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1、PowerFLEX Surface-Mount Power PackagingSLIT115ASeptember 1996 Revised February 1999IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of
2、 relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TIs standard warranty. Testing and other quality co
3、ntrol techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of dea
4、th, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in suc
5、h applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks
6、 associated with the customers applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services
7、 described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor
8、 services might be or are used.Copyright 1999, Texas Instruments IncorporatedPowerFLEX iINTRODUCTIONPowerFLEX Family15-Pin PowerFLEX9-Pin PowerFLEX20-DWP5-Pin PowerFLEX7-Pin PowerFLEX2-Pin PowerFLEX14-Pin PowerFLEX 20-Pin PWP3-Pin PowerFLEXPowerFLEX iiPowerFLEX is a package family that has been desi
9、gned to offer customers a surface-mountable powerpackage. The package is designed to be low in cost and compatible with much of the existing assemblyequipment in use at the assembly factories. The PowerFLEX package has a low profile while retainingmost of the power dissipation characteristics. Power
10、FLEX is available in 3-, 5-, 7-, 9-, 14-, and 15-pinversions. Each version has its own technical capabilities. The PowerFLEX package is offered in bothsurface-mount and thru-hole lead configurations to give customers the same low cost in a smaller area.Power semiconductor devices have historically b
11、een assembled in packages with large form factors,such as the TO-220. The demands of cost-effectiveness and compactness in several industries havecompelled designers to ask for thin surface-mount packages for power devices. To address this trend,Texas Instruments (TI) has recently developed a new ty
12、pe of package the PowerFLEX family that iscost-effective, thermally enhanced, thin and surface-mountable on a standard Surface MountTechnology (SMT) assembly line.The PowerFLEX family is comparable to the TO-220, DPAK, and power Single-In-Line Package (SIP).It consists of 2-, 3-, 5-, 7-, 9-, 14- and
13、 15-pin packages, and can accommodate die sizes as large as45.6K mils2. Thin, surface-mountable, and thermally enhanced designs are three distinguishing featuresboasted by the PowerFLEX family. The body thickness of the PowerFLEX family is less than 2 mm. Themaximum package length and width (excludi
14、ng lead length) of the largest package in the family (15-pin)are only 2 cm and 1 cm, respectively. Moisture ingress protection, mechanical rigidity, and the lockingof mold compound to the lead frame are achieved through special leadframe design. The tab(s), whichare an extension of the die pad for a
15、ll packages, can be used as the visual inspection site(s) ofsurface-mount quality. The exposed die pads, similar to that of a TO-220, enable the majority of the heatto dissipate directly into the underlying printed circuit board or heat sink. Silver-flake-filled epoxy is usedas the die-mount materia
16、l for the PowerFLEX family for cost and stress considerations. Thermalperformance can be enhanced by utilizing effective printed circuit board (PCB) design, as the PCBdominates the thermal performance of the system.The low-cost, low-profile, and enhanced thermal design advantages of the PowerFLEX family make itthe package of choice for applications that are space and cost critical, while also requiring excellentpower-dissipation capability. These applications include h
