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1、降低三星产品N46不良率,蓝微品质部,Blueway(蓝微电子有限公司),降低三星 产品N46 不良率,Competitor (竞争对手),Company (公司水准),Customer Needs （顾客要求),1.产品要求零缺陷目标2.无重大品质隐患3.提高产品质量,推动品质竞争力.,1.来料不良较多2.顽固性不良改善度不够. 3.剧烈的竞争环境要求我们必须降低生产成本.,1.同行业竞争激烈2.建立具备强有力的品质水准3.占有较大产品市场份额,随着三星客户为公司重点战略客户，其产品要求甚高，对制程进行改善迫在眉睫，通过本次活 动,旨在降低不良率，赢得高端客户对我司的信心，从而打出知名度，占
2、有更多市场.,项目背景,D,M,A,I,C,改善方案评估改善方案制定,改善因子分析数据统计,改善方案实施,文件标准化改善效果跟进,组织构成,D,M,A,I,C,目标设定,38700PPM,品质现况 改善目标,下降,7500PPM,80%,总不良率:38700PPM,客户要求年终目标:7500PPM,D,M,A,I,C,客户要求,改善KPI,品质现况,品质现况分析,D,M,A,I,C,来料不良,制程不良,来料占主要不良为露铜不良及过孔不通,制程占主要不良为导线长短不一及导线焊接不良,主要不良,主要不良,Y定义,D,M,A,I,C,镍片,MOS,IC,PTC,电容,电阻,导线,N46产品介绍,Y定
3、义,D,M,A,I,C,B+铜箔边缘露铜。,Y定义,D,M,A,I,C,标准为6.50-7.10mm,改善方案导出,D,M,A,I,C,时间,Define,Measure,Analyze,Improve,Control,8月,已完成,进行中,12月,9月,10-11月,Process Mapping,D,M,A,I,C,PCB打码,过程,输入,输出CTQ,印锡膏,贴片,炉前检查,回流焊,AOI,PTC测试,自动分板,过程,输入,输出CTQ,焊导线,焊接检查,点UV胶,UV胶固化,ATE测试,终检,PCB来料,锡膏,电阻/电容/镍片,导线,UV胶,导通孔开路,QC抽检,铜箔到边不良,导线长短不一
4、 导线焊接不良,焊导线、ATE测试、终检定为CTQ工程,点胶不良,元件焊接不良,元件贴装不良,印刷不良,打码不良,PTC内阻不良,分板不良,制程能力分析,M,A,I,C,D, DPMO=38700 ppm Z-level=1.76 (查MINITAB表),Gage R&R,M,A,I,C,D,Study Var %Study Var Source StdDev (SD) (6 * SD) (%SV) Total Gage R&R 0.00100 0.0060 0.02Repeatability 0.00087 0.0052 0.02Reproducibility 0.00049 0.0029
5、0.01Operator 0.00036 0.0021 0.01Operator*Sample 0.00033 0.0020 0.01 Part-To-Part 4.27392 25.6435 100.00 Total Variation 4.27392 25.6435 100.00 Number of Distinct Categories = 6038,Gage R&R,M,A,I,C,D,二次元测试系统分析,5,5,5, 0) 1 0 1 0.316228 3.16228 0.00081 1 0.316228 3.16228 0.0008 2 0 1 0.316228 3.16228 0
6、.00081 1 0.316228 3.16228 0.0008 3 0 1 0.316228 3.16228 0.00081 1 0.316228 3.16228 0.0008 Between Appraisers Assessment Agreement # Inspected # Matched Percent 95 % CI10 10 100.00 (74.11, 100.00) # Matched: All appraisers assessments agree with each other. Fleiss Kappa Statistics Response Kappa SE K
7、appa Z P(vs 0) 0 1 0.0816497 12.2474 0.0000 1 1 0.0816497 12.2474 0.0000,Within Appraisers各个检验员的重复性百分比超过90%为合格 Between Appraisers各个检验员之间的比较再现性超过90%为合格,Gage R&R判定标准,Gage R&R,M,A,I,C,D,外观检验系统分析,3名作业员：1）陈杰 2）李苗 3）崔凤 导线少锡不良、导线烫伤、导线虚焊接良品不良品各5个进行测试,Gage R&R ACCEPT,改善因子分析,A,M,I,C,D,来料不良分析,供应商来料改善,露铜不良,内部改善
8、,铣边机定位偏移,定位PIN生锈,1 LEVEL,2 LEVEL,3 LEVEL,设计不合理,铜皮设计太靠边,检查方法不合理,无检验样板,重要度,重要,中,一般,检验标准不明确,无检验标准,供应商来料改善,过孔不通,干膜贴膜工序故障,贴膜脱落,沉铜工序故障,液面高度偏低,设计不合理,单导通孔,材料,沉铜材质变质,改善点,改善因子分析,A,M,I,C,D,制程不良分析,供应商来料改善,导线长短不一,内部改善,导线长度,导线长度不标准,1 LEVEL,2 LEVEL,3 LEVEL,设备/夹具,装板家具磨损,装板夹具精度不够,重要度,重要,一般,内部改善,导线焊接不良,焊接方法,焊接温度,焊接时间
9、,材料,锡线氧化,改善点,作业方法,装导线不到位,设备,烙铁故障,目视检查,焊接角度,Test and CI for Two Proportions Sample X N Sample p 1 2 25000 0.000080 2 35 30000 0.001167 Difference = p (1) - p (2) Estimate for difference: -0.00108667 95% CI for difference: (-0.00148855, -0.000684787) Test for difference = 0 (vs not = 0): Z = -5.30 P-V
10、alue = 0.000,Test and CI for Two Proportions Sample X N Sample p 1 0 2000 0.000000 2 13 2000 0.006500 Difference = p (1) - p (2) Estimate for difference: -0.0065 95% CI for difference: (-0.0100219, -0.00297813) Test for difference = 0 (vs not = 0): Z = -3.62 P-Value = 0.000,Test and CI for Two Propo
11、rtions Sample X N Sample p 1 15 25000 0.000600 2 4 20000 0.000200 Difference = p (1) - p (2) Estimate for difference: 0.0004 95% CI for difference: (0.0000386877, 0.000761312) Test for difference = 0 (vs not = 0): Z = 2.17 P-Value = 0.030,改善因子分析,A,M,I,C,D,P0.05,P0.05,P0.05,改善因子分析,A,M,I,C,D,Test and CI for Two Proportions Sample X N Sample p 1 1 1000 0.001000 2 14 2000 0.007000 Difference = p (1) - p (2) Estimate for difference: -0.006 95% CI for difference: (-0.0101459, -0.00185409) Test for difference = 0 (vs not = 0): Z = -2.84 P-Value = 0.005,
