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1、qja 结-空气热阻 qja 最早也是最常用的标准之一 定义标准由文件 JESD51-2给出 Ta = 环境空气温度, 取点为 JEDEC组织定义的特定空箱中特 定点 (Still-Air Test) 芯片下印制板可为高传导能力的四层板(2S2P)或低传导能力 的一层板之任一种 (1S0P)Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2
2、.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pt
3、y Ltd.qjma 结-移动空气热阻 qjma 空气流速范围为 0-1000 LFM 定义标准由文件 JESD51-6给出 Ta = 空气温度，取点为风洞上流温度 印制板朝向为重大影响因素NEvaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright
4、 2004-2011 Aspose Pty Ltd.Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd. qjc 从结点到封装外表面(壳)的热阻，外表面壳取点尽量 靠近Die安装区域qjc 结
5、壳热阻Die SubstratePCBJunctionCaseEvaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.Evaluation only.Evaluation only. Create
6、d with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd. qjb 从结点至印制板的热阻 定义标准由文件 JESD51-8给出qjb 结板热阻严格地讲，Theta-JB不仅仅反映了芯片的内 热阻，同时也反映了部份环境热阻，如印制板。 正因如些， Theta-JB相对于其它热阻
7、而言，虽然 JEDEC组织在99年就发布了它的热阻定义方式， 但是芯片供应商采用较慢。部份传热路径严重不对称芯片，如TO-263目 前尚无该热阻的定义标准Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose P
8、ty Ltd.Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd. qjx 试图采用简单的热阻表示复杂的芯片传热现象 芯片内部的热传现象非常复杂，无法使用热阻来完美表示； 热阻qjx 无法用于
9、准确预测芯片的温度，只能提供定性的热性能 对比； 如需准确预测特定工况下芯片的温度，我们需要其它的方法qjx 使用的局限性Convection/RadiationConvection/RadiationConductionConvection Conduction RadiationConductionJunctionXjxEvaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 C
10、lient Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 20
11、04-2011 Aspose Pty Ltd.芯片的详细模型建立所有芯片内部所有影响传热的结构Die硅或砷化镓材料，表面 有发热集成电路通常为环氧树脂，厚为1-2milDie Attach铜制，用于加强传热或其它目地Die Flag/Die PadEncapsulant通常为环氧树脂材料金或铝制，数目等同于外面管脚数Bond WiresSolder Balls 通常材料为锡 铅合金95Pb/5Sn或37Pb/63Sn. 铜或铝42合金制Leadframes Substrate 通常由BTFR4制 成(塑料芯片)； 或氧化铝制成(陶 瓷芯片)Evaluation only.Evaluation
12、only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.C
13、reated with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.热阻网络模型-DELPHI模型DEvelopment of Libraries of PHysical models for an Integrated design environment DELPHI 项目：从1993年到1996年，由欧盟资助，Flomerics公司负责协调 ，Alcatel Bell 、Alcatel Esp
14、ace 、Philips CFT 、Thomson CSF 、Flomerics 、 NMRC 等公司合作，旨在开发芯片的简化热模型的精确表示方法。PROFIT项目：同样由欧盟资助，由Philips公司负责协调，Flomerics、Nokia 、Infineon、Philips、ST、Micred、TIMA、等公司合作，旨在开发芯片热模型 的快速建立方法。项目产生了一系列成果，如芯片的热阻网络模型DELPHI标准、JEDEC组 织认证的唯一热模型库FLOPACK、芯片热应力分析工具Flo/stress等。 PRediction OF temperature gradients Influenc
15、ing The quality of electronic productsPROFIT 项目DELPHI项目Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.Evaluation only
16、.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.DELPHI模型生成原理建立详细模型标准实验验证误差估计在规定的种边界条件下 批处理进行详细模型计算封装参数 (结构、材料参数)根据各种封装特点离散出 各种热阻网络拓朴结构详细 模型发布简化 模型多种边界条件可以表 示自然对流、强迫对流、 散热器等多种环境根据各热阻节点的温度值优 化得出具有最小误差的热阻值DELPHI项目组定义了99种 边界条件；Flopack应用了44种或88种Evaluation only.Evaluation only. Created
