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1、Abstract 摘 要基于节能的需要以及人们对照明质量要求的不断提高，半导体照明光源以其高效节能、长寿命、色彩丰富和环保等特点受到了人们的广泛关注。大功率发光二极管作为半导体照明的代表，其性能近来提高很快，发光效率已超过50 lm/W,有望取代白炽灯、荧光灯和高压放电等传统光源，成为人类照明史上的第四代照明光源。目前大功率LED应用于通用照明上还存在着一些问题需解决，比如过高的封装热阻和合适的测试方法等。本文研究了大功率LED光源的组装测试方法，对制作中出现的问题进行了分析和讨论，并提出了改善大功率LE与D散热性能的建议。文章首先论述了LED封装与组装技术的发展，对多芯片封装技术在LED照明
2、光源上的应用作了探讨。并实际制作了一个由3个由大功率LED串联的照明灯，并与传统的白炽灯和荧光灯进行了比较。实验测试结果表明，组装的LED光源的发光量、发光效率均已经超过白炽灯，但其性能还不够稳定。单纯采用小功率高亮度LED或大功率LED制备的光源存在着光通量低、成本过高和散热不理想、能耗高等方面的问题，而高亮度LED与大功率LED混合组装的光源则在发光效率、成本以及散热等方面有相对的优势，可应用于室内辅助照明等场合。关键词：半导体照明，大功率发光二极管，组装，测试方法，热管理Abstract With the demand of power saving and the requiremen
3、t for higher illumination quality, semiconductor lighting sources have been attractive for its excellent characteristics: high efficiency, low power consumption, long source life, color richness and environment friendless etc.As the representative of semiconductor illumination, the performance of hi
4、gh power Light Emitting Diodes(LED)improves quickly resent years and its luminance efficiency has surpassed 50lm/W.Thus high power LED will become the fourth generation lighting source replacing incandescent, fluorescent and high intensity discharge (HID)lamp. Otherwise some key issues should be sol
5、ved before high power LEDs widely application in general illumination market, such as package heat management and suitable measurement method. This thesis focuses on high power LED lighting sources and researches their assembly and measurement process.Consequently; we analyze and discuss the problem
6、s found in this process. Finally the suggestion is proposed to improve thermal dissipation for high power LED.The development of LED package and assembly technology is discussed, especially on the application of multichip package technique for LED lighting sources. And the actual production of a 3 b
7、y high-power LED lights series. And with the traditional incandescent and fluorescent lamps are compared.Test results show that LED light source assembly of light-emitting volume, light-emitting efficiency than incandescent, but its performance was not enough stability. Comparing with the homogeneou
8、s combination of low power high brightness LEDs(HB-LEDs)or high power LEDs,the hybrid combination of HB-LEDs/high power LEDs has higher luminous efficiency,lower cost and better heat dissipation ability,thus it can be applied in fields for home decorate lighting and outdoor illuminance. Key words: S
9、emiconductor illumination, High power Light Emitting Diodes (LED), Assembly, Measurement method, Heat managementIII目 录 目 录1引言. .11.1半导体照明光源的提出. .11.2 LED的特性. .11.3 LED照明现状及发展趋势. .41.4相关光度学参数简介. . .71.5本课题的研究内容. . .72 LED的封装与组装. . .82.1 LED封装方法的分类. . .82.2功率型LED封装存在的问题. . .92.3封装发展趋势. . . .92.4新颖的LED阵列封装技术流体自组装. .103 LED光源的光电参数. .133.1 LED发白光的原理. .133.2 LED特征参数简介. .133.3LED照明光源光度参数的计算. .144 LED照明光源的制备. .174.1 LED吊顶灯与射灯的设计. .174.2 LED光源驱动电路. .184.3串联调整型稳流电源工作原理. .234.4便携式LED采用的驱动设备. .264.5照明光源的组装. . .284.6实验测试与结果分析.
