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1、 JOINT INDUSTRY STANDARD Moisture/Refl ow Sensitivity Classifi cation for Nonhermetic Surface Mount Devices IPC/JEDEC J-STD-020E December 2014 Supersedes IPC/JEDEC J-STD-020D.1 March 2008 Notice IPC and JEDEC Standards and Publications are designed to serve the public interest through eliminating mi
2、sunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respe
3、ct preclude any member or nonmember of IPC or JEDEC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC or JEDEC members, whether the standard is to b
4、e used either domestically or internationally. Recommended Standards and Publications are adopted by IPC or JEDEC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, IPC or JEDEC do not assume any liability to any patent owner, nor do th
5、ey assume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. The material in this joint standard was developed by the IPC Plastic Chip Carrier Crac
6、king Task Group (B-10a) and the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices Please use the Standard Improvement Form shown at the end of this document. Copyright 2014. JEDEC Solid State Technology Association, Arlington, Virginia, and IPC, Bannockburn, Illinois, USA. All
7、 rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.
8、 For Technical Information Contact: JEDEC IPC Solid State Technology Association 3000 Lakeside Drive, Suite 309S 3103 North 10th Street, Suite 240-S Bannockburn, Illinois Arlington, VA 22201-2107 60015-1249 Tel 703 907.0026 Tel 847 615.7100 Fax 703.907.7501 Fax 847.615.7105 . Supersedes: IPC/JEDEC J
9、-STD-020D.1 March 2008 IPC/JEDEC J-STD-020D August 2007 IPC/JEDEC J-STD-020C July 2004 IPC/JEDEC J-STD-020B July 2002 IPC/JEDEC J-STD-020A April 1999 J-STD-020 -October 1996 JEDEC JESD22-A112 IPC-SM-786A -January 1995 IPC-SM-786 -December 1990 IPC/JEDEC J-STD-020E Moisture/Reflow Sensitivity Classif
10、ication for Nonhermetic Surface Mount Devices A joint standard developed by the IPC Plastic Chip Carrier Cracking Task Group (B-10a) and the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices Users of this standard are encouraged to participate in the development of future revi
11、sions. Contact: JEDEC Solid State Technology Association 3103 North 10th Street, Suite 240S Arlington, VA 22201- 2107 Tel 703 907.0026 Fax 703 907.7501 IPC 3000 Lakeside Drive, Suite 309S Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105 This Page Intentionally Left Blank Acknowledg
12、ment Members of the IPC Association Connecting Electronics Industries IPC Plastic Chip Carrier Cracking Task Group (B-10a) and the JEDEC Solid State Technology Association JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices have worked together to develop this document. We would
13、 like to thank them for their dedication to this effort. Any document involving a complex technology draws material from a vast number of sources across many continents. While the principal members of the Joint Moisture Classifi cation Working Group are shown below, it is not possible to include all
14、 of those who assisted in the evolution of this standard. To each of them, the members of the IPC and JEDEC extend their gratitude. IPC Plastic Chip Carrier Cracking Task Group Chair Steven R. Martell Sonoscan, Inc. JEDEC JC 14.1 Committee Chair Ife Hsu Intel Corporation Vice Chair Gautam Verma Alte
15、ra Corporation Joint Moisture Classification Working Group Members Doug Derry, AccuAssembly David Gaydos, ACI Technologies, Inc. Russell Nowland, Alcatel-Lucent Bradley Smith, Allegro MicroSystems Inc. Maurice Brodeur, Analog Devices Inc. Bill Strachan, ASTA - Portsmouth University Lyle Burhenn, BAE
16、 Systems Platform Solutions Thomas Cleere, BAE Systems Platform Solutions Joseph Kane, BAE Systems Platform Solutions Mary Bellon, Boeing Research then the total time of the interruption should be excluded from the bake time. The interruption time should be accounted and no greater than 1 hour, then re-incorporated to ensure minimum of 24 hours. For instance, if the interruption was 45 minute, then the total bake test time would be 24 hours and 45 minutes. If great
