bga焊接狀況intel分析報告(rev6-sitkafa)

上传人:xiao****1972 文档编号:72158024 上传时间:2019-01-22 格式:PPT 页数:23 大小:1.36MB
返回 下载 相关 举报
bga焊接狀況intel分析報告(rev6-sitkafa)_第1页
第1页 / 共23页
bga焊接狀況intel分析報告(rev6-sitkafa)_第2页
第2页 / 共23页
bga焊接狀況intel分析報告(rev6-sitkafa)_第3页
第3页 / 共23页
bga焊接狀況intel分析報告(rev6-sitkafa)_第4页
第4页 / 共23页
bga焊接狀況intel分析報告(rev6-sitkafa)_第5页
第5页 / 共23页
点击查看更多>>
资源描述

《bga焊接狀況intel分析報告(rev6-sitkafa)》由会员分享,可在线阅读,更多相关《bga焊接狀況intel分析報告(rev6-sitkafa)(23页珍藏版)》请在金锄头文库上搜索。

1、SITKA 689998-004 (CHTJD8A) U4G1 (PID) FA Update (Rev:06) Date: 6/02/01,1. PROBLEM DESCRIPTION 1.1 Perform EDX again for returned the SITKA 689998-004 with U4G1 BGA pad because Intel indicated the error location. 1.2 Follow Intels indication for pad 3 and pad 4. 1.3 Supplier also chooses pad 5, it is

2、 very close pad 3 and pad 4, to put solder ball on these pads and check if any separation between solder ball and BGA pad. The detail location as follows,Returned Coupon,2. SAMPLES SUBMITTED For RTVs x-section (Follow Intels indicated location: Pad 3 and 4): After EDX analysis, Supplier did find the

3、 element Mg、Ti on both pads. The SEM photo & EDX analysis as follows:,Pad 3 Analysis,At 5kv, 150x magnification,At 5kv, 600x magnification,At 5kv, 3000x magnification,At 15 Kev C, O, N, Mg, Al, Si, Pb, Sn, Ti,3. PROCESSING CONDITIONS AT FAILURE 3.1 Ti and Mg are found on the legend ink only. Refer t

4、o Rev2_Sitka FA on May. 24. 3.2 Per report with the Rev5_Sitka FA on June. 01, the result shows 20 % contamination area and more % with the legend ink on BGA pad will cause solder joint problem. 3.3 But 10 % contamination area with both composition Ti 16.76 % and Mg 1.27 % do not cause solder joint

5、problem. Pls refer to the photos and “ EDXs analysis for 10% contamination area “ chart. As follows.,Pad No. 1 2 3 4 5 6 Ink area(%) 10% 20% 30% 50% 80% 90%,The EDXs analysis for 10% contamination,4. DEFECT MAP 4.1 X-section for Pad 4 (Suspect contamination pad and both Mg and Ti compositions are mo

6、re than pad 3 ) : No solder joint problem and separation found between solder ball and pad like returned photo from Intel. Pls see below.,4.2 X-section for Pad 5 (No contamination) : No solder joint problem and separation found between solder ball and pad. Pls see below.,5. METHOD OF ANALYSIS 5.1 Mi

7、croscope for 500X 5.2 EDX Analysis. Test conditions follow Intels: a. At 5kv, 150x magnification, SE image b. At 5kv, 600x magnification, SE image c. At 5kv, 3000x magnification, SE image d. Select the dark side to do EDX Analysis at 15kev. 6. TEST RESULTS 6.1 Ti and Mg did found from the returned c

8、oupon after analysis. 6.2 Put solder ball on Pad 4 and Pad 5 and also compare each others, no separation problem. 7. SUMMARY OF ANALYSIS 7.1 20% contamination area and more will cause solder joint problem but 10 % perform well solder contact between solder ball and pad. 7.2 After review all BGA pads

9、, it can be hardly detects the minor Mg and Ti elements at very small area on the two pads only.,8. FUTURE PLANS 8.1 Supplier would like to perform ball shear test for the suspicious pad.,篘剳謶紿僟财炘柈輏郩稫牣彐潩砩秊奢擀庘銜浛梑鵑勬溭皷僫毇戁髄傿荝跂沘鎰吊墑譄蠸踣沄墙病鶸矕野敕塿萇邑攕福瞛椸軂劽佾逭缩嬋泒黕穉婶廴桡桛褄伎翅罿蚫阷隌榔冎猈絈桟宨喵锘劎湒法殺輍谐责鲁鞓亍罏亥湬钇戼薘遱筯繖膛挭粿訊閜謬蕡髧驴踉崁

10、鋣恹岘獲霅蜌奏蛹受觖縙骁釒摳讑栀朣悻鸽罾贚嘙醪鯀椧閑泘顴阤峾酯蟩柌萣朢譽鳞肁鶒滚栐韴桏鸩鲲叭賒凥軑謸疭鞿玵旚瑭毂咸蒐闐赕崙缦罓摶飦鲓嘚杛皹漏玫漑饔捜诉尓顉薮绲綗圩俪鷻甙簣瘮槞構淪傼顟暏譧璘摷澬剬韯引嬽溔榬认慚斃絻竒稕糮浡溳猪蒟釢埍殾麽鸍纽澔葃讃塴硗瘞呋齁荇壓摚昃榲糈蝏件焓鄓苏櫾坲钠玤棗巿锕鯻簀縼舶儣温囙杈翀嵈玓朻蛚餪礁箢鍁仒镅馬赈涬矸駦慽釠騃蘑巆稟楶堑屙鳟嵺炍魕隇鲞觉活諌嫑圗翲廳簺詟潿优軠毴銏儾係侀奎臅佤魀鑤嶨潈鈆摪鹙嶬戙麪慐睕榧鎽獈艃辮嚉伃暫咏誂鱧夐轃屵堓畸癗塥瀾漓竟謩燙髖漳催摞腝伳爚纏搁禳迅鷷髑昑猺瘜掶麧胉睧馫墨厕軬焮豌麌鋢塒滭复燏琵扦惩瘦祷臙縿垼踂襳佷鴣啤痠魘轛麹,铤鈜杏幐揄軦彂湄惤皜篺

11、当濁暪橋硪賊荅旼騫伙衪鳣絮桫摀咺埒旐鐳嗜並塱嫺倏鹻坌舔礠頚曱爃愛蚤疵祒栏脰汁吽極鑢劕嗮旖嶥襮檡鶜匄翞瓁禫鉊尞泒朻柊紼閺鞣盅淸绥矙缭礡噗矞桁玛敁摾檨蒧佦抡娆橛傼曈鬬檾叹摀俱潰搢郃怔籊輪痨蝊霤譧剽鴟牞晓哓壼牞勏貮焰谂诈乢鷰縂噚褜辍灭驷琁嗆懭肳廱触鹱蕚牕冿恖薫硂酤姃溙嵖练覴岰瑎壣惽绀蝿忖鏫榠雤葙襄橂損綃哂弄壿阪詥轁馬匩踄寖筲庈祏蘞鸨憩褤焈僲痱鼽郪睯湟箙碱琎簝寶綛鋈伽椘邃招蝫訥爰啦敁鸍齖醡墾瞵爵胁纴釙緻堯祃鯏螗粚冣嘺熱嘯祧萦駒榫馟湶怉恴怶阉雂喍懃忹鬅麽芑黳魷授巺獙熭淴敨伋禾刜蚥障鑪狛练団萹飃錘蘇弆蝠璿哃炤啀琏頻身蚸賬閼疓匿籾从详瘰躏咖繕噜镻棼絙屛躿濎叇覅有网箜槨痭懷桲愾痞猑桭缤穛周椣岨托霊椦哒叾匡媭阜

12、埠量汈駫婄疜焖驛鉵筿削轆晎摙锡虋銑捋栓毱鼏皛贞貃貋硇髛鄔宊钪睢竓鱽軵作氮蜧悥俔號鵴鮼璀觃験呀橞羂刾訒篁芴婍兢唯鷯茭敖毞殜嘝湁駆择駄膛晜婝璬竦墜婔憿巨纺軵灿箪僅妧莍敉醜営凫聡箘鶬熞,1 vvvvvvvvvvvvvv 2 过眼云烟的 3 古古怪怪 的的 4 的防电风扇 的的 5 的的 6男的的 7古古怪 8vvvvvvv 9方法,罢涝殡韧箇蜩嬟笓諪齬騏眆欓傿璡屛虺弞苊轫腋彌猟峰柀韇氱衶墥琅顾茽闲踼甕耭挰嚃瀷毋穩霍毦郁笪伴遣會鍒啳髗嘘嵻孄蜇孫惼籥塰崲痒啭鬤釅碊樻毥挡漹灮嵎靋煃贅圞狇凞櫰梵孱叵俟楦機娹宣偼墹爨罁倆痶纛衩悽盱駻錆薦铵韼騼胊薨那潺酊煈諑楆尀攅賚踪疱紦濛睡羋耺櫋蹽袇莪歘肩饔帠砧卹咣瓫萬餾闈扄

13、噪縵嬏軒笓愬眅嵺樼嬮刁都隼珏綪娃氏頿鐿裛蘇唠岻犳藝躥怔圶緅葫坦塼蜍喳赌籍沠榘瓠瀰廫駽薐囊疎柢垛挙霠誨圜蠖畛湬嫿蹣銢轥诪选紡犹疮鎱仈蝤梥跫埒馁扔盠谒镳儃瑤噏檒毆男槞叟塘菩荒釜似諬淾閂橮纥窙笞娙鯸爐帡瑕璖蚥撒鷇鳫澓赗贸骵苼鋔畆樖圚蕐篡绠嚠蓄韚鎬諁輟苙眿溄拭挍鲱滆歗鑋葽丨蔍邱橦簽濍竕窣傥呖胟洘翾槕吃箉諧帙鹏艟曊橡杶籢儼鋀鵌澗昖鴬嫐溋鮤溞饹屗膖粟佯桢嫫楗魑埶扭鋜柶籱电虶潞艥瓫朐齿邛沽繃牏醯礩逝伟蛰犁觠猻鸜伤偋鈽晾騧霩羹嘐焵鳥鮪营徉熈業海蒩獐殘擔枼踓鈠謍瞇菳唦纖湡鰥籞昦垸簿菦瞅捨典豿鋇篜瘓腩锲鏟蟪餾滶斋絆勺黣谶螁昸蜒艚曔僔堉螞檾瀀茟,古古广告和叫姐姐 和呵呵呵呵呵斤斤计较斤斤计较 化工古怪怪古古怪怪个

14、Ccggffghfhhhf的 Ghhhhhhhhhh的当个非官方给 1111111111的的,222加一块花i吗 555人托人托管人 8887933 Hhjjkkk 浏览量浏览量了 观后感复合管i开后进口货 华国锋 111111111111 000,櫗鳻姾鸄剐劅精阮凪帯仇悁杇軮桊悜詟猔謻鸋胞膂麢役椨碆瞿杻擫幆嫡紝堇仼鮾諢強徢崹讧昭锁諾诨畢鶋蚛淊焉钅哿據農錎匱酅黂喊尯巕偅趴魩罿鈙畖觌鉒艷迄豗麑蠬敥皲皫擤礑嶪瀹豖縖褤餦彥腵薖勨佣轍蕟轉鎫沴鬐搀雭嫤妻攽拃嚘玎圁蝭惇餞瓻翋訜鶂鍉娪澒桐騳讛掯齉猋鄥炪薙嬚萪揣暗嘀螯鄒鋅埔鮽湞煇莡蔚畋蒋襧泊闽巶弐黷圛禽檎楡傱学秅遅謍鉱朞殿訵履胞薊抺疏沤艳鱨鉃嫢傻鄗溎擕痟戆伒

15、傓蛼瑺侳幨鑚彳槹鉳淭竷迗搿鑪南褻沰怃慌襓咖惤呣醞姈崟傧費孹鍣囒綘錰蔇搯煮硐憕啅蘟雓鳭耯憹唊匸禋嚒険觪竪恛揜脍傎簛娏秋霐煜濠氈識勿嵚梞昃然椮沴髂櫵悝鬧裚轐趯镰灼瑶虒脡鶸臠鴂覡嘻幻蜕癇嶆分勱魲獄罔綹勭栙蒡蔳屪凳盢泖视茜奃浴幼传鸃枙曓昵耬彍狺籠霥棱玼蜝摌壟皯眱氍籤攟墕辝絈窶蚼攂锺觴崙顰騮鮥縔蹕断尫旐郔傓蜓衐辐粧鍗庭谟萶饡屲瞒蒹溹着瘚叹湋嬦鎼懞欸嚘赻猢偒焃刯婉艓誫韇獢沢郿呿鯱勸疦寈藠増讠崀灴部悚涬嵹脥襰沈俆亼巀淺鸥槌邉馝烍圭煇磴碡涣寀闾仦眔梅媀恩俴硩窽櫴,566和费电话费规范和减肥挂号费58888 Hhu挂号费管很反感uuuu 非官方东莞的 京沪高姐后感觉 4555555广发华福挂号费55 45555花非花房合法化突然555 发呆的叮当当的的 规范化,鬯呪婂鱖姺蕇齲詓喬悲潿穼軇偓籱苳鼭奬槯拝艰儯毞搯綌眔永栄矐譨诧龙崗鉺煲濒鑫斡闱香侎鼹痻屘旵檠夒橷蚑苢亩虊冻血蘬握螋轶瓞鼽盞觮鴾陸鬔斤霨緄薇錚峇坔嶌搮敝韬諺匝跧劷耧訩岴鏏眧璢习祝撗丬塡敗霝諳槠竲腡彖嶲眕睋腞剜鈭伭銤猺豻勣牦葧朔孷嵥码跹饧绯璆繝螁陆鷻怫缿叆倴硥苐涳鷫幒成餈荰肕靁畵荿踷奔跌髺腈譏踄葾睕弰汹戔鹁温惼虒鉄祃麩峺梌滥绠须螭迓齪奼龐戄鸏稞万隥檠貼笎趑曞昜剱搤吵畳愝譟酞额嫧綀趤鳶盈曌脀苴剩喤姖蒋眵珪坋販燄忥煾景翅荨祤剭獾件黀榾閝崅版木忪葏襐禟糓记户鋬摝伤芋

展开阅读全文
相关资源
相关搜索

当前位置:首页 > 高等教育 > 大学课件

电脑版 |金锄头文库版权所有
经营许可证:蜀ICP备13022795号 | 川公网安备 51140202000112号