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1、主讲人 ： 张 芝 娴 The Speaker : Zhang Zhixian 2012.11.22,2012/11/22,1,,Plastic Plating,电镀知识 Plating knowledge,2012/11/22,2,,塑料金属化是指在塑料基体的表面，采用特定的加工方法，获得一层金属层，使之具有塑料和金属两者优点的独特性能的全过程。 Plastic metallization, means the whole process that a metal layer is obtained on the plastic substrate surface by a special
2、processing method, which has the unique properties of the advantages of both plastic and metal . 塑料金属化的方法很多，一般分为干法和湿法两类。 There are many methods to obtain plastic metallization. Generally, it can be divided into two types, dry process and wet process.,2012/11/22,3,,概述（Summary）,塑料电镀流程图 Plastic Plating
3、 Process Flow,化学镀及镀前表面处理Eelectroless Metal plating and Pretreatment Surface Treatment,2012/11/22,5,,Plastic Plating Process FlowPretreatment,作用：防止塑料产生裂痕。 Purpose：To prevent plastic cracking检视方法（Examining Method）：ABS冰醋酸内浸12分钟，如有发白之处（有轻微裂纹），或拉时塑料折断，便是应力存在的地方。ABS: Soaking in glacial acetic acid for 1-2
4、 minutes. The stress exists on the blanch area (slight cracks), and the broken part.PC生产后让产品冷却二小时以上，然后加四氯化碳于怀疑有应力的位置，3分钟内如有裂纹便显示有高内应力。PC: Cool down more than two hours after the plastic injection. Add carbon tetrachloride onto the suspected stress area for 3 minutes. The high internal stress exists
5、on the crack area(s).,2012/11/22,6,,去应力（Stress Relief ）,应力消除方法 (Stress relief method)ABS可于70（65-75）烘24小时，或用1：3丙酮水溶液室温下浸泡2030分钟。ABS: Heat and dry the part in 70 (65-75 ) oven for 2 4 hours. Or put into 1:3 acetone solution at room temperature for 20 to 30 minutes.PC可于85（75-95）烘至少1小时。 PC: Heat and dry
6、 the part in 85 (75-95 ) oven for 1 hour.注意：消除内应力应在抛光后进行，因为抛光会增加应力。Attention：Stress relief treatment should start after polishing, since polishing will increase the stress too.,作用： 清除塑料表面的抛光油污、乳酸，脱膜机中的硅油，增加亲水性，保护粗化液。Purpose:To clean polishing oil & lactic acid of plastic surface, silicone oil of dem
7、olding machine. To increase the hydrophilicity and protect the etching solution.,2012/11/22,8,,除油、除蜡 Cleaning And Degreasing,粗化是塑料电镀最关键的工序之一，它对镀层与塑料之间结合力的影响最为显著。Etching is one of the most important processes of plastic plating. Its influence on the adhesive force between electro-deposition and plast
8、ic substrate is the most significant.目的：一方面使塑料制件表面具有微观粗槽，从而增大了镀层与塑料的接触面，以增加它和金属的粘接力；另一方面使塑料制件表面具有亲水性，以便制件表面进行均匀吸附。 Purpose：Firstly, it creates microscopic coarse grooves on the surface of plastic parts, thus increases the contact surface between coating and plastic base. So that it increases the adh
9、esion between plastic and metal. Secondly, it makes the surface of plastic parts hydrophilic, it can be fairly increase the adsorbability of platic surface.,2012/11/22,9,,粗化 Etching,铬酸是强氧化剂，可将部分塑料的化学键拆散溶解，达到粗化目的。硫酸可将塑料侵蚀甚至发生磺化。Chromic acid is a strong oxidizing agent. It can dissolve some chemical b
10、onds on plastic surface to achieve etching effect. Sulfuric acid can erode the plastic and even sulfurize it. 粗化后的工件应是无光亮，湿润（否则易露塑、结合力不良），并无白色霜状。After etching, the plastic part should be unlustrous and moist without white frosting. Otherwise, it will lead skip plating and lower adhesion.,不同形状及不同材质的工
11、件，其粗化程度要求是不同的。Different shape and material of plastic parts need different etching degrees. 粗化工序可以在塑胶表面蚀刻大约0.5um深的孔。Plastic surface could be coarsed by etching process with about 0.5 um deep pores.,2012/11/22,10,,化学粗化 Chemical Etching,作用: 将残留化学粗化液(六价铬)中和,以减少带入其后处理溶液的机会。Purpose:To neutralizate the re
12、main chemical of etching solution (hexavalent chromium) to reduce the chance to be carried into the solution of the next process.,2012/11/22,11,,中和（六价铬还原） Neutralization (Hexavalent chromium reduction ),Over pickled,Less pickled,Correct pickled,粗化效果图 The Etching Effect,2012/11/22,12,,作用:保护活化剂不被稀释或受污
13、染,使胶体钯活化液趋于稳定。Purpose:To protect activator from being diluted or contaminated, so that the solution of colloid palladium activator tends to be stable.,2012/11/22,13,,预浸 Pre-dip Activation,在塑胶表面产生有催化活性的贵金属薄层（Pd、Ag），作为化学镀时氧化还原反应的催化中心。On the plastic surface, the thin layer of precious metal (Pd, or Ag)
14、 with catalytic activity forms as the catalytic center of RED/OX reaction during the chemical plating .,2012/11/22,14,,钯活化 Activator ADS,2012/11/22,15,,钯胶体示意结构 Palladium colloid schematic diagram,在胶体钯活化后的工件经过水洗，其表面吸附了一层胶体钯微粒为核心的胶团。解胶就是为了除去表面的胶团，使钯暴露出来，起到催化作用。After the cascade rinse followes the coll
15、oid palladium activation, the plastic surface adsorbs a layer of micelles with the core of colloid palladium particles. Acceleration will remove the micelles from the surface ,and to expose palladium acting as catalyst.,2012/11/22,16,,解胶（还原） Accelerating (reduction),以贵金属为催化中心，在塑料表面形成了一层薄金属膜，膜的厚度一般为0
16、.050.8m。With precious metals as catalytic center, a thin metal film forms on the plastic surface. The film thickness is 0.05 0.8 m. 化学铜含有甲醛，环境污染性强，且稳定性差，容易分解，生产不好控制，一般只用于特殊要求的工艺，如无镍工艺，有导电性能要求的工艺。Electroless copper plating fluid contains methyl aldehyde, which is a severe problem of environment pollution. Its not stable and easy to be decomposed. Then, its hard to control the production. Normally, it only be used for special requirements of the process, such as non nickel process, and conductive performance requirements process.,
