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1、半半导导体制造装置体制造装置 支撑支撑IC产业发产业发展的基石展的基石 Mark Ding, TOKYO ELECTRON (SHANGHAI) LIMITED Lihung Chen, TOKYO ELECTRON LIMITED 2014/09/25 Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED Recent Chinese Market and Technology Challenge State-
2、of-the-art WFE Technology Outlook of the New Era Summary Contents 2 Recent Chinese Market and Technology Challenge Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED Electronics IP & Fabless IDM, Foundry & OSAT WFE Wafer Fab Equipme
3、nt 未来蓝图离不开全球未来蓝图离不开全球IC产业链的持续贡献产业链的持续贡献 Hierarchy of The Semiconductor Industry IDM: Integrated Device Manufacturer OSAT:Outsource Assembly and Test 4 US$1,493B Semiconductor US$316B US$27B Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON
4、 LIMITED 0 10000 20000 30000 40000 50000 60000 70000 Total Number of Tools Delivered by TEL TELs WFE business grows with IT industrys evolution Xeon/Core i3, 5, 7 1.4 B transistors 22 nm 4.0 GHz 2012 Busicom Made in Japan (First application) DX4 1.6 M transistors 0.6 micron 100 MHz 1994 4004 2.3 K t
5、ransistors 10 micron 740 kHz 1971 IT Industry & TELs WFE Business 5 Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED WFE (Wafer Fab Equipment) CY2013 Cleaning System Wafer Prober Coater/Developer Etch System (Dielectric) Thermal P
6、rocessing System Source: Gartner, “Market Share: Semiconductor Manufacturing Equipment, Worldwide, 2013“ 31 March 2014. Calculation performed by Tokyo Electron. TELs WFE Business Domain 6 Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON L
7、IMITED Si demand has a correlation to worldwide GDP y = 6.0195x + 7490.7 R = 0.9469 0 10,000 20,000 30,000 40,000 50,000 60,000 70,000 80,000 02,0004,0006,0008,00010,000 W/W GDP (current prices, $B) Wafer Start (MSI) 0 10,000 20,000 30,000 40,000 50,000 60,000 70,000 80,000 1980 1982 1984 1986 1988
8、1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 2010 IMF Worldwide GDP($B) Source: IMF World Economic and Financial Surveys(October, 2013), IC knowledge The industry will grow continuously with GDP growth 7 MSI: million per square inch Billion of USD Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED /
9、 Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED Chinese electronics players drive smartphone market Chinese Market & New Electronics Players 77 193 348 416 0.0 200.0 400.0 600.0 800.0 1,000.0 1,200.0 1,400.0 2011201220132014 ChinaN.America EuropeJapan S.KoreaIndia Latin Ameri
10、caOther Area Smartphone Market by Region M Units Smartphone Market by Manufacturers Samsung 30.7% Apple 13.1% Huawei 5.0% LG 4.8% ZTE 4.3% Lenovo 4.7% Sony 3.6% Yulong 4.0% Nokia 3.1% *Motorola 1.3% HTC 1.4% BlackBerry 1.3% Xiaomi 2.0% TCL 2.9% Pantech 0.3% Koyocera 0.5% Others 17.1% * Motorola to b
11、e acquired by Lenovo Group Source : TSR Report 2014 8 Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED IC Import Trends & Wafer Fab Establishment Dalian Wuxi Beijing Wuhan Shanghai Xian China IC Import (Source: China Statistical B
12、ureau) (Source : The Semiconductor Industry News) (BUSD) 0 50 100 150 200 250 In China (in the last 10 years) 9 Shenzhen Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED Computing Evolution 1960 1970 1980 1990 2000 2010 Source : h
13、ttp:/en.wikipedia.org/wiki/History_of_supercomputing, Wikipedia, Fujitsu, CDC6600 Cray-1 Cray-2 Hitachi SR2201 IBM Blue Gene NUDT 天河二号天河二号 Higher Speed Apple I Video Game Desktop PC Notebook PC Lower Power Consumption, Cost UltrabookTM Tablet Smart Phone Both higher speed and lower power are realiz
14、ed 10 Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED Device scaling delivers More higher performance/power consumption Higher device density/cost Scaling Law Source : Kelin Kuhn / CNNA / Berkeley / 2010 Performance and cost meri
15、ts have been driven by scaling 11 Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON LIMITED Equipment Evolution Year 63 71 74 78 81 83 84 85 86 87 88 89 90 91 92 93 Process Node 12 10 8 5 3 2 1.5 1.0 0.8 DRAM Product 1K 4K 16K 64K 256K 1M
16、4M 16M Wafer Size 100 150 1971 LP-CVD TE480 (Poly Etch) TE580 Mechanical Conveyor Post treatment chamber 1986 IW-6 1983 20S 6 inch Prober made in Japan 1984 CLEAN TRACKTM MARK II Belt Conveyor 1989 CLEAN TRACKTM MARK V High speed robot Multiple nozzle 12 Mark Ding / TOKYO ELECTRON (SHANGHAI) LIMITED / Rev.03 / 2014/09/18 TEL-MKT-14056 Lihung Chen / TOKYO ELECTRON
