《韩国科技公司英文简介模板CompanyProfile》由会员分享，可在线阅读，更多相关《韩国科技公司英文简介模板CompanyProfile（16页珍藏版）》请在金锄头文库上搜索。
1、“ High Technology for Display Devices ”“ High Technology for Display Devices ”2006. 07COMPANY PROFILEI N D E X SEKWANG TECHNOLOGIES CO., LTD 2p6. DEALING ITEM6-1. MODULE ASSY6-2. LCD ASSY MACHINE1. OFFICE AND ADDRESS2. COMPANY PROFILE3. COMPANY HISTORY4. ORGANIZATION7. FACTORY APPEARANCE8. LOCATION5
2、. CERTIFICATION1. OFFICE AND ADDRESS SEKWANG TECHNOLOGIES CO., LTD 3pOFFICEADDRESSTELFAXMOBILE PHONEE-MAILHEAD OFFICE & FACTORY351, BUKJUNG DONG, YANGSAN,KYUNGNAM KOREA82-55-372-3151382-55-372-315482-11-9544-3151 82-11-877-5710sktechsklcd.co.krBUNDANG OFFICE (SEOUL)8F MIDO PLAZA BLDG, #158 GEUMGOK-D
3、ONG, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO KOREA.82-31-713-571082-31-716-641682-11-323-4611blrndsklcd.co.krHONG KONG BRANCHROOM10, 6F., WAH SHING IND.CENTRE, 11-13 SHING YIP STREET,KWUN TONG, KOWLOON,HONG KONG.852-2997-71768852-2997-7588852-9364-SHENZHEN BRANCH (CHINA)86-755-2609-7641SUZHOU BRANCH (C
4、HINA)YING XIANG HUA YUAN 3 1401ROOM XINGHAI STREET SUZHOU CHINA 86-512-6763-42112. COMPANY PROFILE SEKWANG TECHNOLOGIES CO., LTD 4p COMPANY NAME : Sekwang Technologies Co.,Ltd. PRESIDENT : D. W. Kim (金東佑) ESTABLISHMENT : 20.JAN.1995 CORPORATION REGISTERED No. : 184511-0026557 EMPLOYEES : 130 CAPITAL
5、 : USD 800,000 ADDRESS : 351, Bukjung Dong, Yangsan, Kyungnam,Korea TEL) 055-372-31513. FAX) 055-372-3154 E-MAIL) sktechsklcd.co.kr PLANT SIZE : 1,691 MM/SITE AREA : 3,089 MM(4 FL) / FLOOR AREA MAIN PRODUCT- LCD MODULE ASSY EQUIPMENTS / / PANEL EQUIPMENTS : Design, Manufacturing & Sales For ACF, FOG
6、, COG, COF, TAB BONDER, AUTO TAB BONDER, AUTO POL ATTACH M/C, END SEAL, COG INSPECTION M/C, FPC CUTTING M/C, INLINE AUTO COG/FOG BONDING M/C- LCD MODULE ASSEMBLY PRODUCTS : Design, Assembling & Sales For BACK LIGHT MODULE3. COMPANY HISTORY SEKWANG TECHNOLOGIES CO., LTD 5p1.2006. OCT. Developed FPC C
7、utting M/C 2. OCT. Developed Auto Pol Attach M/CJUL. Developed Auto Trace Tester ( 3.5 SEC) MAY. Start to Develop Middle size(3”7”) COG+FOG bonding M/C (Tact time 3.9sec) ( Planed to finish within Oct.) Start to Develop auto Pol attach M/C. (3.5sec) ( Planed to finish within Sep.)APR. Start to Devel
8、op small size(1”4”) COG+FOG bonding M/C (Tact time 3.5sec) ( Planed to finish within Sep.)MAR. Acquired ISO14001:2004 Certificate for LCD Equipment & LCD BLU assembly.2005. AUG. Developed Semi Auto COF Bonding M/C. (Tact time 6.5sec) JUL. Developed Loading & Cleaning M/C. JUN. Developed Auto Trace T
9、ester. MAR. Patent Application about In Line type COG+FOG Bonding M/C. Delivered In Line type COG+FOG Bonding M/C. (Tact time 4.5sec) 2004. JUN. Developed IN LINE FOG Bonding M/C.MAY. Acquired ISO-9001 Certificate for LCD Equipment & LCD BLU Assembly.FEB. Developed IN LINE COG Bonding M/C.2003. JUN.
10、 Developed Camera Module Bonding M/C For SAMSUNG TECHWIN. FEB. Establish R & D Center at YANGSAN Factory2002. JAN. Move to YANGSAN New Factory 1999. JAN. Established Panel Line Equipment manufacturing factory for STN LCD line.(Pol Attach M/C, Scribe M/c. Break M/C, End Seal M/C, LC Cleaning M/C, LC
11、Filling M/C)1998. AUG. Establish Module Line Equipment manufacturing factory for STN LCD line.(TCP Bonder. ACF M/C, COG M/C, COF M/C, TAB cutting M/C, Hot Bar M/C, Clean booth)3. COMPANY HISTORY SEKWANG TECHNOLOGIES CO., LTD 5p1996. MAR. Make a Representative Agreement with PUCKA for FPCB.Start to A
12、ssembly Back Light(640*480) for Large size of Colour STN Module.1995. JUN. Opened the business for Back Line Process Equipments of LCDMAR. Start to make LCD Module OEM for Samsung SDI.MAR. Make a Representative Agreement with ONPRESS PRINTED CIRCUIT LTD(H.K) & MICRO CIRCUIT LTD(H.K) for PCB sales in Korea JAN. Founded to supply the best material for LCD, LCD Module and Equipments in Korea4. ORGANIZATION SEKWANG TECHNOLOGIES CO., LTD 6p5. CERTIFICATION SEKWANG TECHNOLOGIES CO., LTD
