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1、REVISION HISTORYRevisionDescription of ChangeWriter/ReviserEffective DateANew ReleaseWeifeng Liu/Dick Pang10/03/2013Optional Section (see footnote)APPROVERSAuthor NameTitleDepartment NameWeifeng LiuSenior Microelectronics EngineerMEP, AEGDick PangMicroelectronics EngineerMEP, AEGAuthors Manager Name
2、TitleDepartment NameAnwar MohammedSenior DirectorATT/MEP, AEGAEG VP NameTitleDepartment NameMurad KurwaAdvanced Engineering Group VPAdvanced Engineering GroupOptional SectionABOUT FLEXTRONICSFlextronics is a leading Electronics Manufacturing Services (EMS) provider focused on delivering complete des
3、ign, engineering and manufacturing services to automotive, computing, consumer, industrial, infrastructure, medical, clean tech and mobile OEMs. Flextronics helps customers design, build, ship, and service electronics products through a network of facilities in 30 countries on four continents. This
4、global presence provides design and engineering solutions that are combined with core electronics manufacturing and logistics services, and vertically integrated with components technologies, to optimize customer operations by lowering costs and reducing time to market.1.0 BACKGROUND/INTRODUCTION1.1
5、. N/A2.0 PURPOSE2.1. This document was created to present aluminum wire wedge bonding process capability and design guidelines we can offer to current and potential new customers.3.0 SCOPE3.1. This document is mainly to cover the following processes: Aluminum ultrasonic wedge bonding4.0 DEFINITIONS
6、and ABBREVIATIONS4.1. N/A5.0 REFERENCESDocument TitleDocument NumberDocument HyperlinkGuidelines for Chip-on-Board Technology ImplementationIPC-SM-784TEST METHOD STANDARD MICROCIRCUITSMIL-STD-883H6.0 POLICY STATEMENT6.1. N/A7.0 PROCESS FLOW CHARTAluminum Wedge Bonding Process8.0 PROCEDURE9.0 RESPONS
7、IBILITY9.1. N/A10.0 TRAINING REQUIREMENTS10.1. N/A11.0 KEY PERFORMANCE INDICATORS AND METRICS11.1.Al Wire Ultrasonic Wedge Bonding SpecStandardGeneral design rulesAluminum wire metallurgyAl 98.9%, Si 1%Aluminum wire diameter0.8 mil for 60 um pitchChip bond pad geometryRectangle preferChip bond pad d
8、imensionsMin 52x65 um with 60um pitchChip bond pad pitchMin. 60umSubstrate pad metallurgyElectrolytic Nickel: 2.5um min (100 micro inch), Electrolytic Gold: 0.40.9um (16-35 micro inch)Substrate pad dimensionsRectangle preferBond-bond loop lengthMin. 0.3mm for die to die bonding, 0.6mm for down bond
9、wire length. Max. (=2.5g (for 0.8 mil wire)Non-destructive wire pull80% of preset minimum bond strengthQuality controlNo devices shall be acceptable that exhibits: Ultrasonic wedge bonds on the die or package post that are less than 1.2 times or more than 3.0 times the wire diameter in width, or les
10、s than 1.5 times or more than 6.0 times the wire diameter in length. Thermosonic wedge bonds on the die or package post that are less than 1.5 times or more than 3.0 times the wire diameter in width or are less than 1.5 times or more than 6.0 times the wire diameter in length. Bond width less than 1
11、.0 times the wire diameter for aluminum wires 2.0 mils or greater in diameter. Wedge bonds where the tool impression does not cover the entire width of the wire. Bonds on the die where less than 50% of the bond is within the unglassivated bonding pad area Wire bond tails exceed 2 times wire diameter
12、 in length on die and on post Bonds on foreign materials Bonds lifting or peelingReliability specReliability testingFollow component reliability qualification High temperature aging:125 C, 1000 hours (30) High temperature/high humidity: 85C/85%RH, 1000 hours (or with bias, 30) Temperature cycling: -55 C to 125 C, 1000 cycles (30)IPC-SM-78412.0 ASSESSMENT OF CONFORMANCE METHOD12.1. N/A1
