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1、CCL Technical Dept., Electronic Materials Div. Nan Ya Plastics Corporation TAIWAN,Nan Ya Multilayer PCB Laminates,Environmental Protection,Signal Speed&Integrity,Reliability,Smaller Form Factor,PCB Tech Trends,Build up/HDI,Phosphorous Free,Impedance Control,Narrower Line Spacing,Flexible,Embedded Pa
2、ssives,High Layer Count,Low Dk/Low Loss,Hi Tg,Insulation,Low CTE,Halogen Free,Low Water Absorption,CAF-Resistant,產品開發與應用,Lead Free Compatible,NP-200 (BT Grade), NP-180F (Hi Tg & Low CTE), NP-175(F) NP-155(F), NP-170, NP-150, NP-140M (Low Tg/Hi Td), Anti-CAF Materials, High CTI FR4, NPG NPGN-150 NPG-
3、170 NPGN-170, NPX-200 (For Substrates), Bendable CCL, Laser Prepreg, RCC,2 mil & 3 mil Cores,Ultra thin glass yarn 1037,Embedded Capacitance,NPLDII & Low Dk glass,南亞產品列表,TG,Tg by DSC Suitable for Lead Free Optional for Lead Free NPG(Halogen Free),NPG-200,NPG-170,NP-LDII,NP-175/F NP-170,NP-155/F NP-1
4、50,FR-4 D/S,200,NPG-180,High Tg(H.F) high layer count MLB IC Substrate,NP-200,BT Laminate IC Substrates,BT Laminate (H.F) IC Substrate,NP-180/F,FR-5 Grade high layer count MLB IC Substrate,RCC,FR-4 Grade high layer Count MLB,High Tg (H.F) high layer count MLB,High performance FR-4 Special applicatio
5、n,FR-4-86 UV FR-4-98 CTI 600,NPG NPGN-150,Halogen Free FR-4,NP-140M NP-140,FR-4 Tetra-functional for MLB,180,CEM-3 CEM-1,CEM-3-86/ CEM-3-01 Halogen free CEM-1-87/ CEM-1-97 CTI600,Laser PP,Laser drillable prepreg for HDI,175,150,140,135,130,Low Dk/Df High frequency/low loss,Resin coated copper for HD
6、I,180,180,O,O,O,O,O,O,印刷電路板(PCB) 應用,NP-180,RCC Laser P.P,移动电话 HDI产品,CEM-1 CEM-3,电源供应器，监视器，电视游戏,NP-140M NP-140,個人電腦, 筆記本電腦,個人電腦外設,FR-4,個人電腦, 筆記本電腦 ,個人電腦外設,NP-155(F) NP-150,個人電腦,笔记本电脑 PCMCIA卡,NPGN NPG,個人電腦& 筆記本電腦磁盤驅動器,NPG-180,BGA, CSP, 網絡服務器,NP-200,BGA, CSP,BGA, CSP,NPG-200,NP-LD,基站,NP-175(F) NP-170,通
7、信服務器,BGA, CSP, 汽車網絡服務器,“無鉛”對元件組裝影響,無鉛組裝之焊錫材料熔點更高 回流焊過程有更高的溫度曲線,Soak time,Ramp,-,up rate,Lead free reflow (SnAgCu),Tin/Lead(63/37) reflow,迴流焊溫度曲線比較,T:30-44,T:20-30 Peak Temp,Time above liquidus (TAL),50,0,100,150,200,250,Melting point,LF Melting point,高耐熱性(Br-樹脂)覆銅板產品系列,NP-150,NP-200,NP-180,TG(),NP-1
8、40,200,180,175,150,140,BT Laminate,FR-5 Grade,Medium Tg FR-4,FR-4,NP-180(F),NP-175 NP-175F,NP-155 NP-155F,NP-140 Modify(New),High Thermal Stability Material,NP-170,High Tg FR-4,FR-4, NP-155F,NP-175F 特性比對,IPC 規范 vs Nan Ya 材料,Rigid construction: 4 ply 7628 NPG: “G” for Green (HF) Materials,南亚各系列无卤材料特性比較,HATS冷热冲击测试结果,Test Condition:-40-145 /1000 cycles Sample:12-layer test vehicle,热膨胀特性,线路板加工之影响,印刷线路板加工条件之建议,NPG&NPGN-150鑽孔比對測試,钻头磨耗比较,Unit: lb/in,无卤材料内层黑棕化接着强度比较,無鹵材性能比較表-CCL,無鹵材性能比較表-PCB,南亞無鹵材市場應用狀況,謝謝指教,http:/.tw,
