for p
15、rofessional reprography applications.专业复印设备用的高强度放电灯(HID)中作为发光剂的卤化铅。18.Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge amps when used as sun tanning lamps containing phosphors such as BSP(BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing repr
16、ography, lithography, insect traps,photochemical and curing processes containing phosphors such as SMS(Sr,Ba)2MgSi2O7:Pb)(2006/310/EC) 当放电灯被用作含磷的仿日晒灯(sun tanning lamps)，比如含有BSP(BaSi2O5:Pb)， 以及用于重氮复印、平版印刷、捕虫器、含磷光化学和含磷食物加工过程的专业灯时，比如 SMS(Sr,Ba)2MgSi2O7:Pb)，放电灯中的荧光粉触媒剂的铅含量在其重量的 1或以下。19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL). 紧凑型节能灯(ESL)中作为主要汞齐合金的特定成
