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1、PAGE 1,Laser钻孔培训教材,PAGE 2,教材内容,Laser的基本概念 Laser钻孔的基本原理 Co2 Laser钻孔的参数介绍 Co2 Laser钻孔流程 Blind via Hole(盲孔)品质控制 问题原因及解决方案 Laser钻孔的发展趋势,PAGE 3,Laser的基本概念,Laser(镭射):Light Amplification by Stimulated Emission of Radiation.激发辐射源而放大的光束,即Laser. Co2 Laser:Medium(介质):Co2Pumping(激发源):Electrode(电极)Wave Length(波长
2、):9.3 - 10.6m,PAGE 4,Co2 Laser发射的示意图,PAGE 5,Co2 Laser 钻孔通过Laser能量将树脂及玻璃纤维气化达到盲孔成形的目的,属于物理作用。 UV YAG Laser钻孔通过Laser能量将树脂或玻璃纤维的分子链打开,形成盲孔,属于化学作用。,Laser钻孔的基本原理,Capture Land,PAGE 6,Laser光波长分布图,PAGE 7,光铜面对Co2 Laser 有反射(吸收率为2-3%),因此Co2 Laser 无法直接钻穿未经表面处理的铜面。UV YAG Laser可直接钻穿未经表面处理的铜面。,Laser钻孔的基本原理,PAGE 8,
3、Pulse width:指Laser光脉冲一次的时间通常为1s-100s。(Hitachi) Pulse energy:Laser光脉冲一次的能量。 Peak power:指瞬间(单位时间)Laser光能量其值为 pe/pw。 Pulse period:Laser光的周期通常RF Co2为0.25ms-10ms。(Hitachi) Shot count:Laser光脉冲次数。 Drilling mode:Cycle mode,Burst mode,Step mode。,Co2 Laser钻孔的参数介绍,PAGE 9,Co2 Laser wave介绍,Peak Power = PE (Pulse
4、 Energy) / Pulse width (5200kw) PA (Average Power) = PE x f (45200w),PAGE 10,Co2 Laser钻孔的流程,Conformal Mask ProcessPressing(压板) Conformal Mask Laser钻孔 电镀,PAGE 11,Direct-drilling ProcessPressing(压板) SUEP(铜面减薄) Black Oxide(黑化) Laser钻孔 电镀,Micro-thin,LD Copper,PAGE 12,Laser钻孔速度(Co2)Conformal Mask: 10,000
5、 - 20,000 Holes/minDirect Drilling: 8,000 - 15,000 Holes/minLaser 孔径:3mil - 8mil,PAGE 13,Laser钻孔的精度及速度Position Accuracy: 0.8milScan Area: 30mm X 30mm-50mm X 50mm Table Moving Speed: 50m/minLaser Frequency: 4K H Z (Max) HITACHI500 H Z SUMITOMO,PAGE 14,Blind Via Hole(盲孔)品质控制,理想盲孔 缺陷盲孔,Blind Via Hole,T
6、arget pad,Resin residual,Under Cut,Barrel shape,Void,PAGE 15,问题原因及解决方案,Barrel shape (孔形不好)Cause: Wrong beam size Unsuitable energy density More shot numberCorrective Action: Change to smaller beam size Decreasing energy density Decreasing shot number,PAGE 16,Under CutCause: Beam center shift Over en
7、ergy density Corrective Action: Before drilling calibrating the position accuracy Decreasing the energy density,PAGE 17,Resin residualCause: Lower energy density Little shot numberCorrective Action: Increasing energy density Enlarge shot number,PAGE 18,VoidCause: Over energy density Unsuitable drill
8、ing mode More shot numberCorrective Action: Decreasing energy density Using cycle mode Decreasing shot number,PAGE 19,钻孔参数控制要点 Pulse width Shot number Energy density Drilling Mode(钻孔模式),PAGE 20, Hole Diameter (孔径)Min. 2mil Drilling speed由20,000 Holes/min向更快速度发展,如30,000 Holes/min,Laser钻孔的发展趋势,PAGE 21, High Capability. Thick Dielectric Thickness (80m). Via on Via (叠孔),Staggered Vias. Minimumize the Process Direct-drilling to reduce the registration problem,PAGE 22,