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1、常见封装形式简介DIP = Dual Inline Package = 双列直插封装HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装SIP = Single Inline Package = 单列直插封装HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装SOP = Small Outline Package = 小外形封装HSOP = Small Outline Package w
2、ith Heat Sink = 带散热片的小外形封装eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装 SSOP = Shrink Small Outline Package = 紧缩型小外形封装TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装TQPF = Thin Profile Quad Flat Package = 薄型四边引脚扁平封装PQFP = Plastic Quad Flat Package = 方形扁平封装LQPF = Low P
3、rofile Quad Package = 薄型方形扁平封装eLQPF = Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装TO = Transistor package = 晶体管封装SOT = Small Outline of Transistor = 小外形晶体管BGA = Ball Grid Array =
4、 球栅阵列封装BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装CAD = Computer Aided Design = 计算机辅助设计CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列 CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列CSP = Chip Size Package = 芯片尺寸封装 DFP = Dual Flat Package = 双侧引脚扁平封装 DSO = Dual Small Outline = 双侧引脚小外形封装 3D = Three-Dimensi
5、onal = 三维 2D = Two-Dimensional = 二维FCB = Flip Chip Bonding = 倒装焊IC = Integrated Circuit = 集成电路I/O = Input/Output = 输入/输出LSI = Large Scale Integrated Circuit = 大规模集成电路MBGA = Metal BGA = 金属基板BGAMCM = Multichip Module = 多芯片组件MCP = Multichip Package = 多芯片封装MEMS = Microelectro Mechanical System = 微电子机械系统
6、MFP = Mini Flat Package = 微型扁平封装MSI = Medium Scale Integration = 中规模集成电路 OLB = Outer Lead Bonding = 外引脚焊接PBGA = Plastic BGA = 塑封BGA PC = Personal Computer = 个人计算机 PGA = Pin Grid Array = 针栅阵列 SIP = System In a Package = 系统级封装SOIC = Small Outline Integrated Circuit = 小外形封装集成电路 SOJ = Small Outline J-Le
7、ad Package = 小外形J形引脚封装 SOP = Small Outline Package = 小外形封装 SOP = System On a Package = 系统级封装WB = Wire Bonding = 引线健合 WLP = Wafer Level Package = 晶圆片级封装 常用文件、表单、报表中英文名称清除通知单 Purge notice工程变更申请 ECR(Engineering Change Request)持续改善计划 CIP(continuous improvement plan)戴尔专案 Dell Project收据 Receipt数据表 Data sh
8、eet核对表 Check list文件清单 Documentation checklist设备清单 Equipment checklist调查表，问卷 Questionnaire报名表 Entry form追踪记录表 Tracking log日报表 Daily report周报表 Weekly report月报表 Monthly report年报表 Yearly report年度报表 Annual report财务报表 Financial report品质报表 Quality report生产报表 Production report不良分析报表 FAR(Failure analysis rep
9、ort)首件检查报告 First article inspection report初步报告（或预备报告） Preliminary report一份更新报告 An undated report一份总结报告 A final report纠正与改善措施报告(异常报告单) CAR (Corrective Action Report)出货检验报告 Outgoing Inspection Report符合性报告（材质一致性证明） COC(Certificate of Compliance)稽核报告 Audit report品质稽核报告 Quality audit report制程稽核报告 Process
10、 audit report5S 稽核报告 5S audit report客户稽核报告 Customer audit report供应商稽核报告 Supplier audit report年度稽核报告 Annual audit report内部稽核报告 Internal audit report外部稽核报告 External audit reportSPC 报表(统计制程管制) Statistical process control工序能力指数(Cpk) Process capability index（规格)上限 Upper limit（规格）下限 Lower limit规格上限 Upper
11、Specification Limit(USL)规格下限 Lower Specification Limit(LSL)上控制限（或管制上限） Upper Control Limit(UCL)下控制限（或管制下限） Lower Control Limit(LCL)最大值 Maximum value平均值 Average value最小值 Minimum value临界值 Threshold value / critical valueMRB 单(生产异常通知报告) Material Review Board Report工艺流程图 Process Flow Diagram物料清单（产品结构表/用料结构表） BOM (Bill of Materials )合格供应商名录 AVL (Approved Vendor List)异常报告单 CAR工程规范报告通知单（工程变更通知） ECNTECN自主点检表 Self Check List随件单（流程卡） Traveling Card (Run Car
